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Friday, August 22, 2014

• North American Semiconductor Equipment Industry Posts July 2014 Book-to-Bill Ratio of 1.07

Thursday, August 21, 2014

• JPR Reports AMD jumps 11% in GPU shipments in Q2, Intel up 4%, Nvidia slips

Thursday, August 21, 2014

• Undo Software releases UndoDB Out-and-About edition

Thursday, August 21, 2014

• Synopsys Posts Financial Results for Third Quarter Fiscal Year 2014

Thursday, August 21, 2014

• Algo-Logic Systems Joins OpenPOWER Foundation

Wednesday, August 20, 2014

• SmartPlay Offers Specialized Design Services for Customers of Intel Custom Foundry

Wednesday, August 20, 2014

• RTOS Synthesis Tool SynthOS Goes Online For Free

Wednesday, August 20, 2014

• NxGn Data Emerges from Stealth Mode to provide a paradigm shift in enterprise storage solutions

Wednesday, August 20, 2014

• Process Roadmap For Memory Devices Marches On as 3D Looms

Wednesday, August 20, 2014

• 2014 Q2 Tablet Market Grows, as Apple and Samsung Disappoint says Strategy Analytics

Tuesday, August 19, 2014

• INSIDE Secure NFC patents licensed to smartphone manufacturer LG

Monday, August 18, 2014

• ON Semiconductor Completes Acquisition of Aptina Imaging and Provides Guidance for Third Quarter on Impact of Acquisition of Aptina Imaging

Monday, August 18, 2014

• Wind River Integrates Virtualization Technology into Next-Generation RTOS for Internet of Things

Monday, August 18, 2014

• Mentor Graphics Extends Nucleus RTOS with Industry-Leading Capabilities for Microcontroller and Multicore Applications

Monday, August 18, 2014

• Northwest Logic's PCI Express Gen3 Core and S2C's Virtex-7 ASIC Prototyping Platform fully validated together

Monday, August 18, 2014

• Dolphin Integration announce the availability of their Reusable Power Kit Library at TSMC 180 nm eLL

Monday, August 18, 2014

• Bitcoin ASIC in Chips-to-$ Race

Monday, August 18, 2014

• Nvidia Flexes Custom 64-Bit ARM

Monday, August 18, 2014

• Ittiam Systems announces availability of its third generation H.265/HEVC codec with 422 12-bit support

Monday, August 18, 2014

• Sibridge Technologies expands with a New Design Centre in Bangalore

Monday, August 18, 2014

• Microsoft Plugs FPGAs in Datacenter

Monday, August 18, 2014

• Microsemi and eInfochips Collaborate to Improve Efficiency, Reliability and Performance for Critical Avionics Systems Development and Design

Monday, August 18, 2014

• Server ASIC Hits Performance/Cost Sweet Spot

Monday, August 18, 2014

• USB 3.0 Promoter Group Announces USB Type-C Connector Ready for Production

Monday, August 18, 2014

• Worldwide Smartphone Shipments Edge Past 300 Million Units in the Second Quarter; Android and iOS Devices Account for 96% of the Global Market, According to IDC

Monday, August 18, 2014

• TSMC Board of Directors Meeting Resolutions

Thursday, August 14, 2014

• Imagination Technologies Group plc - Board Changes

Thursday, August 14, 2014

• Microcontroller Sales Kick Into Gear Again After Slump

Tuesday, August 12, 2014

• Energy-efficient and programmable heterogeneous many-core platform with self-adaptive capabilities

Tuesday, August 12, 2014

• 400 Gbit Ethernet: The Next Leap

Tuesday, August 12, 2014

• Strong Growth in Second Quarter 2014 Silicon Wafer Shipments

Tuesday, August 12, 2014

• Intel Outlines 14nm, Broadwell

Monday, August 11, 2014

• New IBM SyNAPSE Chip Could Open Era of Vast Neural Networks

Monday, August 11, 2014

• e2v technologies to acquire AnaFocus

Monday, August 11, 2014

• MIPI Alliance Enhances its Battery Interface Specification with "Smart Battery" Capabilities for Mobile Devices

Monday, August 11, 2014

• Lattice Simplifies Optical Ethernet System Management Interfaces

Monday, August 11, 2014

• Altera to Demonstrate FPGA Technologies at Flash Memory Summit 2014

Monday, August 11, 2014

• Calypto Catapult High-level Synthesis Platform Chosen by Olympus for C-Based Design and Verification

Monday, August 11, 2014

• Cadence Introduces Voltus-Fi Custom Power Integrity Solution, Delivering Foundry-Certified SPICE-Level Accuracy for Transistor-Level Power Signoff

Monday, August 11, 2014

• eASIC and Mobiveil Collaborate on Optimized NVMe Solution for SSD Systems

Monday, August 11, 2014

• Khronos Releases SPIR 2.0 Provisional Specification

Monday, August 11, 2014

• Khronos Group Announces Key Advances in OpenGL Ecosystem

Monday, August 11, 2014

• MagnaChip to Offer Competitive Embedded Multiple Time Programmable (MTP) IP Solutions

Monday, August 11, 2014

• Open-Silicon Establishes High-Speed SerDes Technology Center of Excellence

Monday, August 11, 2014

• Dolphin Integration reveal high quality and common-mode noise-resilient audio CODEC targeting automotive infotainment application

Monday, August 11, 2014

• DMP Launches the world's smallest GPU IP core for Wearables and Internet of Things (IoT)

Monday, August 11, 2014

• SMIC and JCET Establish a Joint Venture in Jiangyin National High-Tech Industrial Development Zone

Monday, August 11, 2014

• UMC Reports Sales for July 2014

Monday, August 11, 2014

• TSMC July 2014 Revenue Report