Search News

Thursday, June 5, 2025

• Transition Plan: Leonardo publishes its transition strategy
• NCSC proposes its PQC transition timeline to UK Policy makers: guiding the UK to a quantum-safe future, Jeremy Bradley NCSC
• Plug and Play Expands Semiconductor Ecosystem Program with New Synopsys Collaboration to Accelerate Chip Design Innovation
• TSMC Achieves 90% Yield in 2nm Memory Chip Production
• Intel Foundry Direct Connect 2025 Expands Roadmap And Partnerships
• Alphawave Semi Tapes Out Breakthrough 36G UCIe™ IP on TSMC 2nm, Unlocking Foundational AI Platform IP on Nanosheet Processes
• CAST Expands Functional Safety Line with Additional Certified IP Cores
• IntoPIX Showcases Smart Image Sensor Compression At AutoSens US 2025
• GlobalFoundries Announces $16B U.S. Investment to Reshore Essential Chip Manufacturing and Accelerate AI Growth
• Chips&Media Unveils WAVE-N: A Custom NPU for High-Quality, High-Resolution Imaging
• Automakers Can Launch AI-Defined Vehicles a Full Year Sooner - Powered by Arm Zena CSS

Wednesday, June 4, 2025

• Joseph von Fraunhofer Prize 2025 for research team at Fraunhofer IIS
• Cadence Extends Support for Automotive Solutions on Arm Zena Compute Subsystems
• Arm Unwraps Automotive Compute Platform Aimed at 'AI-Defined Vehicles'
• Using Design-to-Test Workflows and Managing the IP Lifecycle in Chiplet Designs
• New president reiterates commitment to Korea's tech future
• Dolphin Semiconductor Provides High-Efficiency DC-DC Converter in 40nm to XHSC for High-end Industrial Products Applications
• IP Cores, Inc. Announces New Shipment of PQC1 Hardware Accelerator for Post-Quantum Cryptography

Tuesday, June 3, 2025

• Siemens and Northrop Grumman continue collaboration to advance digital ecosystem
• Addressing e-waste with recyclable, healable circuit boards
• FlexGen Streamlines NoC Design as AI Demands Grow
• OpenGMSL™ Association Announces Formation to Revolutionize the Future of In-Vehicle Connectivity
• AccelerComm Secures $15m Funding to Speed Adoption of Technology for Space-Based 5G Networks to Deliver Universal Mobile Coverage

Monday, June 2, 2025

• Metanoia Communications Selects Andes Technology RISC-V Processor to Boost 5G O-RAN Efficiency and Accelerate Development
• Ex-TSMC executive joins Samsung Foundry to lead US expansion
• What's making smart cities and homes even smarter?
• Metanoia Communications Selects Andes Technology RISC-V Processor to Boost 5G O-RAN Efficiency and Accelerate Development
• Siemens and IBM collaborate to bring SysML v2 model-based systems engineering to Siemens Xcelerator
• 12-bit, 5MS/s SAR ADC IP Core for Ultra-Low Power Precision Applications: T2M Unveils New IP
• Chevin are proud to be awarded runner-up of Arm Silicon Startups Contest 2025
• HPC Innovator Taps Aion Silicon for $12M RISC-V Accelerator Program
• Making Technology Real: GlobalFoundries' Vision for the Future

Sunday, June 1, 2025

• Japan's Softbank will join hands with U.S. Intel to develop a new memory semiconductor that will be used for artificial intelligence (AI)

Friday, May 30, 2025

• How Cadence Is Powering Greener Semiconductor Innovation

Thursday, May 29, 2025

• AI memory chip guru to unveil road map for next-generation HBMs
• Synopsys Issues Statement in Connection with BIS Letter
• TSMC to Open EU Design Center in Munich in Q3
• 300mm RF silicon interposer platform for chiplet-based heterogeneous integration demonstrates record-low insertion loss at frequencies up to 325GHz
• SCI Semiconductor raises £2.5m to develop security-enhanced microcontroller based on CHERI

Wednesday, May 28, 2025

• Keysight Technologies (KEYS) to Acquire Divested Assets from Synopsys and Ansys
• Trump Blocks Chip Design Software Firms From Selling In China
• Synopsys Posts Financial Results for Second Quarter Fiscal Year 2025
• CEA Backs RISC-V for Sovereign, Scalable Computing
• Arteris Bridges Hardware-Software Gap with New EDA Tool
• Rapidus to assist training in Vietnam's semiconductor industry
• Ireland Maps Out 'Silicon Island' National Semiconductor Strategy
• Toward High-Density Embedded LiDAR for the Autonomous Vehicle of Tomorrow
• ICTK Partners with BTQ of Canada for Quantum-safe Security Solutions
• SCI Semiconductor secures £2.5m towards developing CHERI-secured MCU
• TSMC dazzles in Amsterdam
• TSMC to Open First European Design Center in Munich by Q3 2025, Focusing on AI and Automotive
• EnSilica Establishes New Engineering Hub in Cambridge
• Brite Semiconductor Releases TCAM IP based on 28HKC+ Process

Tuesday, May 27, 2025

• Keysight Announces Executive Leadership Transitions and New Appointments
• Imec ITF World 2025: The hardware horizon for AI
• Alphawave IP extends Qualcomm PUSU deadline for third time
• Soitec reports fourth quarter revenue and Full-year results of fiscal year 2025
• Towards next-generation edge-AI technologies: EU consortium opens services to external customers
• Imec's 300mm RF silicon interposer platform for chiplet-based heterogeneous integration demonstrates record-low insertion loss at frequencies up to 325GHz

Monday, May 26, 2025

• Veriest & Xsight - Advancing Data Transfer for Cloud Data Centers
• CFX's 55nm BCD process OTP IP has been put on the shelves
• AMD sees TSMC as the clear favorite for 2nm, but Samsung remains in the game
• RISC-V Turns 15 With Fast Global Adoption
• High-Performance USB 3.2 Gen1 & Gen2 PHY and Controller IP Cores from T2M, Powers Next-Gen SoCs

Sunday, May 25, 2025

• Samsung to use Glass Substrate for Semiconductor manufacturing in 2028