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Monday, March 2, 2015

• Accellera Systems Initiative UVM 1.2 Proceeds to IEEE Standardization

Monday, March 2, 2015

• NXP and Freescale Announce $40 Billion Merger

Monday, March 2, 2015

• Waves MaxxVoice Technology Now Available for Cadence Tensilica HiFi Audio DSPs

Monday, March 2, 2015

• NXP, Freescale: Bigger Not Better

Monday, March 2, 2015

• PLDA and Avery Design Systems Cooperate on PCI Express

Monday, March 2, 2015

• How to meet the challenges of Set-Top-Boxes on Internet? Thanks to Dolphin Integration's Engineering Support team!

Monday, March 2, 2015

• eASIC and Comcores Announce Availability of CPRI v6.1

Monday, March 2, 2015

• Synopsys and Hillcrest Labs Announce Ultra-Low Power Sensor Processing Solution for Always-On Applications

Monday, March 2, 2015

• Synopsys and Sensory, Inc. Deliver Ultra-Low Power Voice Control Solution for Mobile, Automotive and Consumer Applications

Monday, March 2, 2015

• Kilopass Hires Michel Courtoy as Vice President of Marketing and Business Development

Monday, March 2, 2015

• Rambus Launches Partners-in-Open-Development Program to Accelerate Adoption of Lensless Smart Sensor Technology

Monday, March 2, 2015

• MWC 2015, Inside is Driving Security Innovation to Meet Demands of New Mobile and Internet Age

Monday, March 2, 2015

• Waves Partners with CEVA to Offer the latest Sonic Enhancement Technologies for the Mobile Market

Monday, March 2, 2015

• Arteris FlexNoC Helps Enable Texas Instruments Wireless Connectivity for the Internet of Things (IoT)

Monday, March 2, 2015

• CAST Makes Evaluating 32-bit Processor IP Easier with Talos for BA20 Plus FreeRTOS

Monday, March 2, 2015

• Express Logic's ThreadX To Bring Full RTOS to the ARM mbed Ecosystem

Monday, March 2, 2015

• INSIDE Secure Introduces HCE Payment Security Updates at Mobile World Congress 2015

Monday, March 2, 2015

• ARM Adds Customized Remote Training to Education Portfolio

Monday, March 2, 2015

• Hillcrest Labs' Freespace Always-On Sensing Software Available on Cadence Tensilica DSP

Monday, March 2, 2015

• eSilicon Uses Sonics' Flagship On-chip Network in Complex SoC Design

Monday, March 2, 2015

• CEVA Brings Human-Like Intelligent Vision Processing to Low-Power Embedded Systems

Monday, March 2, 2015

• Imagination and Altair report growing traction for Altair's LTE devices with MIPS CPUs

Monday, March 2, 2015

• Imagination packs high-quality PowerVR Rogue graphics into a tiny footprint

Monday, March 2, 2015

• Imagination's MIPS CPUs power Sequans' newest Colibri and Calliope LTE chipset platforms for IoT and M2M

Monday, March 2, 2015

• New PowerVR video IP family from Imagination combines highest quality H.265/H.264 encoding with optimized low latency streaming

Monday, March 2, 2015

• VeriSilicon Introduces Hantro G2v2 Multi-format Decoder IP with VP9 Profile 2 to Support 10-bit Premium Internet Content

Monday, March 2, 2015

• PLDA and Analog Bits Partner to Provide a Silicon-proven PCIe 3.0 Solution for leading 28nm low power process

Monday, March 2, 2015

• Freescale, Cisco, Ciena Give Nod to FD-SOI

Monday, March 2, 2015

• PRO DESIGN Unveils New Virtex UltraScale 440 FPGA Based Prototyping Solution

Monday, March 2, 2015

• Shikino Launches Still Image Decoder IP Obtaining "World-class speed" 16X faster image processing

Monday, March 2, 2015

• Altera and China Mobile Demonstrate Virtualized C-RAN Platform for 5G at Mobile World Congress 2015

