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Wednesday, January 22, 2014

• Intel vs. TSMC: An Update

Wednesday, January 22, 2014

• Samsung's 28nm HKMG Inside Apple's A7

Wednesday, January 22, 2014

• Dual-interface Financial IC Card Chip Based on SMIC's eEEPROM Platform Gains CC EAL4+ Certification

Wednesday, January 22, 2014

• First CAN FD Bus Controller IP Core for ASICs & FPGAs Available Now from CAST

Wednesday, January 22, 2014

• Xilinx Announces 2014 Fiscal Q3 Results; 28nm Sales Reach $100 Million

Tuesday, January 21, 2014

• Xilinx Tapes-out First Virtex UltraScale All Programmable Device as Part of Industry's Only High-End 20nm Family

Tuesday, January 21, 2014

• TSMC Tweaks 16nm FinFET to Match Intel

Tuesday, January 21, 2014

• Silicon360 Acquires IDT ADC & DAC Products from IDT/NXP

Monday, January 20, 2014

• Dolphin Integration announces groundbreaking regulators for multi-mode optimization of consumption

Monday, January 20, 2014

• Intel used ARM chips in wearables demos at CES

Monday, January 20, 2014

• Intel does ARM: Citi 'identifies' another possible customer

Monday, January 20, 2014

• Creonic Selected for German Silicon Valley Accelerator

Friday, January 17, 2014

• Why ARM has the upper hand over Intel: analysts

Friday, January 17, 2014

• Xylon announces new version of the Bayer Sensor Decoder IP core

Friday, January 17, 2014

• Silicon Turnkey Solutions Completes Asset Acquisition of Bay Area EMS (BAEMS)

Friday, January 17, 2014

• MPEG LA Announces License Terms for High Efficiency Video Coding (HEVC/H.265)

Thursday, January 16, 2014

• Carmel Ventures and Ericsson Invest in Adapteva

Thursday, January 16, 2014

• Which IP Is Better?

Thursday, January 16, 2014

• Arteris Announces FlexNoC Composition Features, Improving Design Flows and Cutting Design Time in Half

Thursday, January 16, 2014

• oViCs Introduces 4Kp120 HEVC/H.265 Decoder

Thursday, January 16, 2014

• Hot trends at CES 2014 reflect Imagination’s technology vision

Thursday, January 16, 2014

• Arira Design Announces Availability of its Hybrid Memory Cube Evaluation & Development Board

Thursday, January 16, 2014

• INSIDE Secure achieves new level of security for enterprise applications in smartphones

Thursday, January 16, 2014

• Exar Acquires Stretch Incorporated

Thursday, January 16, 2014

• Apple's Custom Graphics Chip Coming Soon?

Thursday, January 16, 2014

• TSMC Reports Fourth Quarter EPS of NT$1.73

Wednesday, January 15, 2014

• Semtech's PCI Express 3.0 PHY IP Platform is Fully Compliant and Included on PCI-SIG Integrators List

Wednesday, January 15, 2014

• Xilinx Zynq-7000 All Programmable SoCs Enable Wuhan Maxsine's EP3E Servo Drive

Wednesday, January 15, 2014

• EDA Consortium Reports Revenue Increase for Q3 2013

Wednesday, January 15, 2014

• TSMC preps Apple's next finger-print sensor, says report

Wednesday, January 15, 2014

• Microprocessor Sales Growth Will Strengthen Slightly in 2014

Wednesday, January 15, 2014

• Server Market Faces Disruption in 2014

Wednesday, January 15, 2014

• Is Apple Building Its Own Wireless Chips?

Tuesday, January 14, 2014

• SuVolta Raises $10.6 Million in Corporate and Venture Funding

Tuesday, January 14, 2014

• Cadence C-to-Silicon Compiler Helps Renesas Realize Quick HEVC IP Development

Tuesday, January 14, 2014

• Recore Systems appoints Dirk Logie as CEO

Tuesday, January 14, 2014

• PLDA's XpressRICH3-AXI PCI Express 3.0 IP with AMBA AXI Support Passes PCI-SIG PCIe 3.0 Compliance Testing

Tuesday, January 14, 2014

• eASIC and EnSilica Announce 16-bit and 32-bit Soft Processors for eASIC Nextreme Devices

Tuesday, January 14, 2014

• ARM and UMC Extend 28nm IP Partnership to Target Cost-Effective Mobile and Consumer Applications

Monday, January 13, 2014

• Andes Leads The Industry by Reducing Power Consumption for New Embedded Devices

Monday, January 13, 2014

• CES Mobile Wrap: DSP, GPU, CPU Redefined

Monday, January 13, 2014

• Cadence Incisive 13.2 Platform Sets New Standard for SoC Verification Performance and Productivity

Monday, January 13, 2014

• Memoir Systems Joins TSMC Soft IP Alliance

Monday, January 13, 2014

• Sundance launches SMT166 dual-FPGA development platform; powers EU's FP7 FlexTiles 3D SoC project

Friday, January 10, 2014

• Gartner Says Worldwide PC Shipments Declined 6.9 Percent in Fourth Quarter of 2013

Friday, January 10, 2014

• Avery Design and BaySand Team to Deliver IP Solutions for TeneX Configurable SoC

Friday, January 10, 2014

• SEMI Reports Shift in Semiconductor Capacity and Equipment Spending Trends

Friday, January 10, 2014

• TSMC December 2013 Revenue Report

Friday, January 10, 2014

• MediaTek's Global Ambition Opens Door to CEVA