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Sunday, March 17, 2024

• A System On Module (SoM) developed by Electra IC: BitFlex-SPB-A7 FPGA SoM
• After TSMC fab in Japan, advanced packaging facility is next
• Weebit Nano to demo its ReRAM technology on GlobalFoundries' 22FDX® platform
• Revolutionary Cadence Reality Digital Twin Platform to Transform Data Center Design for the AI Era
• Siemens and NVIDIA expand collaboration on generative AI for immersive real-time visualization
• Cadence and NVIDIA Unveil Groundbreaking Generative AI and Accelerated Compute-Driven Innovations
• EU takes a step closer to regulating AI

Friday, March 15, 2024

• Intel will bring a performance-improving feature to its chips one year ahead of TSMC

Thursday, March 14, 2024

• SoC Secure Boot Hardware Engine IP Core Now Available from CAST

Wednesday, March 13, 2024

• Canaan's RISC-V based edge AIoT SoC adopted VeriSilicon's ISP and GPU IPs
• Dolphin Design in Arm's Partner Catalog
• QuickLogic and Zero-Error Systems Partner to Deliver Radiation-Tolerant eFPGA IP for Commercial Space Applications
• embedded world 2024: Codasip demonstrates CHERI memory protection
• PrimisAI Unveils Premium Version of RapidGPT, Redefining Hardware Engineering

Tuesday, March 12, 2024

• Arasan proudly introduces the VESA VDC-M Encoder and Decoder IP
• Arasan proudly releases its Radiation Hardened NAND Flash IP
• Cadence Collaborates with Arm to Jumpstart the Automotive Chiplet Ecosystem
• HBM3 Initially Exclusively Supplied by SK Hynix, Samsung Rallies Fast After AMD Validation, Says TrendForce
• Arteris Expands Automotive Solutions for Armv9 Architecture CPUs
• Arm Announces New Automotive Technologies to Accelerate Development of AI-enabled Vehicles by up to Two Years
• Siemens to demonstrate first pre-silicon simulation environment for Arm Cortex-A720AE for Software Defined Vehicles
• Arteris Expands Ncore Cache Coherent Interconnect IP To Accelerate Leading-Edge Electronics Designs
• We'll Need Many More Fabs to Meet $1 Trillion by 2030 Goal
• Tenstorrent and MosChip Partner on High Performant RISC-V Design
• Arm's Broadest Ever Automotive Enhanced IP Portfolio Designed for the Future of Computing in Vehicles
• Ecosystem Collaborations Bring Full Stack Software Solutions to Develop Leading-edge Automotive Applications From Day One
• University of Western Australia Latest to Join the BrainChip University AI Accelerator Program
• New accelerated modeling for automotive development is here

Monday, March 11, 2024

• Agile Analog delivers first full always-on IP subsystem
• Tiempo Secure's TESIC RISC-V IP Secure Element successfully characterized on GlobalFoundries' 22FDX technology node
• Andes Technology: Cultivating Academic Collaboration for Over a Decade with Sustainable Spirit
• Global Top 10 Foundries Q4 Revenue Up 7.9%, Annual Total Hits US$111.54 Billion in 2023, Says TrendForce
• The Imminent Arrival of 2-Nanometer Advanced Process
• Cold Spin-Electronics for Quantum Technologies
• Pasqal aims for 10,000 qbit quantum computer in 2026
• University of Western Australia Latest to Join the BrainChip University AI Accelerator Program
• TI Commits to 100% Renewable Energy Worldwide by 2030

Monday, March 11, 2024

• Omni Design Technologies Offers Swiftâ„¢ Data Converters for Advanced Software Defined Radio (SDR) Solutions

Sunday, March 10, 2024

• OPENEDGES and SEMIFIVE Partnership Reinforce the SoC Platform
• Re-imagining Imagination Technologies
• Alphawave Semi Demonstrates 3nm Silicon-Proven 24Gbps Universal Chiplet Express (UCIe) Subsystem for High-Performance AI Infrastructure
• Omni Design Technologies Offers Swift™ Data Converters for Advanced Software Defined Radio (SDR) Solutions
• Elevate the performance of your Automotive Application by integrating the IP cores of a 14-bit wideband Time-Interleaved Pipeline Data Converters
• Free configurator puts the power of full core customisation into hands of customers
• Former Moortec executives create chip monitor startup

Thursday, March 7, 2024

• CAST Adds I3C Secondary Controller Core to MIPI IP Product Line
• Credo Launches 112G PAM4 SerDes IP for TSMC N3 Process Technology
• M31's Revenue Grew Against the Trend by 18.5% Last Year and Will Increase Investment in Advanced Processes This Year
• TSMC February 2024 Revenue Report

Wednesday, March 6, 2024

• SignatureIP announces PCIe Gen 6 Controller IP
• sureCore announces ultra-low power memory IP for AI applications
• Marvell Announces Industry's First 2nm Platform for Accelerated Infrastructure Silicon
• nepes corporation expands IC packaging capabilities for the 3D-IC era with advanced design flows from Siemens
• Samsung to use recycled neon gas in chip manufacturing

Tuesday, March 5, 2024

• UMC Reports Sales for February 2024
• Taalas emerges from stealth with $50 million in funding and a groundbreaking silicon AI technology
• Nuclei System Technology collaborates with Siemens to deliver RISC-V Processor Trace Encoder solution
• Imsys develops RISC-V core, looks to AI in space
• JEDEC Publishes GDDR7 Graphics Memory Standard
• Ethernovia Unveils World's First Single and Quad Port, 10G to 1G Automotive PHY in 7nm
• Flex Logix Joins Intel Foundry USMAG Alliance
• Industry Leading PPA DSP Available For All Existing EFLX eFPGA
• GUC Monthly Sales Report - February 2024
• Cadence to Acquire BETA CAE, Expanding into Structural Analysis
• Niobium and Veriest collaborate to develop the world's fastest complete FHE accelerator chip
• BrainChip Adds Edge Box to Chip and IP Offerings
• Synopsys Supports AI-Bogged Data Centers With First 1.6T Ethernet IP
• Revolutionizing Fuel Cell Production: Fraunhofer IPA and Partners Launch H2FastCell Robotics
• QuickLogic (QUIK) Secures Five-year Contract for Its eFPGA IP