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Friday, November 28, 2025

• EU digital package promises €155B in savings with streamlined AI and data rules
• Sovereign AI: The New Foundation of National Power
• Intel Could Manufacture Apple M-Series Chips in 2027 with 18A-P Node

Thursday, November 27, 2025

• BOS Semiconductors Eyes Expansion into ‘Intelligent Space’ AI Market Beyond ADAS
• Edge AI’s Next Battlefield: Development Tools
• Tenstorrent QuietBox tested: A high-performance RISC-V AI workstation trapped in a software blackhole
• Finland: At the forefront of specialised microelectronics in Europe
• Sustainability moves upstream delivering greener semiconductor design
• Keysight Technologies Reports Fourth Quarter and Fiscal Year 2025 Results
• Europe tackles e-waste with eco-friendly innovation that helps reuse and repair
• Semiconductor supply risk management From firefighting to proactive strategy
• BKT Waluj Plant Wins CII National Water Award for 25% Water Reduction
• 6 IoT semiconductor predictions for 2026
• Codasip announces strategic licensing agreement with EnSilica for its CHERI-enabled embedded CPU from the 700 family
• Synopsys Demonstrates Framework for Optimizing Manufacturing Processes with Digital Twins at Microsoft Ignite
• InPsytech showcases 3nm UCIe 3.0 at OCP 2025, accelerating innovation in chiplet ecosystem
• RPI and GlobalFoundries Partner on Semiconductor Research, Education, and Workforce Development Initiatives
• TSMC to Build Three New 2 nm Fabs in Taiwan for $28 Billion
• Intel confirms steady 18A yield improvements and 14A progress

Wednesday, November 26, 2025

• The 10 Hottest Semiconductor Startups Of 2025
• HiPEAC Vision, a Blueprint for European Survival
• Neuromorphic Photonic Computing: Lights On
• WAVE-N v2: Chips&Media’s Custom NPU Retains 16-bit FP for Superior Efficiency at High TOPS

Tuesday, November 25, 2025

• Cadence to Present at UBS Global Technology and AI Conference
• Why PCB security matters in military electronics
• How A New eSIM Standard Is Opening New IoT Opportunities For Partners
• Siemens: Industrial AI Can Deliver Marked Green Improvements
• Samsung Reportedly Hits 55–60% 2nm Yields, Eyeing an Edge Through Early GAA Deployment
• Perceptia Begins Port of pPLL03 to Samsung 14nm Process Technology
• Qualitas Semiconductor Demonstrates Live of PCIe Gen 6.0 PHY and UCIe v2.0 Solutions at ICCAD 2025

Monday, November 24, 2025

• Rapidus Selected as Official Business Operator by Japan Government
• Sustainability moves upstream delivering greener semiconductor design
• Japanese government to invest 100 bil. yen in chipmaker Rapidus
• TSMC gets NT$147bn in subsidies in two years
• Beyond Silicon: Exploring new materials for Photonic Integrated Circuits
• How Europe Can Build—and Keep—the Next Generation of Deep-Tech Giants
• Photonics Investments—Part 3: Three Game-Changing Photonics Technologies
• Oulu’s semiconductor industry: A rising European wireless technology hub
• Engineering Education in the Age of AI
• Cadence Adds 10 New VIP to Strengthen Verification IP Portfolio for AI Designs
• Synopsys Convenes Industry Leaders to Discuss Future of Automotive Engineering for Software-Defined Vehicles
• Fragmentation to Standardization: Evaluating RISC-V’s Path Across Data Centers, Automotive, and Security
• Samsung announces 2nm GAA process has 5% more perf, 8% more efficient than 3nm GAA
• VSORA and GUC Partner on Jotunn8 Datacenter AI Inference Processor

Thursday, November 20, 2025

• Breker Verification Systems and Frontgrade Gaisler Collaborate on High-Reliability RISC-V Fault-Tolerant Processor Core
• Mixel MIPI IP Integrated into Automotive Radar Processors Supporting Safety-critical Applications
• Dnotitia Revolutionizes AI Storage at SC25: New VDPU Accelerator Delivers Up to 9x Performance Boost
• Three Ethernet Design Challenges in Industrial Automation
• Scintil Photonics: AI at the speed of light
• Denmark Opens 300-mm Wafer Fab to Strengthen Europe’s Sovereignty
• Arm Neoverse platform integrates NVIDIA NVLink Fusion to accelerate AI data center adoption
• AMD maps out strategy for leadership in future compute and AI
• GlobalFoundries and BAE Systems Collaborate on Semiconductors for Space
• proteanTecs and Akeana Announce Joint Initiative to Drive Next-Generation RISC-V Processor Performance
• RISC-V And Its Modularity Shine Across Applications
• Siemens and Microsoft team up to deliver Polarion X on Azure
• Cadence Debuts Its First System Chiplet Silicon To Accelerate Physical AI Development
• Chinese crypto-mining manufacturers order next-gen 2nm GAA chips from Samsung Foundry
• GlobalFoundries Acquires Advanced Micro Foundry, Accelerating Silicon Photonics Global Leadership and Expanding AI Infrastructure Portfolio
• CEA-Leti to Launch Multilateral Program to Accelerate AI with MicroLED Data Links

Wednesday, November 19, 2025

• QuickLogic eFPGA Hard IP Selected by Chipus for 12 nm High Performance Data Center ASIC
• EagleChip Selects CAST TSN IP Core to Enhance Advanced Intelligent Control SoC

Tuesday, November 18, 2025

• Moreh and Tenstorrent reveal joint AI data center solution
• SAICEC and Siemens to accelerate chip-to-vehicle validation using digital twin technology

Monday, November 17, 2025

• d-Matrix and Andes Team on World's Highest Performing, Most Efficient Accelerator for AI Inference at Scale
• Ceva Receives 2025 IoT Edge Computing Excellence Award from IoT Evolution World
• AI's Speed Problem Sparks Light-Based Chip Revolution
• Samsung & Nvidia: Rewiring Manufacturing With AI Megafactory
• GlobalFoundries Reports Third Quarter 2025 Financial Results
• Bluetooth Channel Sounding: The Next Leap in Bluetooth Innovation
• EPI announces the open-source release of the CEA-List VPSim simulator
• EPI announces SC25 attendance to present results: Proactive Compute showcases FAUST and FEVER
• Renesas’ Industry-First Gen6 DDR5 Registered Clock Driver Sets Performance Benchmark by Delivering 9600 MT/s
• Silicon Photonic Chiplets with In-memory Computing Accelerate LLM Inference, Surpassing H100 Efficiency
• TSMC, Samsung Reportedly Cut 8-Inch Wafer Output, Boosting Korea’s DB HiTek
• Intel's 18A process technology – a lifeline for the Intel Foundry department?
• EnSilica to develop quantum-resilient secure processor chip for critical national infrastructure applications backed by £5m UK Government ‘Contract for Innovation’
• GUC and Ayar Labs Partner to Advance Co-Packaged Optics for Hyperscalers