Sunday, March 1, 2015

• Asian Share of Global Fab Capacity May Top 69% by 2019
• New PowerVR G6020 GPU targets ultra-affordable mobile and IoT devices
• Freescale-NXP Merger Leaves Fewer Viable Alternatives in Chip Market
• Global Semiconductor Industry Posts Highest-Ever January Sales
• DTS Headphone:X Optimized for Cadence Tensilica HiFi Audio DSPs

Friday, February 27, 2015

• T&VS and Blackpepper Technologies announce strategic partnership to provide turnkey end-to-end SoC implementation services

Friday, February 27, 2015

• Cypher Partners with CEVA to Offer Innovative Noise Reduction Solution for Mobile, Wearables and Voice-activated Devices

Friday, February 27, 2015

• INSIDE Secure - 2014 Annual Results

Friday, February 27, 2015

• Cortus and Oryx enable Internet of Things SoC applications with IP v6 stack running on the full range of Cortus processor cores

Friday, February 27, 2015

• Blunk Microsystems offers CrossStep IDE for Cortus Software Development

Friday, February 27, 2015

• SMIC Achieves 8M Pixel CIS Production on 0.13-Micron BSI with Cista

Friday, February 27, 2015

• WiLAN Enters into Settlement and License Agreement with Texas Instruments

Friday, February 27, 2015

• New EEMBC CoreMark-Pro Benchmark Bumps Processor Benchmarking Capabilities

Friday, February 27, 2015

• Synopsys' embARC Open Software Platform Accelerates Development of ARC-based Embedded Systems for the Internet of Things

Friday, February 27, 2015

• SmartDV Announces Addition of Six New Verification IPs to their Product Portfolio

Friday, February 27, 2015

• Brite Semiconductor Improves Quality of Results and Reduces Time to Market for Four SoC Designs with Cadence Digital Implementation and Signoff Tools

Friday, February 27, 2015

• Altera and Escape Communications Announce High-capacity Turn-key Modem Solution for E- and V-band Microwave Radios

Friday, February 27, 2015

• Credo Demonstrates Industry's First 56G NRZ Solutions at OFC 2015

Friday, February 27, 2015

• ARM Unveils Advanced Technology to Accelerate Game Development at the Game Developers Conference (GDC) 2015

Friday, February 27, 2015

• ARM Launches Intelligent Flexible Cloud Framework to Shape the Next-Generation Network

Thursday, February 26, 2015

• Cavium and ARM To Demonstrate Comprehensive Cloud RAN Application on 48 Core 64-bit ARMv8-A ThunderX SoC Processor at Mobile World Congress 2015

Thursday, February 26, 2015

• Apple & Samsung No Longer Control Majority of Tablet Market

Thursday, February 26, 2015

• Real Intent Unveils New Release of Ascent Lint for Early Verification of Digital Designs

Wednesday, February 25, 2015

• INSIDE Secure Introduces HCE Payment Security Updates at Mobile World Congress 2015

Wednesday, February 25, 2015

• Microchip Licenses EtherCAT Technology

Wednesday, February 25, 2015

• Blu Wireless to demonstrate HYDRA gigabit modem IP targeted at mmWave communication

Wednesday, February 25, 2015

• Microsemi's Innovative TimeProvider 5000 System Supports Phase Synchronization Needed for LTE Advanced and Small Cell Deployments

Wednesday, February 25, 2015

• Kilopass to Demonstrate Ultra Low-Power, High-Performance Non-Volatile Memory IP at GSA Memory+ Conference in Tokyo

Wednesday, February 25, 2015

• Dream Chip Technologies and Chips&Media partner to provide Premium Ultra HD (4k) video experience

Wednesday, February 25, 2015

• Tronics Expands its Business Model to Mobile and Wearable Applications with the Licensing of its Combo Sensors Based on Disruptive Magelan and M&NEMS Technologies

