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Sunday, April 6, 2025

• Global Semiconductor Sales Increase 17.1% Year-to-Year in February
• GUC Monthly Sales Report - March 2025
• Will RISC-V reduce auto MCU's future risk?
• Analysts question TSMC-Intel JV plan
• HCLTech recognized as Leader in all three service areas in ISG Provider Lens ™ 2024 - Advanced Analytics and AI Services reports for US and Europe
• Altera Starts Production Shipments of Industry's Highest Memory Bandwidth FPGA

Friday, April 4, 2025

• Siemens chooses Canada for $150M AI manufacturing research hub in Oakville

Thursday, April 3, 2025

• Matrox Video and intoPIX Expand Interoperable IPMX & ST 2110 Solutions with JPEG XS Innovation at NAB 2025
• Frontgrade Gaisler and wolfSSL Collaborate to Enhance Cybersecurity in Space Applications
• HCLTech joins Samsung Advanced Foundry Ecosystem as a Design Solution Partner
• Continuous-Variable Quantum Key Distribution (CV-QKD) system demonstration
• 2025 RISC-V CON: Andes Technology Celebrates 20 Years, Bringing Together Innovators, Engineers, and Ecosystem Leaders
• Major Manufacturing Shake-up: Intel Agrees to TSMC Takeover of Chip Foundries, Sources Say
• Japan's Rapidus in talks with Apple, Google to mass-produce chips, Nikkei reports
• Silicon Photonics and Co-Packaged Optics Shine a Light at OFC 2025

Wednesday, April 2, 2025

• QuickLogic to Exhibit at HEART Conference in Monterey
• ST's Automotive MCU technology for next-generation vehicles
• Europe consults on critical raw materials
• Frontgrade Gaisler Launches New GRAIN Line and Wins SNSA Contract to Commercialize First Energy-Efficient Neuromorphic AI for Space Applications
• Latest intoPIX JPEG XS Codec Powers FOR-A's FA-1616 for Efficient IP Production at NAB 2025
• VeriSilicon Launches ISP9000: The Next-Generation AI-Embedded ISP for Intelligent Vision Applications
• GUC Announces Tape-Out of the World's First HBM4 IP on TSMC N3P
• BrainChip Partners with RTX's Raytheon for AFRL Radar Contract
• Arteris Opens New Engineering Hub in Poland
• Qualcomm considers buying Alphawave Semi
• Alphawave IP Response to announcement from Qualcomm
• New splitting method: Fraunhofer IIS brings satellites into the 5G era

Tuesday, April 1, 2025

• Will RISC-V reduce auto MCU's future risk?
• Digital Core Design Unveils DPSI5 - The Next-Generation IP Core for PSI5 Communication
• ProMOS Adopts Silvaco Victory TCAD Solution for the Development of Next-Gen Silicon Photonics Devices
• Fraunhofer IIS Walks the Line for Edge AI
• Siemens acquires Dotmatics to extend AI-powered software portfolio to Life Sciences
• Capgemini recognized as a 'Leader' in Application Modernization and Multicloud Managed Services by independent research firm

Monday, March 31, 2025

• Silicon-Proven MIPI CSI-2 & DSI-2 Tx/Rx IP Cores for your Camera & Display SoCs
• QuickLogic Announces $1.4 Million Incremental Funding Modification for its Strategic Radiation Hardened Program
• Village Island Enhances its AI100 with intoPIX's JPEG XS Technology for Advanced Real-Time Analysis
• Movellus and RTX's SEAKR Engineering Collaborate on Advancing Mission-Critical ASICs
• GlobalFoundries and UMC Mull Potential Merger
• Exploring the Rationale for HAV in Complex SoCs
• TeraSignal to Showcase Retimer-Less PCIe 6.0 over Optics Featuring Synopsys IP at OFC 2025
• TSMC opens up 2nm wafer fab, races to mass production

Monday, March 31, 2025

• Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation

Monday, March 31, 2025

• RISC-V in Space Workshop 2025 in Gothenburg

Sunday, March 30, 2025

• Avant Technology Partners with COSEDA Technologies to Enhance System-Level Software Solutions
• VeriSilicon introduces AcuityPercept: an AI-powered automatic ISP tuning system
• X-FAB, SMART Photonics and Epiphany Design demonstrate InP-on-Silicon design flow for next-generation optical transceivers at OFC
• SEALSQ and IC'ALPS Join Forces to Advance Post-Quantum Secure ASICs for Automotive Functional Safety
• New cryostatic systems elevate current research on Qubits
• Phonemic has Full Registration on ESA STAR, Strengthening Its Position in Space FPGA Engineering

Friday, March 28, 2025

• LDRA Updates Tools to Automate Worst-Case Execution Time Analysis for RISC-V

Thursday, March 27, 2025

• intoPIX Powers Ikegami's New IPX-100 with JPEG XS for Seamless & Low-Latency IP Production
• Intel brings 3nm production to Europe in 2025
• How Soitec Engineers Substrates for Cloud and Edge AI

Wednesday, March 26, 2025

• Faraday Technology Selects Silvaco FlexCAN IP for Advanced Automotive ASIC Design
• EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
• SiliconIntervention Announces Availability of Silicon Based Fractal-D Audio Amplifier Evaluation Board
• Qualcomm initiates global anti-trust complaint about Arm
• Sarcina Technology launches AI platform to enable cost-effective customizable AI packaging solutions
• Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
• Faraday Technology Selects Silvaco FlexCAN IP for Advanced Automotive ASIC Design
• Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
• Qualcomm initiates global anti-trust complaint about Arm
• EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
• SiliconIntervention Announces Availability of Silicon Based Fractal-D Audio Amplifier Evaluation Board
• Sarcina Technology launches AI platform to enable cost-effective customizable AI packaging solutions
• Crypto Quantique Simplifies CRA Compliance for Embedded Security
• Pragmatic Semiconductor set to revolutionise NFC connectivity with sustainable flexible chips
• Korea's science ministry partners with Samsung, SK hynix, and DB HiTek for MoaFab upgrades

Wednesday, March 26, 2025

• X-FAB, SMART Photonics, and Epiphany Design Collaborate on Advanced Heterogeneous Photonics Integration Platform

Tuesday, March 25, 2025

• PolarFire® SoC FPGAs Achieve AEC-Q100 Qualification
• EnSilica Opens Second Brazilian Design Centre Following Multimillion Pound Design and Manufacturing Contract Win
• Alphawave Semi Reveals Suite of Optoelectronics Silicon Products addressing Hyperscaler Datacenter and AI Interconnect Market
• intoPIX JPEG XS Cores Power Delta Video's IP Video Transmission Solutions
• TSMC Reportedly Speeds Up AP7 and AP8 Build-Outs, Targets Doubling SoIC Capacity
• Siemens acquires Altair to create most complete AI-powered portfolio of industrial software
• SiliconIntervention Announces Availability of Silicon Based Fractal-D™ Audio Amplifier Evaluation Board
• PolarFire® SoC FPGAs Achieve AEC-Q100 Qualification

Tuesday, March 25, 2025

• Cadence Launches Conformal AI Studio, Improves SoC Productivity by 10x
• Siemens is European patent champion

Monday, March 24, 2025

• Rapidus Announces Strategic Partnership with Quest Global to Enable Advanced 2nm Solutions for the AI Chip Era
• Fraunhofer to show AI, robotics and connected data for healthcare
• AI platform enables customisable packaging solutions for AI applications
• Renesas Introduces Low-Power Bluetooth Low Energy SoC for Automotive Applications
• Spanish government invests €13.8m in 5G satellites