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Thursday, May 7, 2026
Siemens and Xometry partner to bring expanded AI-native supply chain intelligence to Siemens Xcelerator
Accelerate Your Innovation: Why FPGA System on Modules (SoMs) Are the Strategic Choice
Semidynamics and SiPearl Announce Strategic Cooperation to Develop EU-Sovereign Rack-Scale AI Compute Platform
AI demand reshapes semiconductor capacity and intensifies supply chain competition
Lenovo’s New ThinkPad Headset Uses Ceva Spatial Audio to Make Entertainment Content More Immersive and Drive All-Day Use
Keysight and CATARC New Energy Vehicle Inspection Center Expand Strategic Collaboration to Advance Charging Test Technologies
Fraunhofer IIS tests high bandwidths for non terrestrial networks (NTN)
AI drives photonics innovation
European scientists turn to light to halt internet energy crisis
Infineon once again listed as a global leader in sustainability Read more at: https://www.bisinfotech.com/infineon-once-again-listed-as-a-global-leader-in-sustainability/
QuickLogic to Showcase EOS™ S3 and eFPGA Solutions at Sensors Converge
Omni Design Technologies Steps Up European Hiring and Advanced Data Center IP Push
Analysts bullish on SkyeChip ahead of IPO, upside seen at up to 91%
The Next Phase of Europe’s Semiconductor Strategy
Global Semiconductor Sales Increase 25% from Q4 2025 to Q1 2026
European Processor Initiative finishes second stage
Nvidia Enters the Scene. Behind the $400 Million in Financing, RISC-V Ushered in Spring
Why Codasip went all‑in on CHERI
Keysight Expands PCIe® 7.0 Test Portfolio with New Receiver Stress Calibration
SEMI ESD Alliance 2026 Executive Outlook Explores How Agentic AI Will Change Chip Design and Verification
GlobalFoundries accelerates adoption of co-packaged optics for advanced AI data centers with SCALE optical module solution
Apple Considers Samsung and Intel Foundries to Reduce Reliance on TSMC
TSMC pushes next-gen chip expansion while Samsung grapples with union
Wednesday, May 6, 2026
Rambus Introduces PCIe® 7.0 Switch IP with Time Division Multiplexing for Scalable AI and Data Center Infrastructure
Siemens hardware-assisted verification validates Arm AGI CPU for scalable agentic AI
Tuesday, May 5, 2026
Two Weebit Nano product customers tape-out; one already demonstrating a functional prototype
Monday, May 4, 2026
Silicon-Proven 112Gbps SerDes IP Core in 12FFC Redefines High-Speed Connectivity with Unmatched Flexibility and Performance
TES Electronic Solutions GmbH Provides a Configurable Display Controller IP for Flexible Embedded Video Applications
Arteris (AIP) Is Up 20.7% After Expanded MIPS RISC-V Physical AI Partnership Has The Bull Case Changed?
Surge in custom chip business propels VeriSilicon's Q1 revenue to double, with new orders skyrocketing to 8.2 billion yuan; increased R&D investment leads to wider net loss | Earnings Insight
Cadence Reports First Quarter 2026 Financial Results
QuickLogic Establishes New Banking Relationship and Secures $10 Million Revolving Credit Facility
SkyeChip Berhad: Malaysia’s Leading IC Design & Silicon IP Company – Business Overview, Competitive Strengths & Future Plans
"We Will Build a Korean Broadcom" ... Jaehong Park, CEO of BOS Semiconductors
Satellite IoT connectivity: extending the IoT into Earth orbit
AI Transforms the Chip Industry
The great data center delay: Why your AI chips are stuck in 2026
GUC Collaborate with Wiwynn to Advance Silicon-to-System Infrastructure for Next-Generation Hyperscale AI
Arm AGI CPU Goes to Market via Supermicro and Verda at 2026 OCP EMEA Summit
TSMC SoIC roadmap targets 2029 chip stacking
Thursday, April 30, 2026
Arteris Wins Stevie Award for Technology Innovation of the Year
Semifive Wins 3D IC Turnkey Design Deal for Edge AI Chip
Korea Semiconductor Association Expands AI Innovation Center in Silicon Valley
Siemens Industrial Edge ecosystem strengthens data and AI integration
Microcontrollers for Machine Learning
Tenstorrent Unveils Next-Gen Servers for Fast Tokens, No Disaggregation Needed
Siemens fortifies cyber resilience to ensure energy supply for critical infrastructures
A lunar network project powered by digital twins
Auto China: Bosch pushes ahead with Level 3 highly automated driving
ISO 26262: The Impact of ASIL Metrics on Embedded Software Design
Arteris, Inc. grows Poland engineering hub and strengthens European semiconductor ties
Chip design firm SkyeChip sets Main Market IPO at 88 sen apiece to raise RM352 mil
STMicroelectronics brings always-on vision to next-generation personal electronics with new ultralow-power image sensors
Korea and Qatar to Expand Investment Cooperation in Manufacturing AI, Semiconductors, and Bio Industries
Altair Semiconductor Secures $50M Funding Following Sony Spinoff to Accelerate IoT & 5G Innovation
Vietnam, South Korea cooperate to develop semiconductor ecosystem, supply chain
LTSCT Joins imec Automotive Chiplet Program
Xylon Presents New 12-Channel GMSL3/GMSL2 FMC+ ExpansionBoard
MIPI Alliance Launches Physical AI Birds of a Feather (BoF) Group Focused on Humanoids
Wednesday, April 29, 2026
Perceptia Devices and Dolphin Semiconductor Partner to Deliver Best-in-Class IP Portfolio Covering Power Management, Clocking, High-Quality Audio and In-Situ Monitoring
IC Manage Advances GDP-AI for Custom IC Design with Virtuoso
Tuesday, April 28, 2026
TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.
Monday, April 27, 2026
Enabling the Chiplet Era: T2M Brings Production-Proven, UCIe-Ready Die-to-Die IP for Chiplet SOCs.
CAST Introduces MAC-SEC-MG IP Core for Secure 10G+ Ethernet SoC Designs
More Control, Less Chaos With Microchip’s New All-in-One DSCs
Infineon joins European quantum pilot lines for quantum chips
Ceva’s 5G NTN Modem IP Could Democratize Modems for Satellite Terminals
Rambus Enables Power-Efficient AI Platforms with SOCAMM2 Server Module Chipset
EU DARE Project Is Scrambling to Replace Codasip
M31 Collaborates with TSMC to Achieve Tapeout of eUSB2V2 on N2P Process, Advancing Design IP Ecosystem
Silvaco Partners with ITRI to Support MCU Development and Startup Innovation
Atomera Extends Collaboration With Synopsys to Accelerate GaN Modeling in High-Value RF and Power Devices
TSMC Latest Roadmap: A12, A13 for 2029 Without High-NA EUV; A16 Volume Production Delayed to 2027
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