Tuesday, February 24, 2015

• Cadence Achieves First PCI Express 2.0 and PCI Express 3.0 Compliance for TSMC 16nm FinFET Plus Process
• Hitachi Reduces Verification Turnaround Time for Mixed-Signal Chip with Cadence Virtuoso AMS Designer
• Arteris FlexNoC Helps Enable Texas Instruments Wireless Connectivity for the Internet of Things (IoT)
• POWER FIRST - Subduing The Power Management Storm
• Blunk Microsystems offers TargetTools™ IDE for Cortus Software Development
• CEVA Brings Human-Like Intelligent Vision Processing to Low-Power Embedded Systems
• Nabto offers its "Internet of Things" Communication Platform on Cortus-based Systems-on-Chips
• Xilinx and BEEcube Announce Highly Scalable Prototyping Platform for 5G Massive MIMO Antenna Systems
• Arm at Mobile World Congress 2015 - Expanding the Connected Experience

Tuesday, February 24, 2015

• JEDEC Announces Publication of e.MMC Standard Update v5.1

Tuesday, February 24, 2015

• S3 Group's Video Data Converter IP Selected by GEO Semiconductor

Tuesday, February 24, 2015

• Xilinx and Xylon Announce New Industry Leading Automated Multi-Camera Image Stitching IP for 2D/3D Surround View Systems

Monday, February 23, 2015

• Hillcrest Labs' Freespace Always-On Sensing Software Available on Cadence Tensilica DSP
• Samsung Wants Moore's Law End, Analyst Says
• Cadence Announces Stratus High-Level Synthesis Platform
• TSMC to Start 10nm in 2017, Closing Gap with Intel
• Arm Adds Customized Remote Training to Education Portfolio
• Green Hills Software and Imagination Report Expanded Compiler and Tools Support for MIPS CPUs
• Altera Ships 20 nm SoCs
• eSilicon Uses Sonics' Flagship On-chip Network in Complex SoC Design
• Top Semiconductor R&D Leaders Ranked for 2014
• Freescale Drives for a Secure Internet of Things
• Freescale's Kinetis KV5x MCU with Arm® Cortex®-M7 Core Drives Motor Control into the IoT Era
• Freescale i.MX 6SoloX Takes Applications Processor Security to New Levels
• Lattice Semiconductor Enables Faster IEC61508 Certification with FPGA Functional Safety Design Flow
• Atmel Launches Automotive Grade Arm Cortex-M0+-based MCUs With Capacitive Touch Hardware Support for HMI and LIN Applications
• Microsemi Extends its Leadership in Cyber Security for Automotive and IoT Applications with Escrypt Public Key Infrastructure
• Lattice Semiconductor Expedites & Simplifies USB Type-C Implementation in Consumer and Industrial Devices
• Silicon Vision and Mindtree Enable Next Generation IoT Devices with Bluetooth Smart 4.2
• CAST Makes Evaluating 32-bit Processor IP Easier with Talos for BA20 Plus FreeRTOS
• OneSpin Delivers First SystemC Assertion-Based Formal Verification Solution
• Arm Connects a New World of Intelligent Devices to the Cloud

Monday, February 23, 2015

• New 80251 Microcontroller IP Core Available from CAST is the World's Fastest 8051-Compatible

Monday, February 23, 2015

• Smartphone and Automotive Display Revenue Swelled in 2014, as Demand for Other Small and Medium Display Categories Stalled, IHS Says

Monday, February 23, 2015

• Embedded World 2015: ReFLEX CES Showcases Extended High-Speed FPGA Boards Portfolio.

Monday, February 23, 2015

• Altera FPGAs Achieve Compelling Performance-per-Watt in Cloud Data Center Acceleration Using CNN Algorithms

Monday, February 23, 2015

• Silicon Storage Technology and UMC Announce Availability of Qualified 55 nm Embedded SuperFlash Memory Platform and 40 nm License

Monday, February 23, 2015

• Flex Logix Technologies Introduces EFLX: an FPGA Core for Upgrading Silicon

Monday, February 23, 2015

• EZchip Introduces TILE-Mx100 World's Highest Core-Count ARM Processor Optimized for High-Performance Networking Applications

Monday, February 23, 2015

• North American Semiconductor Equipment Industry Posts January 2015 Book-to-Bill Ratio of 1.03

