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Thursday, May 7, 2026

• Siemens and Xometry partner to bring expanded AI-native supply chain intelligence to Siemens Xcelerator
• Accelerate Your Innovation: Why FPGA System on Modules (SoMs) Are the Strategic Choice
• Semidynamics and SiPearl Announce Strategic Cooperation to Develop EU-Sovereign Rack-Scale AI Compute Platform
• AI demand reshapes semiconductor capacity and intensifies supply chain competition
• Lenovo’s New ThinkPad Headset Uses Ceva Spatial Audio to Make Entertainment Content More Immersive and Drive All-Day Use
• Keysight and CATARC New Energy Vehicle Inspection Center Expand Strategic Collaboration to Advance Charging Test Technologies
• Fraunhofer IIS tests high bandwidths for non terrestrial networks (NTN)
• AI drives photonics innovation
• European scientists turn to light to halt internet energy crisis
• Infineon once again listed as a global leader in sustainability Read more at: https://www.bisinfotech.com/infineon-once-again-listed-as-a-global-leader-in-sustainability/
• QuickLogic to Showcase EOS™ S3 and eFPGA Solutions at Sensors Converge
• Omni Design Technologies Steps Up European Hiring and Advanced Data Center IP Push
• Analysts bullish on SkyeChip ahead of IPO, upside seen at up to 91%
• The Next Phase of Europe’s Semiconductor Strategy
• Global Semiconductor Sales Increase 25% from Q4 2025 to Q1 2026
• European Processor Initiative finishes second stage
• Nvidia Enters the Scene. Behind the $400 Million in Financing, RISC-V Ushered in Spring
• Why Codasip went all‑in on CHERI
• Keysight Expands PCIe® 7.0 Test Portfolio with New Receiver Stress Calibration
• SEMI ESD Alliance 2026 Executive Outlook Explores How Agentic AI Will Change Chip Design and Verification
• GlobalFoundries accelerates adoption of co-packaged optics for advanced AI data centers with SCALE optical module solution
• Apple Considers Samsung and Intel Foundries to Reduce Reliance on TSMC
• TSMC pushes next-gen chip expansion while Samsung grapples with union

Wednesday, May 6, 2026

• Rambus Introduces PCIe® 7.0 Switch IP with Time Division Multiplexing for Scalable AI and Data Center Infrastructure
• Siemens hardware-assisted verification validates Arm AGI CPU for scalable agentic AI

Tuesday, May 5, 2026

• Two Weebit Nano product customers tape-out; one already demonstrating a functional prototype

Monday, May 4, 2026

• Silicon-Proven 112Gbps SerDes IP Core in 12FFC Redefines High-Speed Connectivity with Unmatched Flexibility and Performance
• TES Electronic Solutions GmbH Provides a Configurable Display Controller IP for Flexible Embedded Video Applications
• Arteris (AIP) Is Up 20.7% After Expanded MIPS RISC-V Physical AI Partnership Has The Bull Case Changed?
• Surge in custom chip business propels VeriSilicon's Q1 revenue to double, with new orders skyrocketing to 8.2 billion yuan; increased R&D investment leads to wider net loss | Earnings Insight
• Cadence Reports First Quarter 2026 Financial Results
• QuickLogic Establishes New Banking Relationship and Secures $10 Million Revolving Credit Facility
• SkyeChip Berhad: Malaysia’s Leading IC Design & Silicon IP Company – Business Overview, Competitive Strengths & Future Plans
• "We Will Build a Korean Broadcom" ... Jaehong Park, CEO of BOS Semiconductors
• Satellite IoT connectivity: extending the IoT into Earth orbit
• AI Transforms the Chip Industry
• The great data center delay: Why your AI chips are stuck in 2026
• GUC Collaborate with Wiwynn to Advance Silicon-to-System Infrastructure for Next-Generation Hyperscale AI
• Arm AGI CPU Goes to Market via Supermicro and Verda at 2026 OCP EMEA Summit
• TSMC SoIC roadmap targets 2029 chip stacking

Thursday, April 30, 2026

• Arteris Wins Stevie Award for Technology Innovation of the Year
• Semifive Wins 3D IC Turnkey Design Deal for Edge AI Chip
• Korea Semiconductor Association Expands AI Innovation Center in Silicon Valley
• Siemens Industrial Edge ecosystem strengthens data and AI integration
• Microcontrollers for Machine Learning
• Tenstorrent Unveils Next-Gen Servers for Fast Tokens, No Disaggregation Needed
• Siemens fortifies cyber resilience to ensure energy supply for critical infrastructures
• A lunar network project powered by digital twins
• Auto China: Bosch pushes ahead with Level 3 highly automated driving​​​​​​​
• ISO 26262: The Impact of ASIL Metrics on Embedded Software Design
• Arteris, Inc. grows Poland engineering hub and strengthens European semiconductor ties
• Chip design firm SkyeChip sets Main Market IPO at 88 sen apiece to raise RM352 mil
• STMicroelectronics brings always-on vision to next-generation personal electronics with new ultralow-power image sensors
• Korea and Qatar to Expand Investment Cooperation in Manufacturing AI, Semiconductors, and Bio Industries
• Altair Semiconductor Secures $50M Funding Following Sony Spinoff to Accelerate IoT & 5G Innovation
• Vietnam, South Korea cooperate to develop semiconductor ecosystem, supply chain
• LTSCT Joins imec Automotive Chiplet Program
• Xylon Presents New 12-Channel GMSL3/GMSL2 FMC+ ExpansionBoard
• MIPI Alliance Launches Physical AI Birds of a Feather (BoF) Group Focused on Humanoids

Wednesday, April 29, 2026

• Perceptia Devices and Dolphin Semiconductor Partner to Deliver Best-in-Class IP Portfolio Covering Power Management, Clocking, High-Quality Audio and In-Situ Monitoring
• IC Manage Advances GDP-AI for Custom IC Design with Virtuoso

Tuesday, April 28, 2026

• TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.

Monday, April 27, 2026

• Enabling the Chiplet Era: T2M Brings Production-Proven, UCIe-Ready Die-to-Die IP for Chiplet SOCs.
• CAST Introduces MAC-SEC-MG IP Core for Secure 10G+ Ethernet SoC Designs
• More Control, Less Chaos With Microchip’s New All-in-One DSCs
• Infineon joins European quantum pilot lines for quantum chips
• Ceva’s 5G NTN Modem IP Could Democratize Modems for Satellite Terminals
• Rambus Enables Power-Efficient AI Platforms with SOCAMM2 Server Module Chipset
• EU DARE Project Is Scrambling to Replace Codasip
• M31 Collaborates with TSMC to Achieve Tapeout of eUSB2V2 on N2P Process, Advancing Design IP Ecosystem
• Silvaco Partners with ITRI to Support MCU Development and Startup Innovation
• Atomera Extends Collaboration With Synopsys to Accelerate GaN Modeling in High-Value RF and Power Devices
• TSMC Latest Roadmap: A12, A13 for 2029 Without High-NA EUV; A16 Volume Production Delayed to 2027