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Sunday, October 25, 2015

• IDT to Acquire ZMDI for $310 Million
• Cadence Reports Third Quarter 2015 Financial Results
• Rambus Initiates Accelerated Share Repurchase Program

Friday, October 23, 2015

• Altera Announces Third Quarter Results

Friday, October 23, 2015

• Altera Demonstrates Security and System Acceleration Solutions at MILCOM 2015

Friday, October 23, 2015

• Foundry Sales Defy IC Decline

Friday, October 23, 2015

• North American Semiconductor Equipment Industry Posts September 2015 Book-to-Bill Ratio of 1.07

Thursday, October 22, 2015

• Socionext Licenses and Deploys CEVA Imaging and Vision DSP for Milbeaut Image Processors

Thursday, October 22, 2015

• Trillium Certainly Can Encrypt CAN Bus

Wednesday, October 21, 2015

• Arm tide surges on
• Arteris tackles tyranny of wires
• IC Insights Lowers its Worldwide 2015 IC Market Forecast from +1% to -1%
• The IP companies creep toward an SoC

Wednesday, October 21, 2015

• Anapass Achieves First-Time Success with Mixel's Complete MIPI Solution

Wednesday, October 21, 2015

• Sequans Selects VeriSilicon ZSP Digital Signal Processor for LTE Cat0/Cat1 IoT and M2M Chipsets

Wednesday, October 21, 2015

• Synopsys Demonstrates Industry's First MIPI D-PHY IP Operating at 2.5 Gbps per Lane on TSMC 16-nm FinFET Plus Process

Wednesday, October 21, 2015

• ARM Launches IoT Education Kit in China at Opening of Peking University’s New Smart Device Lab

Wednesday, October 21, 2015

• ARM Holdings PLC Reports Results For The Third Quarter And Nine Months Ended 30 September 2015

Tuesday, October 20, 2015

• CEVA Announces Silicon-based Platform to Streamline Development of Low-Power 'Smart and Connected' Devices
• Andes Technology and INVECAS Enter Into a High Value Collaboration to Win Designs for GLOBALFOUNDRIES 22FDSOI and 14LPP Processes
• Arm Launches IoT Education Kit in China at Opening of Peking University's New Smart Device Lab

Tuesday, October 20, 2015

• Rambus Reports Third Quarter Financial Results

Monday, October 19, 2015

• Imagination announces single board MIPS computer for IoT
• Understanding the IoT cloud and how it will change things
• Eyeing the IoT with the Arm-powered Raspberry Pi
• SEMI Announces Continued Annual Growth for Silicon Shipment Volumes
• Server Benchmark Debuts at Arm Event
• Arm Mali-470 GPU Offers Improved Efficiency and Experiences on Wearable and IoT Devices
• Cadence Announces the First IP Subsystem with Integrated USB Type-C, USB Power Delivery and DisplayPort Alternate Mode Support
• Arm to Offer Cycle-Accurate Virtual Prototyping for Complex SoCs Through an Asset Acquisition from Carbon Design Systems
• Innovasic and OmniPhy Announce Collaboration on Automotive Ethernet Solutions
• Moortec Semiconductor Announces New UMC 28nm HPC High Accuracy Embedded Temperature Sensor
• AXSEM AG is now a part of ON Semiconductor
• New Release of Synopsys Synplify Software Delivers Up to 3X Faster Runtime with Higher FPGA Performance

Monday, October 19, 2015

• Microsemi Corporation Announces Superior Proposal to Acquire PMC-Sierra, Inc. for $11.50 Per Share With Intent to Close in December 2015

Monday, October 19, 2015

• Mentor Graphics Veloce VirtuaLAB Adds Next-Generation Protocols for Leading-edge Networking Designs

Monday, October 19, 2015

• Shanghai Seeks 'More-than-Moore' in Silicon Valley

Monday, October 19, 2015

• Dolphin Integration receives TSMC's Open Innovation Platform 2015 Partner of the Year Award for Specialty IP

Monday, October 19, 2015

• TSMC Slashes 2015 Capex by over 25% to $8 Billion

Monday, October 19, 2015

• Sensory TrulySecure Face Authentication Software Now Available on Cadence Tensilica Imaging/Vision DSPs

Monday, October 19, 2015

• Apple Gives a Foundry Lesson

Sunday, October 18, 2015

• iPhone 7: Will It Have Intel Inside?

Thursday, October 15, 2015

• More-than-Moore Will Lead, Argues GloFo's Wijburg

Wednesday, October 14, 2015

• Connected vehicles are the first big IoT opportunity
• Arm Holdings boosted by M&A chatter in the semiconductor sector
• Internet Society Releases Internet of Things (IoT) Overview: Understanding the Issues and Challenges
• Microsoft and LG extend partnership to Internet of Things
• Simplicity Needed in the Internet of Things
• Kilopass' CEO Charlie Cheng to Keynote Chinese American Semiconductor Professional Association
• Phison Electronics Improves Time to Market by 40 Percent with Cadence Voltus-Fi Custom Power Integrity Solution
• Xilinx Announces Q2 Fiscal 2016 Results; Strong Profitability And New Product Growth
• TSMC Reports Third Quarter EPS of NT$2.91
• Apple loses patent lawsuit to University of Wisconsin, faces hefty damages
• Gartner Says Worldwide Semiconductor Capital Spending to Decrease by One Percent in 2015
• Researchers Demonstrate Single-Ended Die-to-Die Transceiver
• More-than-Moore Will Lead, Argues GloFo's Wijburg
• Report: Analog Devices, Maxim in merger talks
• Will Intel, with CDMA, Gun for iPhones?

Wednesday, October 14, 2015

• Exostiv Labs announces the availability of its 'EXOSTIV' solution for FPGA debug.

Tuesday, October 13, 2015

• Extracting crypto keys from the Cloud
• No way back for the 'smart' microcontroller, says Microchip
• Renesas offers Cortex-M4 MCUs with Synergy RTOS and stacks
• Exostiv Labs announces the availability of its 'EXOSTIV' solution for FPGA debug.

Tuesday, October 13, 2015

• Rambus Ruling To Fuel Reforms

Tuesday, October 13, 2015

• IC vendors, get with the platform

Tuesday, October 13, 2015

• Automotive standard open to interpretation

Tuesday, October 13, 2015

• Not everyone gets mugged for IP

Tuesday, October 13, 2015

• Commentary: Why it's time to redefine ESL

Tuesday, October 13, 2015

• VeriSilicon to Acquire Vivante Corporation in All-Stock Transaction