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Saturday, July 26, 2025

• L&T Semiconductors eyes global play with Fujitsu General's deal, sharp focus on IP and automotive

Friday, July 25, 2025

• Taiwan deepens semiconductor cooperation with Europe
• Top Automotive Semiconductor Solutions Powering the Cars of Tomorrow
• MIPS and Cyient Collaborate on RISC-V Power Solutions
• Soitec VP: 'In the Near Term, Caution Is the Name of the Game'
• Tech giant Intel cancels investments in Poland, Germany
• China Emerging as Significant Force in RISC-V Development and Adoption
• Intel facing another crossroads: 18A or 14A process node
• Paving the Way for Integrated Photonic Chips
• Silicon Photonics Market to Hit Significant Growth

Thursday, July 24, 2025

• Mike Yeager: 'Simulation Is Now Driving Product Design, Not Just Validating It'
• TSMC's 2nm Production Is Expected to Break Records, With Capacity Surpassing 3nm & Soaring Demand Driven by Massive Interest From Big Tech
• Intel Earnings Call Preview: 14A Strategy, Foundry Challenges, and More
• How the semiconductor industry is grappling with cybersecurity threats
• Keysight Supports Post-Quantum Cryptography Evaluation

Wednesday, July 23, 2025

• ADAS and Lidar Technology Revolutionize Automotive Safety in Modern Vehicles
• UMC Announces Software Acquisition and Upcoming Earnings Release
• TSMC to Exit GaN, Focus on Advanced Packaging
• Mixel Supports Automotive SerDes Alliance (ASA) Motion Link SerDes IP

Tuesday, July 22, 2025

• SEMI Predicts Record $125.5 Billion in Global Semiconductor Equipment Sales for 2025
• How Ireland is powering a sustainable future for the global semiconductor industry
• Arm Zena Compute Subsystems: Paving the Way to Scalable Automated Driving for the AI-Defined Era
• ICTK Obtains 'CC EAL6' Certification, a High Level of Security Assurance for IT Products
• Ansys and SASTRA Deemed University Establish Center of Excellence for Advanced Space and Defense Technologies
• Synopsys strengthens India's role with push for world's first AI-based chip foundry
• Designing the future: AI innovation accelerated through university collaboration
• Samsung shortsightedly rejected Nvidia CEO Jensen Huang's reported HBM production and Foundry business proposals in 2018
• Arteris Selected by Whalechip for Near-Memory Computing Chip

Monday, July 21, 2025

• Top 5% Companies Sweep Profits in Global AI Semiconductor Industry
• Siemens and UMC collaborate to advance EM/IR drop analysis with mPower technology
• EnSilica cuts post-quantum cryptography (PQC) silicon area with three-in-one IP block
• 12-bit 5Msps High-Speed, Silicon-Proven ADC IP Core Available for Immediate Licensing
• Axiomise Partners With Bluespec to Verify Its RISC-V Cores

Saturday, July 19, 2025

• NVIDIA's CUDA Now Supports RISC-V Processors in AI Systems, Marking a Major Development & Posing a Threat to the x86 and ARM Duopoly

Friday, July 18, 2025

• New Semiconductor Material for the Chips of the Future
• Korea joins Horizon Europe R&D programme
• TSMC to top $100bn as it plans 11 fabs in Taiwan
• President of Armenia Awards Synopsys Armenia President Yervant Zorian the First-Class Medal for "Service to the Homeland"
• Fraunhofer IPMS and DIVE target cleaner, more efficient chip production
• Cadence Races First to Release LPDDR6/5X Memory IP for AI Infrastructure
• Rapidus Achieves Significant Milestone at its State-of-the-Art Foundry with Prototyping of Leading-Edge 2nm GAA Transistors
• Europe's photonic computing opportunity: Q.ANT's funding boosts competitive edge
• Synopsys Completes Acquisition of Ansys

Thursday, July 17, 2025

• Fraunhofer develops "resource-efficient" measurement system for semiconductor wafer production
• German government plans new semiconductor factories
• European Funding Deals: SiPearl, Exein, Q.Ant Aim For Scaleup
• Sustainability in Action 2025, a strategic vision for a responsible and resilient business
• Quantropi brings post-quantum cryptography to STM32 just in time to face new threats
• TSMC Reports Second Quarter EPS of NT$15.36
• How Mature-Technology ASICs Can Give You the Edge
• The chiplet future could be harmonious
• Perceptia Devices Release pPLL08W, best-in-class RF PLL IP in GF22FDX
• Pioneering Performance: How Allegro DVT Is Accelerating AV1 Adoption in SiliconPermalink
• 2025 TSMC Technical Talk: Exploring Diverse Paths in Semiconductor Technology
• Innosilicon Scales LPDDR5X/5/4X/4 and DDR5/4 Combo IPs to 28nm and 22nm, Cementing Its Position as the "One Stop" for Memory Interface Solutions

Wednesday, July 16, 2025

• How AI is Pushing Semiconductor Manufacturing into a Generational Shift
• Semiconductor Fab Shakeups Signal Application-Focused Plans Ahead
• New architecture for AI datacentres proposed
• IHP, eMemory and its subsidiary PUFsecurity Break Ground on Open Access to Hardware PUF-based Security IP in Europe
• Thalia Design Automation launches AMALIA Platform 25.2
• ESD Alliance Reports Electronic System Design Industry Posts $5.1 Billion in Revenue in Q1 2025
• Siemens collaborates with SK keyfoundry to launch 130nm automotive power semiconductor Calibre PERC PDK
• InPsytech Tapes Out F2F SoIC Design Compliant with UCIE 2.0 Standard Enabling High-Speed Interconnects for 3D Heterogeneous Integration

Tuesday, July 15, 2025

• Niobium Superconducting Interconnects Open New Horizons for Quantum Computing
• Siemens' Veloce CS selected by Arm for Neoverse compute subsystems verification and validation
• GUC Tapes Out Industry-Leading UCIe Face-Up IP for TSMC SoIC-X
• Synopsys Receives All Necessary Approvals for Proposed Acquisition of Ansys

Monday, July 14, 2025

• Broadcom Cancels Spain Fab, Impacting Europe Semiconductor Ambitions
• HCLTech Q1 FY26: Reports 10.8% QoQ net profit decline at Rs. 3,843 Cr
• proteanTecs Launches Solution for System Production Analytics Based on Chip Telemetry
• IPrium releases SOQPSK-TG Demodulator for Aerospace Telemetry
• Breakthrough in AR/VR SoC Innovation: Full Suite of Cutting-Edge Interface & Analog IP Cores Licensed by Tier-1 U.S. Customer