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Tuesday, May 27, 2014

• Cadence Offers Production Proven USB 3.0 Host Controller IP

Tuesday, May 27, 2014

• Breker Verification Systems, Truechip Solutions Partner to Provide Interoperable, High-Quality Verification IP Environment

Tuesday, May 27, 2014

• Grain Media Launches Its 4Kx2K IPcam SoC Solutions by Adopting Faraday's Serial Interface (MIPI/Sub-LVDS/HiSPi) Technology

Tuesday, May 27, 2014

• 35 IC Vendors already adopted Allegro DVT HEVC/H.265 Compliance Streams

Tuesday, May 27, 2014

• Arasan Chip Systems Presents MIPI D-PHY, M-PHY and USB 2.0 IP at the 51st DAC

Tuesday, May 27, 2014

• Altera Delivers Early Access Software for Next-Generation, Non-volatile FPGAs

Tuesday, May 27, 2014

• Synopsys and TSMC Collaborate to Validate DesignWare IP in TSMC 16-nm FinFET Process

Tuesday, May 27, 2014

• Inuitive Introduce NU3000 ASIC, The Industry's Most Advanced 3D imaging and computer vision processor for PCs, laptops, tablets, smartphones and consumer devices

Monday, May 26, 2014

• Fingerprint Cards Acquires Anacatum Design

Monday, May 26, 2014

• Mentor Graphics Acquires Nimbic, Inc.

Monday, May 26, 2014

• Leading technology companies form open source foundation 'prpl' supporting 'datacenter to device' portability

Monday, May 26, 2014

• Imagination and Oracle collaborate to enhance Java for embedded and the Internet of Things

Monday, May 26, 2014

• CSR Selects Cadence Palladium XP Platform for Development of ARM-based Automotive Infotainment Systems

Monday, May 26, 2014

• Cadence and ARM Expand Collaboration for 64-bit Processor Designs

Monday, May 26, 2014

• Cadence Extends Spectre XPS to Support Mixed-Signal Designs

Monday, May 26, 2014

• Cadence Announces New Integrated Solution for Rapid Die-Package Interconnect Planning

Monday, May 26, 2014

• IP Cores, Inc. Ships an FPGA Version of Its 100 Gbps MACsec Statistics IP Core

Monday, May 26, 2014

• Cadence Offers Immediate Availability of DDR4 PHY IP on TSMC 16nm FinFET Process

Monday, May 26, 2014

• GUC Unveils Its First 16nm IP

Monday, May 26, 2014

• OmniPhy Announces 2.5v I/O Transistor based Mixed Signal PHY Availability in TSMC 28nm HPM

Monday, May 26, 2014

• New foundry-sponsored sROMet TITAN available at TSMC 55 nm HV

Monday, May 26, 2014

• Dolphin Integration enable Dongbu HiTek's users to benefit from their ultra high density standard cell library

Friday, May 23, 2014

• Microchip Technology Announces Acquisition of ISSC Technologies

Thursday, May 22, 2014

• New Business Model: Flexible Silos

Thursday, May 22, 2014

• Synopsys Unveils Industry's First Complete PCI Express 4.0 IP Solution

Thursday, May 22, 2014

• Synopsys Posts Financial Results for Second Quarter Fiscal Year 2014

Wednesday, May 21, 2014

• Uniquify Announces UniquiPHY DDR System Analyzer

Tuesday, May 20, 2014

• IPextreme Welcomes Truechip to Constellations

Tuesday, May 20, 2014

• Uniquify Announces Immediate Availability of LPDDR4 Memory Subsystem IP

Tuesday, May 20, 2014

• Increase in First Quarter 2014 Silicon Wafer Shipments

Tuesday, May 20, 2014

• Uniquify Offers 10-Minute Mini-Webinar on DSCL for Achieving the World's Fastest DDR

Tuesday, May 20, 2014

• SMIC Offers Stable and Robust Wafer Productions for Fingerprint Sensors

Monday, May 19, 2014

• FDSOI: Is Cadence, Not Samsung, the Tipping Point?

Monday, May 19, 2014

• Vitesse Licenses Gigabit Ethernet IP Cores To Freescale

Monday, May 19, 2014

• Videantis celebrates 10-year anniversary as a leading video semiconductor IP supplier

Monday, May 19, 2014

• HiSilicon Expands Cadence Palladium XP Platform Usage For Mobile and Digital Media SoC and ASIC Development

Monday, May 19, 2014

• Xilinx Ships First Virtex UltraScale FPGA and Expands Industry's Only 20nm High-End Family for 500G on a Single Chip

Monday, May 19, 2014

• Kilopass' Gusto Ultra-Low Power NVM IP for Code Storage Enabled on UMC 55nm LP Process

Monday, May 19, 2014

• Arasan Chip Systems Announces the Industry's First SD 4.1 and eMMC 5.0 Combined Host Controller

Monday, May 19, 2014

• Samsung and STMicroelectronics Sign Strategic Agreement to Expand 28nm FD-SOI Technology

Monday, May 19, 2014

• Uniquify Delivers High-Performance DDR3 Memory System Running in Low-Cost, Wire Bond Package

Monday, May 19, 2014

• Sonics Introduces Next-Generation Development Environment To Ease Semiconductor IP Integration For Heterogeneous Multicore SoCs

Monday, May 19, 2014

• Intel gains, Nvidia flat, and AMD loses graphics market share in Q1

Friday, May 16, 2014

• SMIC and Other Groups Collaborate to Setup the "IC Advanced Technology Research Institute" to Put Research Into the Fast Lane

Friday, May 16, 2014

• Imagination's PowerVR Rogue GPUs are shipping in mass volume with 32- and 64-bit platforms for mobile and beyond

Friday, May 16, 2014

• Startup Faces SoC, Gender Challenges

Friday, May 16, 2014

• Chips&Media's world first HEVC Codec IP with 10bit support licensed to semiconductor companies

Thursday, May 15, 2014

• Cadence Announces Immediate Availability of Industry's First Verification IP for PCI Express 4.0 Technology

Thursday, May 15, 2014

• Cadence Announces Availability of IP Solutions on 28nm FD-SOI Process

Thursday, May 15, 2014

• MediaTek, SK Hynix, AMD, and Micron Sales Surge in 1Q14!

Thursday, May 15, 2014

• Is 450mm Dead In The Water?

Thursday, May 15, 2014

• Mars Photos from Curiosity Compressed On Demand Using JPEG Encoder IP Core in MSSS Camera System

Thursday, May 15, 2014

• IPextreme Welcomes Methods2Business to Constellations, Helps Company Plant Flag in the Semiconductor IP Market

Thursday, May 15, 2014

• HDL Design House Adopts ARM Engineer Accreditation Program

Thursday, May 15, 2014

• Rambus Joins JEDEC Committee to Advance Server Memory Systems