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Thursday, May 16, 2024

• Defacto SoC Compiler performance on AWS Graviton3
• South Korea Reportedly Plans to open AI Chip Center in San Jose
• Softbank's Arm new AI chips ready by 2025, aims to become an AI powerhouse
• TSMC Reportedly Prepares Next-generation HBM4 Manufacturing, Utilizing 12nm and 5nm Process Nodes

Wednesday, May 15, 2024

• TSMC Confirms Construction for Its First European Chip Plant to Commence in Q4, as Scheduled
• Solid second-quarter performance - Outlook confirmed
• Next-generation sustainable electronics are doped with air
• Axiomise Names Two Executives to Newly Formed Technical Advisory Board
• Siemens Sustainability report 2023
• AiM Future Brings GenAI Applications to Mainstream Consumer Devices

Tuesday, May 14, 2024

• Bosch Powers Battery Recycling Innovation
• TSMC plans automotive chiplet process for 2025
• Cybersecurity threat model for embedded devices
• An Introduction to Post-Quantum Cryptography Algorithms
• RISC-V Chip Combines CPU, GPU, and NPU Into One Core
• Esperanto Technologies and Rapidus Partner to Enable More Energy-Efficient Designs for the Coming "Post GPU Era"
• New Automotive Grade Linux Platform Release Adds Cloud-Native Functionality, RISC-V Architecture and Flutter-Based Applications
• Actions Technology's smart watch SoC adopted VeriSilicon's 2.5D GPU IP

Monday, May 13, 2024

• Green IT: 10 years of cooperation on the circular economy with a record in 2023
• Siemens partners with Microsoft to deliver AI-enhanced solutions for resilient product lifecycle management with Azure
• Digital Core Design in cooperation with DCD-SEMI Unveils DCAN-XL: Revolutionary CAN XL IP Core Bridging the Gap Between CAN FD and Ethernet
• Kevin O'Buckley to Lead Foundry Services at Intel
• Andes, HiRain, and HPMicro Join Hands to Build RISC-V AUTOSAR Software Ecosystem
• ADTechnology and ANAFLASH to Team Up for Embedded Vision Summit (EVS) showcase
• M31 Q1 Revenue Increases 9.3% YoY, Advanced Processes Drive QoQ Growth
• Frontgrade Gaisler Leads the Way in RISC-V Processor Development for Space Applications

Sunday, May 12, 2024

• Demonstrating the UCIe Chiplet Interconnect
• SiPearl chooses Italy to open its third international subsidiary
• TransferTalk "Sustainability as the Success Factor in Industries"
• SiPearl: Rhea1 key features to accelerate HPC & AI inference
• GDDR7 Adds Headroom to Meet AI Pressures
• TSMC April 2024 Revenue Report
• lowRISC Deploys Real Intent Ascent Lint, Meridian CDC, & Meridian RDC for OpenTitan Project
• Is Graphcore Deal Finally About to Close?
• NEO Semiconductor Reveals a Performance Boosting Floating Body Cell Mechanism for 3D X-DRAM during IEEE IMW 2024
• Qualcomm confirms that Huawei no longer need its chips
• Silicon Proven PCIe 5.0 PHY and Controller IP Cores in 12nm to Revolutionize Connectivity solutions

Wednesday, May 8, 2024

• GlobalFoundries' Q1 2024 Revenue Down 16% YoY, Decline Limited by Automotive Growth
• Qualitas to raise funds for research into UCIe PHY IP for chiplets
• X-Silicon Announces a NEW Low-Power Open-Standard Vulkan-Enabled C-GPUâ„¢ - a RISC-V Vector CPU Infused with GPU ISA and AI/ML acceleration in a Single Processor Core
• Sondrel awarded new Video Processor ASIC design and supply contract for a leading provider of High-Performance Video systems
• Ceva, Inc. Announces First Quarter 2024 Financial Results
• Arm revenues up 47%; shares fall
• Silvaco Announces Pricing of Initial Public Offering
• X-Silicon Announces a NEW Low-Power Open-Standard Vulkan-Enabled C-GPU™ - a RISC-V Vector CPU Infused with GPU ISA and AI/ML acceleration in a Single Processor Core
• Softbank reported to be in talks to buy Graphcore
• VESA Elevates PC and Laptop HDR Display Performance with Updated DisplayHDR Specification
• SAPEON Enhances AI Accelerator with proteanTecs Reliability and Performance Monitoring

Tuesday, May 7, 2024

• FMD's Albert Heuberger: Supporting Heterogeneous System Integration
• TSMC crunch heralds good days for advanced packaging
• Credo Schedules Fourth Quarter and Fiscal Year 2024 Financial Results Conference Call
• Cybersecurity professionals say generative AI can be exploited in cyberattacks - but it can also be a powerful defense
• TSMC Certifies a Host of Top EDA Tools for New Process Nodes
• Rapidus and Fraunhofer IZM join Forces for High-End Performance Packaging
• Samsung tapes out 3nm mobile processor, closing gap with TSMC
• sureCore announces successful tape-out of cryogenic IP demonstrator
• Arasan's Total MIPI Camera IP solution with CSI and C-PHY achieve ISO26262 Certification

Monday, May 6, 2024

• Kudelski IoT Selected as One of Zoom's Authorized Hardware Certification Testing Labs
• Apple M4 moves to TSMC N3E
• Siemens delivers end-to-end silicon quality assurance for next-generation IC designs with new Solido IP Validation Suite
• UMC Reports Sales for April 2024
• Synopsys collaborates with TSMC on 2nm IP portfolio and photonics ICs