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Thursday, October 1, 2015

• INSIDE Secure appoints Amedeo D'Angelo as President and Chief Executive Officer

Thursday, October 1, 2015

• Intellitech iJTAGServer leverages Cadence Incisive Enterprise Simulator for IEEE 1149.1-2013 Silicon Instrument Verification

Thursday, October 1, 2015

• iPhone 6S: A9 May Be Dual Sourced

Thursday, October 1, 2015

• Upgraded Components in iPhone 6S Plus Costs Apple an Extra $16 Per Device

Wednesday, September 30, 2015

• Testing PSRR with High-Frequency Ripple
• How to power FPGAs with Digital Power Modules
• Xilinx Beats Altera to the First FinFET FPGA!
• Xylon Multimedia Demo for the ZedBoard

Wednesday, September 30, 2015

• Fuji Xerox Reduces Silicon Area by More than 50 Percent Using Synopsys ASIP Designer

Tuesday, September 29, 2015

• Choosing the Right interface for your SoC
• Mellanox Technologies, Ltd. Announces Definitive Agreement to Acquire EZchip
• TSMC at the 2015 Imagination Summit: optimized silicon IP for the IoT market
• Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
• Arm Aligns With Microsoft Azure

Tuesday, September 29, 2015

• SMIC Best IP Partner Award of 2015

Monday, September 28, 2015

• Shifting the Mobile & Wearable Market -- SoC vs. SiP
• GE Connects Industrial IoT
• Imagination's Ensigma communications IP receives Wi-Fi CERTIFIED ac certification and Bluetooth Smart qualification
• Open-Silicon Announces Comprehensive High Bandwidth Memory (HBM) Gen2 IP Subsystem Solution
• Synopsys Announces Industry's First Security IP Solutions for New SHA-3 Cryptographic Hash Standard
• STMicroelectronics Adopts Arm's Latest Processor Technology for Automotive Applications
• Truechip announces first customer shipment of HBM Comprehensive Verification IP (CVIP)

Monday, September 28, 2015

• Cadence Receives Two TSMC Partner of the Year Awards for 10nm FinFET Solutions and Analog/Mixed-Signal IP

Monday, September 28, 2015

• EDA Consortium Reports EDA Industry Revenue Increase for Q2 2015

Monday, September 28, 2015

• Startup Goes Multi-Die to Customize MCUs

Monday, September 28, 2015

• M&A Activity Continues Through Uncertain Business Climate

Monday, September 28, 2015

• TSMC Recognizes Synopsys with Partner Awards for Interface IP and Joint Development of 10-nm FinFET Design Infrastructure

Monday, September 28, 2015

• Marvell Technology Group Ltd. Announces Significant Restructuring of Mobile Platform Business

Monday, September 28, 2015

• S2C Quad Kintex UltraScale Prodigy FPGA Prototyping Logic Module Addresses Designs with Massive Parallel DSP Algorithms

Monday, September 28, 2015

• Benefit from Dolphin Integration's state-of-the-art compiler for 80251 CISC microcontrollers

Monday, September 28, 2015

• Shikino Launches Still Image Codec IP Obtaining 16X Faster Image Processing

Sunday, September 27, 2015

• Creating new opportunities for Imagination in Taiwan
• Qualcomm Commits Up To $150 Million to Strategic Venture Fund in India

Friday, September 25, 2015

• MCU Vendors Add DSP for Consumer Wireless Apps

Thursday, September 24, 2015

• Imagination Receives TSMC 2015 Graphics Partner of the Year Award

Thursday, September 24, 2015

• TSMC's 2015 Forecast May Be Warning for Supply Chain

Thursday, September 24, 2015

• Legend releases Memory QA Solutions for on-chip memory IP instances

Wednesday, September 23, 2015

• Intel Outlines Plans for New Category of Smarter, Purpose-Built 'System on Chip' Designs, Products
• Moortec Semiconductor Limited Joins TSMC IP Alliance Program
• SMIC Receives 'Hi-Tech Enterprise Achievement Award' for the Second Time
• Speed up your analog simulations thanks to Dolphin Integration's solution

Wednesday, September 23, 2015

• TSMC Fourth Quarter and Full Year 2015 Revenue Outlook

Wednesday, September 23, 2015

• Kilopass to Exhibit at Leading-Edge Embedded NVM Workshop 2015, Demonstrating its Antifuse E-NVM Memory IP

Tuesday, September 22, 2015

• Developing high-reliability FPGAs for DO-254
• FPGAs in embedded systems: It just keeps getting easier
• Wearable sensors challenge low voltage design
• INSIDE Secure Increases Momentum in Financial Services with Three New Major Mobile Application Security Wins

Tuesday, September 22, 2015

• UMC Enters High Volume Touch IC Production using Foundry Industry's First 0.11um eFlash Process

Monday, September 21, 2015

• System-on-Chip (SoC) Market is Expected to Reach USD 71.98 Billion in 2021: Transparency Market Research
• IP Hot Spot Forms in Egypt
• Helping FPGA Designers get started with UVM
• Emulation: Thinking outside of the Big Box
• Conference & exhibition: Technology for building the IoT
• 16 Insights on ICs
• TSMC Honors Arm with Partner Award for Sixth Consecutive Year
• Synopsys Accelerates Development of IoT Designs with Industry's Most Comprehensive IP Portfolio
• TSMC Discusses Next MEMS, Monolithic Mics

Monday, September 21, 2015

• Design Options for Next Billion IoT Devices

Monday, September 21, 2015

• Microcontroller Market Growth Tied to Rise in Internet of Things Applications, IHS Says

Monday, September 21, 2015

• General Processor Technologies Joins HSA Board of Directors and Expands Licensing Geography

Monday, September 21, 2015

• RFEL announces new version of award-winning ChannelCore Flex advanced Channeliser IP core

Monday, September 21, 2015

• eMemory Announces the First Verified NeoFuse OTP IP in 16nm FinFET Plus Process

Monday, September 21, 2015

• SilabTech announces the release of its USB 3.1 Gen 2 Compliant 10 Gbps SERDES IP Core

Monday, September 21, 2015

• Cadence Announces Broad IP Portfolio for TSMC 10nm FinFET Process

Monday, September 21, 2015

• ReFLEX CES Introduces Alaric Instant-DevKit Based on Altera’s Arria 10 SoC

Monday, September 21, 2015

• New performances specified by Dolphin Integration for minimizing Power Regulator Capacitances

Monday, September 21, 2015

• Dialog Semiconductor to acquire Atmel for $4.6 Billion

Monday, September 21, 2015

• AMD Loses Processor Veteran

Monday, September 21, 2015

• Arasan Announces Automotive Grade MIPI DPHY IP For 40nm

Sunday, September 20, 2015

• Winbond to License DPA Countermeasures from Rambus Cryptography Research