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Thursday, April 25, 2024

• Thalia's AMALIA 24.2 introduces pioneering estimated parasitics feature to reduce PEX iterations by at least 30%
• Qualitas Semiconductor Partners with TUV Rheinland Korea to Enhance ISO 26262 Functional Safety Management System
• TSMC plans 1.6nm process for 2026
• Automotive Cybersecurity: A Review of 2023

Wednesday, April 24, 2024

• Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
• Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
• TSMC Celebrates 30th North America Technology Symposium with Innovations Powering AI with Silicon Leadership
• Numem at the Design & Reuse IP SoC Silicon Valley 2024
• Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
• M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process
• TSMC unveils 1.6nm process technology with backside power delivery, rivals Intel's competing design
• TSMC unveils 1.6nm process technology with backside power delivery, rivals Intel's competing design

Tuesday, April 23, 2024

• Rambus Advances AI 2.0 with GDDR7 Memory Controller IP
• Credo at TSMC 2024 North America Technology Symposium
• Leveraging Cryogenics and Photonics for Quantum Computing
• Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
• Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
• Keysight, Synopsys, and Ansys Deliver Radio Frequency Design Migration Flow to TSMC's N6RF+ Process Node
• Industry's First General-Purpose 32-bit RISC-V MCU Core Expands Design Freedom

Monday, April 22, 2024

• Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium
• Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
• Qualitas Semiconductor Appoints HSRP as its Distributor for the China Markets
• Alphawave Semi Audited Results for the Year Ended 31 December 2023
• Faraday Reports First Quarter 2024 Results
• RAAAM Memory Technologies Closes $4M Seed Round to Commercialize Super Cost Effective On-Chip Memory Solutions
• Cadence Reports First Quarter 2024 Financial Results
• Fundamental inventions enable the best ppa and most portable eFPGA/DSP/SDR/AI IP for adaptable SOCs
• Siemens and Mercedes-Benz Transform Future of Sustainable Factory Planning with Digital Energy Twin
• Efabless Announces the Launch of the Tiny ML on Tiny Tapeout Contest

Sunday, April 21, 2024

• Silicon Creations Reaches Milestone of 10 Million Wafers in Production with TSMC
• T2M-IP Unveils Revolutionary MIPI D-PHY & DSI Controller IP Cores with speed 2.5Gbps/lane, Redefining High-Speed Data Transfer and Display Interfaces
• How Close Are We to Commercial Quantum Computers?
• Palladium emulation: Nvidia's Jensen Huang is a fan
• Controversial former Arm China CEO founds RISC-V chip startup
• Siemens Xcelerator: Scaling roll-out of generative AI with Siemens Industrial Copilot
• Infineon's Global Forum: Driving Change With WBG Technologies for a Sustainable Future

Thursday, April 18, 2024

• GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
• DVB-S2X Wideband LDPC/ BCH Decoder IP Core Available For Integration From Global IP Core
• Efabless Announces the Release of the OpenLane 2 Development Platform, Transforming Custom Silicon Design Flows
• Omni Design Technologies Joins Intel Foundry Accelerator IP Alliance
• TSMC Reports First Quarter EPS of NT$8.70
• Brisbane Silicon publishes DPTx 1.4 IP Core
• Fraunhofer IIS Opens Laboratory in Space

Wednesday, April 17, 2024

• Faraday Partners with Arm to Innovate AI-driven Vehicle ASICs
• Demonstration of Weebit ReRAM on GF 22FDX® Wafers at EW24
• Cadence Announces Most Comprehensive True Hybrid Cloud Solution to Provide Seamless Data Access and Management
• Cadence Unveils Palladium Z3 and Protium X3 Systems to Usher in a New Era of Accelerated Verification, Software Development and Digital Twins
• Dolphin Design expands GoAsic partnership to enhance the semiconductor Industry's Supply Chain
• M31 Successfully Validates 5nm IP Solution to Empower Global AI Applications
• Cadence Collaborates with MemVerge to Increase Resiliency and Cost-Optimization of Long-Running High-Memory EDA Jobs on AWS Spot Instances

Tuesday, April 16, 2024

• Rivos Raises More Than $250M Targeting Data Analytics and Generative AI Markets
• U.S. Subsidy for TSMC Has AI Chips, Tech Leadership in Sight
• Silvaco Announces Expanded Partnership with Micron Technology
• Zhuhai Chuangfeixin: OTP IP Based on 90nm CMOS Image Sensor Process Technology Successfully Mass-Produced
• Alphawave Semi: FY 2023 and 2024 YTD Trading Update and Notice of Results
• JEDEC Updates JESD79-5C DDR5 SDRAM Standard: Elevating Performance and Security for Next-Gen Technologies
• Cadence Unveils Palladium Z3 and Protium X3 Systems to Usher in a New Era of Accelerated Verification, Software Development and Digital Twins
• Samsung Develops Industry's Fastest 10.7Gbps LPDDR5X DRAM, Optimized for AI Applications
• STMicroelectronics opens up the FD-SOI era for MCU
• Infineon provides FOXESS with power semiconductors to improve efficiency and power density of energy storage applications

Monday, April 15, 2024

• OPENEDGES Unveils ENLIGHT Pro: A High-Performance NPU IP Quadrupling its Previous Generation's Performance
• Fraunhofer IIS offers JPEG XS plugin for NVIDIAs Holoscan for Media Architecture
• Movellus Extends Droop Management Leadership with Aeonic Generate™ AWM3
• CMC Microsystems and AIoT Canada Sign Memorandum of Understanding to support IoT and semiconductor ecosystem growth in Canada
• Fraunhofer IIS offers JPEG XS plugin for NVIDIA´s Holoscan for Media Architecture
• Movellus Extends Droop Management Leadership with Aeonic Generateâ„¢ AWM3
• IP block covers Wi-Fi 6, Bluetooth 5.4 dual mode and IEEE 802.15.4 for IoT chips
• ITRI launches AIoT certification center with Arm
• Arm accelerates Edge AI with Ethos-U NPU and IoT reference design platform
• Challenges in designing automotive radar systems
• STMicroelectronics Publishes 2024 Sustainability Report
• TSMC Reports Solid Earnings Boost Amid Surging AI Demand
• Emotors adopts Siemens' Simcenter solutions for NVH testing of next-generation automotive e-drives