Search News

Wednesday, February 19, 2014

• Cadence Launches Next-Generation Tensilica High-Performance ConnX Baseband DSP Family

Wednesday, February 19, 2014

• Rubidium Speech Processing Solutions Now Available for Cadence Tensilica HiFi Audio/Voice DSPs

Wednesday, February 19, 2014

• Cadence and Sensory Reduce Voice Activation Power Dissipation in Mobile Devices to Less than 17 MicroWatts

Wednesday, February 19, 2014

• NGCodec Licenses H.265/HEVC Encoder IP core to Leading Fabless Semiconductor Company

Wednesday, February 19, 2014

• Renesas Electronics Develops Industry's First 28nm Embedded Flash Memory Technology for Microcontrollers

Wednesday, February 19, 2014

• Arteris Announces Freescale's License of Multiple FlexNoC Fabric IP Instances for QorIQ Systems-on-Chip

Wednesday, February 19, 2014

• GPU market up - Intel and Nvidia graphics winners in Q4, AMD down

Wednesday, February 19, 2014

• INSIDE Secure launches a unique and comprehensive mobile security offer

Wednesday, February 19, 2014

• OneSpin Solutions Introduces Unique, Formal-Based Observation Coverage Solution to Magnify Verification Closure Precision

Wednesday, February 19, 2014

• Cadence Completes Acquisition of Forte Design Systems

Wednesday, February 19, 2014

• Altera Announces 5 Gbps Microwave Backhaul Solution to Maximize Throughput Capacity and Spectrum Efficiency of 4G Networks

Tuesday, February 18, 2014

• videantis showcases unified video/vision processor solution at Mobile World Congress

Tuesday, February 18, 2014

• World's First 802.11ah IP Introduced by Antcor

Tuesday, February 18, 2014

• Arteris Recruits World-Class Engineering Leadership Team

Tuesday, February 18, 2014

• Big blues at IBM India

Tuesday, February 18, 2014

• Z3 Technology Announces 4K H.264 Video Encoder with Release of Z3-DM8169-4K-RPS System

Tuesday, February 18, 2014

• M31 Technology USA is established

Tuesday, February 18, 2014

• Xilinx Announces 1.6Gbps Low Power, Low Cost, Small Cell Backhaul Modem SmartCORE IP for Millimeter Wave Applications

Tuesday, February 18, 2014

• Xilinx Smarter Radio Solutions Address Performance Needs of Next-Generation LTE and MultiCarrier-GSM Platforms

Tuesday, February 18, 2014

• CYIT Licenses CEVA-TeakLite-4 Audio/Voice DSP for Mobile SoCs

Tuesday, February 18, 2014

• STMicroelectronics Reveals Affordable, Extensible Platform for Efficient Prototyping with STM32 Microcontrollers

Tuesday, February 18, 2014

• Apical and NGCodec Announce H.265/HEVC Encoder with Region Of Interest Optimization via Object Tracking

Tuesday, February 18, 2014

• Semiconductor Unit Shipments To Exceed One Trillion Devices in 2016

Tuesday, February 18, 2014

• Alizem releases its new Embedded Motor Control Software IP for Critical Applications

Tuesday, February 18, 2014

• M31 Technology Announces its USB 3.0 PHY Completed TSMC IP Validation

Monday, February 17, 2014

• Xylon Expands Portfolio with the Face Detection and Tracking Computer Vision Technology

Monday, February 17, 2014

• End of Startup Era: Chips Face Innovation Gap

Monday, February 17, 2014

• 28nm Powers TSMC Forward

Monday, February 17, 2014

• Are Processors Running Out Of Steam?

Monday, February 17, 2014

• SMIC Reports 2013 Fourth Quarter Results

Monday, February 17, 2014

• IBM invests in new $5bn chip fab in India, so is chip sale off?

Monday, February 17, 2014

• PathPartner Technology Announces HEVC (H.265) Decoder on ARM Cortex-A Family Processors

Monday, February 17, 2014

• How Small Will Apple Inc. Go?