Monday, February 23, 2015

• eASIC Files Registration Statement for Proposed Initial Public Offering

Monday, February 23, 2015

• VESA to Showcase Latest DisplayPort Developments for Mobile Applications at Mobile World Congress

Monday, February 23, 2015

• Fast Processor Models of MIPS Warrior Cores Released by Imperas and Open Virtual Platforms

Monday, February 23, 2015

• TVS announces new CPU Verification tool development

Monday, February 23, 2015

• Xilinx Stays a Generation Ahead at 16nm with New Memory, 3D-on-3D, and Multi-Processing SoC Technologies

Monday, February 23, 2015

• Altera Showcases Its Industry-leading SoC Solutions at Embedded World

Monday, February 23, 2015

• CEVA Announces Availability of Enhanced Voice Services (EVS) Codec for its Low Power Audio/Voice DSPs

Monday, February 23, 2015

• Logicircuit Offers First "Safe IP" Subscription Model

Monday, February 23, 2015

• Smart Power Metering: Dolphin Integration first Silicon IP provider to announce range 1/5,000 with 0.05 % accuracy for a complete solution

Monday, February 23, 2015

• Magillem partnering with Imperas: Enabling Internet of Things, using virtual platforms

Monday, February 23, 2015

• Videantis and gestigon bring gesture recognition and skeleton tracking to the automotive market

Sunday, February 22, 2015

• Express Logic's ThreadX To Bring Full RTOS to the Arm mbed Ecosystem

Thursday, February 19, 2015

• Multicore Association Provides Architecture Description Standard to Enhance Software Tool Support for Multicore and Manycore Processors

Thursday, February 19, 2015

• NXP and Chinese Private Equity firm JianGuang Asset Management to Establish Semiconductor Joint Venture

Thursday, February 19, 2015

• Synopsys Posts Financial Results for First Quarter Fiscal Year 2015

Thursday, February 19, 2015

• Microsemi Strengthens Leadership in Defense and Security with Category 1A Trusted Supplier Accreditation From DMEA

Wednesday, February 18, 2015

• Chipmaker Dialog posts strong Q4; eyes good growth in 2015
• INSIDE SECURE named as "2014 European Frost & Sullivan Company of the Year"
• Arm is Enabling Embedded Intelligence for a Smarter World at EW2015

Tuesday, February 17, 2015

• Samsung to Acquire LoopPay, Transformative Digital Wallet Platform
• How to Fail in the Internet of Things
• The 'Internet of Things' will be the world's most massive device market and save companies billions of dollars
• Mobile networks prep for the Internet of Things
• Freescale Semiconductor and Alcatel-Lucent’s Research Arm Bell Labs Extend Collaboration to Advance Wireless Technology for the Internet of Tomorrow
• IoT Center partner Cypherbridge focuses on security
• Mentor Graphics Signs Agreement with CADD Edge to Distribute Electronic Design and Analysis Products
• Microsoft, Google Beat Humans at Image Recognition
• Achronix Dramatically Reduces Compile Times with New Incremental Compile Support in its ACE Design Tools
• CEVA at MWC 2015: Powering a New Era of Intelligent Mobile Devices with the Industry's Leading Portfolio of Communications, Multimedia and Connectivity IPs
• MIPI Alliance Updates its Widely Adopted CSI Specification to Bring High-Resolution Imaging, Richer Color and Video to Mobile and Mobile-Influenced Applications
• Mindtree Enables Next Generation Bluetooth Low Energy Chips at Cypress
• Arm Offers $10,000 in Prizes for Smart Product Design Competition
• eWBM Selects Elliptic's Secure Root of Trust Technology for Newest IoT Chipset
• Two Major Enterprise Solid State Disk (SSD) Vendors License Arteris FlexNoC Interconnect IP
• Semiconductor Unit Shipments To Exceed One Trillion Devices in 2017
• Embedded World 2015: ReFLEX CES Showcases Extended High-Speed FPGA Boards Portfolio
• Imagination at Mobile World Congress 2015 - Driving the future of mobile innovation