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Tuesday, September 30, 2014

• Intel Rose to Number Two Position in Tablet Applications Processors in Q2 2014

Tuesday, September 30, 2014

• Smartphone Apps Processor Revenue Reached $5.2 Billion in Q2 2014 says Strategy Analytics

Tuesday, September 30, 2014

• MPEG LA Offers HEVC Patent Portfolio License

Monday, September 29, 2014

• Lenovo Set to Close Acquisition of IBM's x86 Server Business

Monday, September 29, 2014

• HP Extends Benefits of ARM Architecture Into the Datacenter With New Servers

Monday, September 29, 2014

• ChaoLogix Opening India Engineering Center To Meet Global Demand for ChaoSecure Technology That Boosts Semiconductor Chip Security

Monday, September 29, 2014

• Elliptic Technologies to Speak at the Chip-to-Cloud Security Forum

Monday, September 29, 2014

• Synopsys Unveils Verification Continuum to Enable Next Wave of Industry Innovation in Software Bring-Up for Complex SoCs

Monday, September 29, 2014

• Freescale Plans Extreme Performance for Kinetis MCUs with ARM Cortex-M7 Core

Monday, September 29, 2014

• IAR Embedded Workbench delivers outstanding performance for new ARM Cortex-M7 core

Monday, September 29, 2014

• STMicroelectronics Accelerates MCU-Developers' Pace of Innovation with World's First ARM Cortex-M7 Core-Based STM32 F7 Series MCU

Monday, September 29, 2014

• ARM Supercharges MCU Market with High Performance Cortex-M7 Processor

Monday, September 29, 2014

• Algotronix and Adaptive Micro-Ware Announce Partnership

Monday, September 29, 2014

• PathPartner Technology Announces Industry's First Hybrid Hardware-Software HEVC Decoder Optimized for Programmable SoC Devices

Monday, September 29, 2014

• Sibridge Technologies' USB 3.0 IP solution adopted by Tier-1 companies

Monday, September 29, 2014

• TVS joins MIPI Alliance, introduces MIPI Verification IP Suite

Monday, September 29, 2014

• Coreworks develops audio IP core for integration in SoC and FPGA for 8K UHDTV encoding

Monday, September 29, 2014

• GUC Rolls Out New Low Power Solid State Drive IP Portfolio

Monday, September 29, 2014

• ARM and Cadence Expand Collaboration for IoT and Wearable Device Applications Targeting TSMC's Ultra-Low Power Technology Platform

Monday, September 29, 2014

• ARM and Synopsys Expand Collaboration to Improve Quality of Results and Time-to-Results for Leading-Edge ARMv8-A and ARMv7-A Cores

Monday, September 29, 2014

• TSMC launches ultra-low power technology platform for IoT and wearable device applications

Monday, September 29, 2014

• TVS to champion Requirements Driven Verification and Test at DVCon Europe

Monday, September 29, 2014

• SMIC Gives 2014 "Best IP Partner Award" of the Year

Monday, September 29, 2014

• S2C Announces AXI-4 Prototype Ready Quick Start Kit

Monday, September 29, 2014

• Cadence IP Portfolio and Tools to Support New TSMC Ultra-Low Power Technology Platform

Monday, September 29, 2014

• Smartphone Connectivity Presents Both Opportunities and Challenges for Automotive Processor Chip Suppliers

Monday, September 29, 2014

• Intel and Tsinghua Unigroup Collaborate to Accelerate Development and Adoption of Intel-based Mobile Devices

Monday, September 29, 2014

• 4 Reasons for Intel's $1.5 Billion Bet in China

Monday, September 29, 2014

• Cadence Digital and Custom/Analog Tools Achieve TSMC Certification for 16FF+ Process, Companies Collaborate on 10nm FinFET

Monday, September 29, 2014

• Cadence Unveils Broad IP Portfolio for New TSMC 16nm FinFET Plus Process

Friday, September 26, 2014

• SiTime Raises $25 Million

Friday, September 26, 2014

• Allegro DVT demonstrates its HEVC/H.265 Video Encoder IP and Compliance Streams at ARM TechCon 2014

Friday, September 26, 2014

• Leading-Edge IC Foundry Market Forecast to Increase 72% in 2014

Friday, September 26, 2014

• Cadence to Demonstrate 16FF+ Design Solutions at TSMC 2014 OIP Ecosystem Forum

Thursday, September 25, 2014

• Synopsys Tools Achieve TSMC Certification for 16-nm FinFET+ Process and Entered 10-nm FinFET Collaboration

Thursday, September 25, 2014

• TSMC delivers first fully functional 16FinFET networking processor

Thursday, September 25, 2014

• Xilinx Showcases All Programmable Solutions for Smarter Systems at ARM TechCon 2014