Friday, February 14, 2014

• Leti and STMicroelectronics Demonstrate Order-of-Magnitude-Faster FD-SOI Ultra-Wide-Voltage Range DSP

Friday, February 14, 2014

• Tabula Announces Availability of Stylus Compiler Version 2.8.2

Friday, February 14, 2014

• CEVA and Sensory Enable Power-Optimized Always-Listening Smart Wearables and Sensor Fusion Solutions via TrulyHandsfree 3.0 for CEVA-TeakLite-4 DSPs

Friday, February 14, 2014

• CEVA and Visidon Partner to Bring Ultra-low Power Always-on Face Activation Technology to Mobile Devices

Thursday, February 13, 2014

• Cadence Tensilica HiFi Audio Tunneling for Android Cuts Audio Processing Power by Up to 14X

Thursday, February 13, 2014

• Google Ramps Up Chip Design

Thursday, February 13, 2014

• CEVA to Showcase a Range of Solutions for the Future of Mobile Computing at Mobile World Congress 2014

Thursday, February 13, 2014

• Arteris Featured in World Economic Forum Entrepreneurship Report

Thursday, February 13, 2014

• Sital Delivers Mil-Std-1553 IP core with Multi-RT and Error Injection Capabilities

Thursday, February 13, 2014

• Xilinx Celebrates 30 Years, 3500 Patents, and 60 Industry Firsts

Thursday, February 13, 2014

• Cadence Acquires High Speed Interface IP Assets of TranSwitch Corporation, Further Expanding IP Portfolio for Mobile/Consumer Market

Wednesday, February 12, 2014

• Microsoft Employs Cadence Tensilica Processors in Xbox One

Wednesday, February 12, 2014

• Synopsys, Realtek and UMC Collaborate on Industry's First Single-Chip Ultra High Definition Smart TV SoC

Wednesday, February 12, 2014

• Intel to Cut A Deal with Apple for Fab 42?

Wednesday, February 12, 2014

• oViCs names Jess Herrera as Vice President of Worldwide Sales & Marketing

Wednesday, February 12, 2014

• ISSCC Keynote: No Silicon, Software Silos

Wednesday, February 12, 2014

• Ace Thought Announces the Release of H.265/HEVC Video Decoder Software for ARM and x86 Processors

Tuesday, February 11, 2014

• Allegro DVT unveils its hardware HEVC/H.265 Encoder IP

Tuesday, February 11, 2014

• 3iLogic-Designs Introduces SimSim, Embedded Speech Recognition IP Core, Enabling Voice-Activated User Interfaces for a Range of Consumer Devices

Tuesday, February 11, 2014

• MediaTek Announces MT6595, World’s First 4G LTE Octa-Core Smartphone SOC with ARM Cortex-A17 and Ultra HD H.265 Codec Support

Tuesday, February 11, 2014

• Sonics Receives New Patent For Intelligent Power Controller

Tuesday, February 11, 2014

• Synopsys and Alango Technologies Deliver Voice Communication Package for DesignWare ARC Audio Processors

Tuesday, February 11, 2014

• Microsemi Enables FPGA-Based Root-of-Trust Solution for Embedded Systems with Introduction of Secure Boot Reference Design

Tuesday, February 11, 2014

• Xilinx and Xylon Announce logiADAK Automotive Driver Assistance Kit Enabling Systems with up to Six Cameras

Tuesday, February 11, 2014

• IBM Chip Unit Sale Would Send Tremor Through Industry

Tuesday, February 11, 2014

• Silicon Wafer Revenues Decline in 2013

Tuesday, February 11, 2014

• ARM Enhances IP Suite for 2015 Mid-Range Mobile and Consumer Markets

Tuesday, February 11, 2014

• TSMC January 2014 Revenue Report

Monday, February 10, 2014

• Sonics Joins EDA Consortium

Monday, February 10, 2014

• ARM and SMIC Broaden IP Partnership with 28nm Process for Mobile and Consumer Applications

Monday, February 10, 2014

• Gigabit wireless firm Blu Wireless awarded 1m Pounds from the West of England Growth Fund

Monday, February 10, 2014

• Dolphin Integration announces the availability of the new generation of SpRAM generator at 90 nm and 55 nm eFlash

Monday, February 10, 2014

• eMemory Expands NeoFlash's Industrial Applications

Monday, February 10, 2014

• SilabTech awarded the most promising startup in the Indian Hardware Manufacturing sector

Monday, February 10, 2014

• UMC Reports Sales for January 2014

Saturday, February 8, 2014

• Synopsys Acquires Target Compiler Technologies

Friday, February 7, 2014

• GUC Monthly Sales Report - January 2014