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Friday, June 14, 2024

• Japan to send 200 engineers to U.S. for AI chip training at Tenstorrent
• Codasip Claims 'Best-in-Class' RISC-V Core for Power-Conscious Designs

Wednesday, June 12, 2024

• Cadence and Samsung Foundry Accelerate Chip Innovation for Advanced AI and 3D-IC Applications
• Axiomise Heads to RISC-V Summit Europe June 25-27 in Munich
• Flow Computing Emerges from Stealth with Licensable, On-Die Parallel Processing Enabling 100X Improved Performance For Any CPU Architecture
• Alphawave Semi Tapes Out Industry-First, Multi-Protocol I/O Connectivity Chiplet for High-Performance Compute and AI Infrastructure
• Consortium led by Crosshill Oy signs defense technology development agreement for F-35 Program with Lockheed Martin
• Samsung Showcases AI-Era Vision and Latest Foundry Technologies at SFF 2024
• Rapidus and IBM Expand Collaboration to Chiplet Packaging Technology
• Siemens collaborates with Samsung Foundry to expand 3D-IC enablement tools, optimize other EDA solutions for foundry's newest processes
• Sondrel secures major funding today
• ADTechnology announces next-generation platform "ADP600" at Samsung Foundry Forum 2024
• Synopsys Achieves Certification of its AI-driven Digital and Analog Flows and IP on Samsung Advanced SF2 GAA Process

Tuesday, June 11, 2024

• SEMIFIVE Collaborates with OPENEDGES on Chiplet Development
• Silvaco Announces Initiatives to Enhance Workforce Development in Semiconductor Industry
• SureCore Balances Power and Cooling Costs With Cryogenic Memory
• Alphawave Semi to Showcase Next-Generation PCIe® 7.0 IP Platform for High-Performance Connectivity and Compute at PCI-SIG® DevCon 2024
• Rambus Unveils PCIe 7.0 IP Portfolio for High-Performance Data Center and AI SoCs
• SEMIFIVE joins Arm Total Design with plans to develop Arm Neoverse-powered HPC Platform

Monday, June 10, 2024

• Siemens and KU Leuven collaborate to research Digital Twin for Smart and Sustainable Products
• Alphawave Semi Expands Partnership with Samsung Foundry to Further Drive Innovation at Advanced Semiconductor Nodes
• Arteris Selected by Esperanto Technologies to Integrate RISC-V Processors for High-Performance AI and Machine Learning Solutions

Monday, June 10, 2024

• HCLTech and Arm Collaborate on Custom Silicon Chips Optimized for AI Workloads

Sunday, June 9, 2024

• Sondrel offers leading edge chip design teams
• Global Semiconductor Sales Increase 15.8% Year-to-Year in April; New Industry Forecast Projects Market Growth of 16.0% in 2024
• eXpreso eFPGA Compiler Achieves 98.6% Packing Density
• Synopsys Accelerates Trillion Parameter HPC & AI Supercomputing Chip Designs with Industry's First PCIe 7.0 IP Solution
• intoPIX Launches Titanium at InfoComm, Boosting professional AV-over-IP Workflow Efficiency
• Introducing USB 3.0, PCIe 2.0 and SATA 3.0 Combo PHY IP Cores to empower Next Gen Connectivity Chipsets
• OPENEDGES Announces Silicon-Proven Success of its LPDDR5X Combo PHY IP on Samsung Foundry's SF5A Technology

Friday, June 7, 2024

• Nuvoton Develops OpenTitan® based Security Chip as Next Gen Security Solution for Chromebooks

Thursday, June 6, 2024

• Andes RISC-V CON: Deep Dive into Automotive, AI Application Processors and Security Trend
• Efabless Welcomes Weebit Nano's ReRAM to Its Custom Chip Design Platform
• TSMC May 2024 Revenue Report
• Nuvoton Develops OpenTitan® based Security Chip as Next Gen Security Solution for Chromebooks
• MediaTek Joins Arm Total Design to Shape the Future of AI Computing
• Mobiveil's PSRAM Controller IP Lets SoC Designers fully Leverage AP Memory's Ultra High Speed (UHS) PSRAM Memory
• Sigasi Redefines Chip Design Creation, Integration, Validation Leveraging Shift-Left Principles
• Andes Technology Announces the Annual ANDES RISC-V CON on June 11th at the DoubleTree San Jose Hotel

Wednesday, June 5, 2024

• Samsung Foundry Expands 'Packaging Coalition' with Ten Additional Members
• Synthara Raises Over USD 11M to expand the embedded computing market and enable AI applications
• Q1 2024 Global Semiconductor Equipment Billings Edge Down 2% Year-Over-Year, SEMI Reports
• Siemens brings formal methods to high-level verification with C++ coverage closure and property checking
• Alphawave Semi Collaborates with Arm on High-Performance Compute Chiplet
• BrainChip Introduces TENNs-PLEIADES in New White Paper
• UMC Reports Sales for May 2024
• Arm looking for 50% of Windows PC market
• GUC Monthly Sales Report - May 2024
• Siemens announces breakthroughs in high-level verification of C++

Tuesday, June 4, 2024

• Energy transition, electrification, and electrolysis - research for greater environmental and climate action
• Qualcomm is considering a "dual-sourcing" strategy with Samsung and TSMC for Snapdragon 8 Gen 5
• Intel sells off half its Irish fab for $11bn
• ElevATE Semiconductor and GlobalFoundries Partner on High-Voltage Chips for Commercial and National Security Applications
• AI Edge Inference IP Leader Expedera Opens R&D Office in India
• RaiderChip launches its Generative AI hardware accelerator for LLM models on low-cost FPGAs
• Skymizer Launches Groundbreaking LLM Accelerator IP for on-device LLM Inferencing, EdgeThought, the game-changer in on-device GenAI era
• Qualitas Semiconductor Announces 5nm MIPI C-PHY IP with 8Gsps Data Rate

Monday, June 3, 2024

• ARM could take 50% of Windows PC market, says CEO
• Cadence Acquires Beta CAE
• AI expected to drive TSMC growth over next few years
• Why hardware security underlies AI progress
• Frontgrade Technologies Selected by MDA Space as Part of MDA AURORA™ Supply Chain
• UK digital twin leader joins Siemens Xcelerator
• Codasip introduces best-in-class RISC-V core for power-efficient applications
• SureCore announces low power cryogenic memory technology that could help dramatically cut data centre power usage
• Kalray and Pliops enters into exclusive negotiations to create a global leader in data accelerators for AI and storage acceleration
• Raspberry Pi Selects Hailo to Enable Advanced AI Capabilities for Raspberry Pi 5
• New LZ4 & Snappy IP Core from CAST Enables Fast Lossless Data Decompression