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Wednesday, March 19, 2014

• Magillem to commercialize STMicroelectronics TLM modelling environment and methodology

Tuesday, March 18, 2014

• intoPIX Demonstrates First TICO Lightweight Compression Technology Running on FPGA Hardware at NAB 2014

Tuesday, March 18, 2014

• Why Intel Shouldn't Build an ARM Chip

Tuesday, March 18, 2014

• IoT Creates New IP Requirements

Tuesday, March 18, 2014

• Big sell: IP Trends and Strategies

Monday, March 17, 2014

• Cadence Incisive Specman Elite Testbench Reduces Verification Time for Sharp by 50 Percent

Monday, March 17, 2014

• Aquantia Completes $16M Series G Financing

Monday, March 17, 2014

• Khronos Releases OpenGL ES 3.1 Specification

Monday, March 17, 2014

• Cadence and GLOBALFOUNDRIES Announce First Test Chip Featuring ARM Cortex-A12 Processor in 28nm-SLP Process

Monday, March 17, 2014

• Embedded System Demand Could Reach Almost 19m Units by 2020 says Strategy Analytics

Monday, March 17, 2014

• SEMI Reports 2013 Global Semiconductor Equipment Sales of $31.6 Billion

Monday, March 17, 2014

• Cadence Physical Verification System Certified for GLOBALFOUNDRIES 65nm to 14nm FinFET Processes

Monday, March 17, 2014

• New Xilinx Reference Designs Equip Customers with Industry's Only Single-Chip Solution for 4x100G OTN Transponders and 2x100G OTN Switching Applications

Monday, March 17, 2014

• Altera Introduces OTN Solutions for 400G and Beyond at OFC 2014

Monday, March 17, 2014

• Cadence Expands ARM-based System Verification Solution, Reducing Time-to-Market for Mobile, Networking and Server Applications

Friday, March 14, 2014

• Synopsys Announces STMicroelectronics' Adoption of IC Compiler for CPU and GPU Implementation

Friday, March 14, 2014

• Leti Demonstrates Ultra-scaled Self-aligned Split-gate Memory Cell With 16nm Gate Length

Friday, March 14, 2014

• Creonic to Deliver IP Cores for the New DVB-S2X Standard

Friday, March 14, 2014

• Barco Silex Part of Major VSF J2K Interop Event

Friday, March 14, 2014

• Will Googles of the World Be Cadence's Best Bet?

Friday, March 14, 2014

• Mikron Licenses Cadence Physical Verification System and QRC Extraction Solutions for 90 nm IC Design Flow

Thursday, March 13, 2014

• IC Market for Total Personal Computing Systems to Jump 6% in 2014

Thursday, March 13, 2014

• Dolphin Integration reveals the first audio converter IP with voice detection feature for home appliance electronics

Thursday, March 13, 2014

• Mobiveil's UNEX NVM Express IP Passes University of New Hampshire InterOperability Laboratory (UNH-IOL) Testing

Wednesday, March 12, 2014

• TSMC Updates 1Q'14 Guidance

Wednesday, March 12, 2014

• MoSys Demonstrates 15.625G Bandwidth Engine SerDes Interoperability with Xilinx's Kintex UltraScale FPGA at OFC 2014

Monday, March 10, 2014

• ASIC Design Start Market Expected to Grow 7.1% in 2014, Says Semico Research

Monday, March 10, 2014

• Apple Design Wins Lift Bosch to Top of MEMS Ranking

Monday, March 10, 2014

• Xilinx Announces Availability of Industry's First High Performance DDR4 Memory Solution

Monday, March 10, 2014

• Renesas Maintains Position as Leading Vendor of OE Automotive Semiconductors, but Infineon Closes Owing to Weakened Yen

Monday, March 10, 2014

• TSMC February 2014 Revenue Report

Monday, March 10, 2014

• UMC Reports Sales for February 2014

Friday, March 7, 2014

• Digital Core Design unveils 32bit CPU during CeBIT 2014

Friday, March 7, 2014

• Chips&Media releases CFrame10, its new hardware design for frame buffer compression

Friday, March 7, 2014

• Samsung Proliferates the Internet of Things with the Addition of RF Capabilities to its 28nm Process Technology for Foundry Customers

Friday, March 7, 2014

• EDA Hungers For Growth

Friday, March 7, 2014

• 10 IC Product Segments to Exceed Total IC Market Growth in 2014