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Monday, June 22, 2015

• Synopsys and UMC Expand 14-nm FinFET Collaboration to Include DesignWare Embedded Memory and Test Solutions

Sunday, June 21, 2015

• Building a secure foundation for wearables

Friday, June 19, 2015

• EnSilica Announce WeGoes as New Sales Partner in Korea

Friday, June 19, 2015

• IBM Demos III-V FinFETs on Silicon

Friday, June 19, 2015

• North American Semiconductor Equipment Industry Posts May 2015 Book-to-Bill Ratio of 0.99

Friday, June 19, 2015

• Rambus and SK Hynix Extend License Agreement

Thursday, June 18, 2015

• Silicon Nanowire Remains Favorite to Replace FinFET

Wednesday, June 17, 2015

• Microsemi's SmartFusion2 Secure Boot Solution Addresses Side Channel Analysis Vulnerabilities in Competitors' FPGAs Requiring External Configuration

Wednesday, June 17, 2015

• IC Manufacturers Close or Repurpose 83 Wafer Fabs from 2009-2014

Tuesday, June 16, 2015

• IHS Says Ramifications of Moore’s Law Lead to Trillions of Dollars Added to the Global Economy
• Rise of the machines: The industrial Internet of Things is taking shape
• Algo-Logic Systems Launches 40Gbps TCP Endpoint on BittWare S5-PCIe-HQ FPGA Board
• mCube Unveils Its First Ultra-Low Power Accelerometer Family Optimized for Wearables and the "Internet of Moving Things"
• Chips&Media releases CFrame30, its groundbreaking hardware design for Lossy Frame Buffer Compression

Tuesday, June 16, 2015

• JEDEC to update Solid State Drive Standard

Tuesday, June 16, 2015

• Crocus Technology attracts $21M (19M Euros) in financing

Tuesday, June 16, 2015

• Software Development: Not Written Here Is New Norm

Tuesday, June 16, 2015

• Does Hardware Even Matter Anymore?

Tuesday, June 16, 2015

• 10nm Chips Promise Lower Costs

Tuesday, June 16, 2015

• INSIDE Secure Appoints Executive Vice President of Marketing to Accelerate Growth

Monday, June 15, 2015

• Lattice Semiconductor Updates Key Design Tool Suites
• Europe Has The Potential To Dominate Industrial IoT, But Can It Deliver?
• eASIC and Comcores Deliver CPRI v6.1 Switch Reference Design for Next-Generation LTE Advanced and 5G Networking Equipment
• Omnitek shows high speed Xilinx technology with 12G-SDI Development Kit and RTVE 3.1 at InfoComm15
• Lufthansa Technik and Panasonic Avionics Joint Venture, IDAIR GmbH, Selects INSIDE Secure's DRM Fusion Solution for Its In-Flight Movie Service

Monday, June 15, 2015

• Leti launches new Silicon Impulse FD-SOI Development Program, to Help Designers Broaden the Use of FD-SOI for Low-power Applications

Monday, June 15, 2015

• 8051 MCUs get In-System Programming Benefits Through CAST and SMH Technologies Partnership

Monday, June 15, 2015

• SILICONGATE Presents the 3rd Gen Flagship DC/DC at the 52nd DAC

Monday, June 15, 2015

• Chip, PC Demand Continues Decline

Monday, June 15, 2015

• Altera Arria 10 FPGAs Chosen to Support Real-Time High-Speed Airborne Ethernet Interconnection Technology in Demanding Environments

Monday, June 15, 2015

• IBM, Microsoft, ARM, BAE Systems, Shazam, Patent Properties, Conversant, and Finjan Back ORoPO - the Open Register of Patent Ownership Launched Today

Monday, June 15, 2015

• MegaChips is First to Bridge DisplayPort with HDMI2.0a in a Single Chip

Monday, June 15, 2015

• Dolphin Integration celebrates its 30th anniversary... A new wind is blowing on the enterprise ushering it to success over the next 30 years!

Sunday, June 14, 2015

• Renesas dives into the Internet of Things fray with its Synergy platform
• Synopsys' IC Compiler II Accelerates Silicon Validation of Imagination's Ground-breaking PowerVR® Ray Tracing IP

Friday, June 12, 2015

• Has FD-SOI Hit Its Tipping Point?

Friday, June 12, 2015

• Using Wi-Fi to Power IoT

Friday, June 12, 2015

• Engineering Shortage Persists

Friday, June 12, 2015

• Patent Office Grants Mentor Graphics Petition to Rule Synopsys Emulation Patent Claims Unpatentable

Friday, June 12, 2015

• Hua Hong Semiconductor Launches 0.11um Ultra-Low-Leakage Embedded Flash Process Platform That Delivers Powerful MCU Solutions for IoT

Thursday, June 11, 2015

• Xilinx Demonstrates 'Any Media over Any Network' Solutions for the Pro A/V Industry at InfoComm 2015

Thursday, June 11, 2015

• Catena Partners with CEVA for Complete Wi-Fi and Bluetooth Solutions for Mobile, Wearable and IoT Devices

Thursday, June 11, 2015

• Beken Adopts CEVA DSP and Connectivity IPs for its Wireless Audio SoC Roadmap

Thursday, June 11, 2015

• INSIDE Secure and Synopsys to Present Secure Solutions for the Internet of Things (IoT) at Linley IoT Conference 2015

Thursday, June 11, 2015

• Intel Memo on Layoffs Reported

Thursday, June 11, 2015

• Algo-Logic Systems Launches Industry-First 40Gbps TCP Endpoint on Altera Stratix V for Datacenter Acceleration

Wednesday, June 10, 2015

• CEVA Unveils Wi-Fi IP Platforms to Enable a Broad Range of Connected Devices
• The Evolution of Biometric Security: Part Two
• Ensuring security in the connected home

Wednesday, June 10, 2015

• Cypress Fails to Finalize Merger Agreement with ISSI

Wednesday, June 10, 2015

• TSMC May 2015 Revenue Report

Tuesday, June 9, 2015

• CAPI Acceleration Development Kit brings coherent FPGA acceleration to IBM POWER8 servers
• Apple Inc. Co-Founder Steve Wozniak Believes The Internet of Things Bubble Could Burst
• ISSI Agrees to Merger Terms with Cypress Semiconductor
• 64-bit MIPS architecture provides low-power, high-throughput processing for Cavium's new OCTEON III processors
• Microsemi Introduces Automotive-grade SoC FPGAs and FPGAs

Tuesday, June 9, 2015

• Open-Silicon Expands Management Team

Tuesday, June 9, 2015

• GUC Monthly Sales Report - May 2015