Thursday, September 25, 2014

• Are you ready to conquer PCIe 4.0 challenge? PLDA is ready

Thursday, September 25, 2014

• Codasip Appoints Coby Hanoch as VP of Worldwide Sales

Thursday, September 25, 2014

• iPhone 6 Plus: $100 Costlier for Consumers to Buy - Just $15.50 More Expensive for Apple to Make

Wednesday, September 24, 2014

• Kilopass to Exhibit at ARM TechCon 2014

Wednesday, September 24, 2014

• Uniquify Will Demonstrate Fastest DDR4 Memory IP at ARM TechCon

Wednesday, September 24, 2014

• Sidense Exhibiting at TSMC Open Innovation Platform (OIP) Ecosystem Forum

Tuesday, September 23, 2014

• SD Association Expands iSDIO Specification, Adds High-Speed Contactless Data Transfer with TransferJet

Tuesday, September 23, 2014

• Cadence's Rowen Forecasts Processor Design Split

Monday, September 22, 2014

• VESA Brings DisplayPort to New USB Type-C Connector

Monday, September 22, 2014

• Teardown.com Analysis: Apple iPhone 6 Plus

Monday, September 22, 2014

• Broadcom Enables Industry's First 20 nm 100G Coherent PHY

Monday, September 22, 2014

• Lattice Announces Production of MachXO3L in WLCSP Packages

Monday, September 22, 2014

• Users Cite 10 Percent Smaller Design Sizes with Latest Releases of Synopsys' Design Compiler

Monday, September 22, 2014

• Semtech Provides Ultra-High Speed ADC and DAC for Advanced Digital Microwave Systems

Monday, September 22, 2014

• MIPI Alliance Introduces MIPI C-PHY Specification and Updates its D-PHY and M-PHY Specifications

Monday, September 22, 2014

• Synopsys' New DesignWare MIPI D-PHY Cuts Area and Power by 50 Percent

Monday, September 22, 2014

• MegaChips to Acquire certain Smart Connectivity Products based on DisplayPort technology from STMicro

Monday, September 22, 2014

• Apple, Samsung in 20nm Race

Monday, September 22, 2014

• Xilinx Showcases 100G Solutions with Live Traffic over Optical Fiber and Backplane Demonstrations at ECOC 2014

Monday, September 22, 2014

• IEEE Forms Two New Working Groups to Standardize Software and System-Level Energy Management and Power Modeling for System-on-Chip Devices

Monday, September 22, 2014

• Cavium Standardizes on Synopsys' IC Compiler for High-performance Processor-based SoC Designs

Monday, September 22, 2014

• IP Subsystems in SoCs in Americas will grow to $340.5M by 2017, Says Semico Research

Monday, September 22, 2014

• Open-Silicon Speeds and Simplifies ASIC Development For 100G Networks

Monday, September 22, 2014

• Synopsys' New MIPI C-PHY Verification IP Accelerates Adoption of MIPI Alliance's Physical Layer Specifications

Monday, September 22, 2014

• Altera and Baidu Collaborate on FPGA-based Acceleration for Cloud Data Centers

Monday, September 22, 2014

• Samsung Now Mass Producing Industry's First, 20-Nanometer 6Gb LPDDR3 Mobile DRAM

Monday, September 22, 2014

• Why UMC is Boosting Automotive Chip Business

Monday, September 22, 2014

• What Apple Stuffed Inside iPhone 6 Plus

Friday, September 19, 2014

• Dell: 'If ARM works and costs less, we will use it'

Friday, September 19, 2014

• Ericsson discontinues development of modems - shifts part of investment into radio networks

Friday, September 19, 2014

• Microsemi Ships 22nm FinFET ASICs

Friday, September 19, 2014

• 18 Views of the Silicon Horizon

Friday, September 19, 2014

• North American Semiconductor Equipment Industry Posts August 2014 Book-to-Bill Ratio of 1.04

Friday, September 19, 2014

• AMD and Synopsys Expand IP Partnership

Friday, September 19, 2014

• CoinTerra announces the world's first 16nm ASIC based Bitcoin Miner - the AIRE Miner

Thursday, September 18, 2014

• Cisco Announces Intent to Acquire Memoir Systems

Thursday, September 18, 2014

• Leadcore Achieves First-Pass Silicon Success with DesignWare MIPI IP in Smartphone Application Processor SoC

Thursday, September 18, 2014

• Constellations will "Unlock the Mystery of IP" at Silicon Valley IP Users Conference

Thursday, September 18, 2014

• 2014 SMIC Technology Symposium Will Kick Off in Shanghai