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Thursday, July 25, 2013

• Xilinx's 10GBASE-KR Solution Passes Full Electrical and Protocol Testing for Backplane Applications

Thursday, July 25, 2013

• Cadence Reports Second Quarter 2013 Financial Results

Thursday, July 25, 2013

• Oasys Announces New Funding Led by Intel Capital, Xilinx and former Cadence CEO Joe Costello

Wednesday, July 24, 2013

• Creonic First FEC IP Core Provider to Receive ISO 9001:2008 Certification

Wednesday, July 24, 2013

• ARM Holdings plc Reports Results For The Second Quarter and Half Year Ended 30 June 2013

Wednesday, July 24, 2013

• CSR Licenses Arteris FlexNoC Interconnect Fabric IP

Wednesday, July 24, 2013

• Imagination's Design Optimisation Kits (DOKs) deliver substantial silicon PPA gains while reducing design cycle times

Wednesday, July 24, 2013

• IP Software Integration Left Out in the Cold

Wednesday, July 24, 2013

• Altera Announces Second Quarter Results

Wednesday, July 24, 2013

• Fab lite, Design lite

Wednesday, July 24, 2013

• Former ARM CEO Joins Micron

Wednesday, July 24, 2013

• Khronos Releases OpenCL 2.0

Wednesday, July 24, 2013

• Foreign IC Companies to Represent 70% of China's IC Production in 2017, Up From 58% in 2012

Tuesday, July 23, 2013

• SuVolta Announces Speed-Power Benefits of Transistor Technology Validated in ARM Processor

Tuesday, July 23, 2013

• Tilera's TILE-Gx72 Processor Sets World Record for Suricata IPS/IDS: Industry's Highest Performance

Tuesday, July 23, 2013

• Nufront and YYG, Both Pacific Rim Companies, Go to Production with Multiple Mixel MIPI Solutions

Tuesday, July 23, 2013

• CEVA Extends SATA/SAS Portfolio With SAS-3 IP

Tuesday, July 23, 2013

• UMC and SuVolta Announce Joint Development of 28nm Low-Power Process Technology

Tuesday, July 23, 2013

• Intel Tips Custom and 14nm Server Chips

Monday, July 22, 2013

• eInfochips Releases Verification IP for OTL (Optical Channel Transport Lane)

Monday, July 22, 2013

• ARM and Oracle Announce Plans to Optimize Java SE For Enterprise and Embedded Markets

Monday, July 22, 2013

• Entropic Switches to ARM Mali for Superior Graphics Performance and Extends ARM Cortex Processor Licenses

Monday, July 22, 2013

• North American Semiconductor Equipment Industry Posts June 2013 Book-to-Bill Ratio of 1.10

Monday, July 22, 2013

• New low-power unified computer vision and video processing solution from videantis

Friday, July 19, 2013

• How ARM's Cortex-A7 Beats the A15

Friday, July 19, 2013

• Allegro DVT improves its HEVC Decoder silicon IP with 10 bit support

Thursday, July 18, 2013

• Intilop delivers their enhanced Dual 10G iNICs with Ultra-low latency TCP and UDP Offload accelerators, benchmarking sub micro second wire-to-host latency and Ultra high data throughput

Thursday, July 18, 2013

• Semtech Announces a New PHY IP Platform from its Snowbush IP Group that Supports JESD204B, CPRI and OBSAI

Thursday, July 18, 2013

• RapidIO Nudges ARM Into Servers

Thursday, July 18, 2013

• TSMC Reports Second Quarter EPS of NT$2.00

Thursday, July 18, 2013

• The ARM Diaries, Part 2: Understanding the Cortex A12

Thursday, July 18, 2013

• Xilinx Announces 2014 Fiscal Q1 Results; Sales Increase 9% Sequentially

Thursday, July 18, 2013

• Cadence Incisive Platform Cuts Fujitsu Semiconductor’s Regression Verification Time By 3X

Wednesday, July 17, 2013

• Noesis Technologies Announces Availability of CVSD Voice Codec

Wednesday, July 17, 2013

• Synopsys Announces Availability of Complete 28-nm Data Converter IP Portfolio

Wednesday, July 17, 2013

• OCP-IP Releases White Paper Profiling EEMBC MultiBench Programs in a 64 Core Machine

Wednesday, July 17, 2013

• M-PCIe - Goin' mobile!

Wednesday, July 17, 2013

• Sequans powers HiveMotion LTE module for M2M devices in Korea

Wednesday, July 17, 2013

• Big Gains Forecast in Quarterly DRAM ASP

Tuesday, July 16, 2013

• MoSys Joins Xilinx Alliance Program Supporting 100G and Beyond Networking Line Cards

Tuesday, July 16, 2013

• Hitachi Accelerates Time to Market for IT Products by Utilizing Cadence Rapid Prototyping Platform

Tuesday, July 16, 2013

• UMC Adopts Cadence Physical and Electrical Design-for-Manufacturing Signoff for 28-Nanometer Node

Tuesday, July 16, 2013

• Xilinx's Zynq-7000 All Programmable SoCs Enable Mobilicom's Advanced Peer-to-Peer Software-Defined Radios

Tuesday, July 16, 2013

• What's inside Google Glass?

Tuesday, July 16, 2013

• Apple, Samsung Reportedly Ink 14-nm Foundry Deal

Monday, July 15, 2013

• Why GlobalFoundries Should Appeal to Apple

Monday, July 15, 2013

• Mentor Graphics Questa Verification Platform Adds Software-Driven Verification for Multi-Core SoC Designs

Monday, July 15, 2013

• Ricoh Selects Cadence Palladium XP Platform for Next-Generation Multifunction Printer SoC Development

Monday, July 15, 2013

• Industry View: Doug Wong of Toshiba on the Future of Memory

Monday, July 15, 2013

• ARM Beats Intel With Revised AnTuTu Benchmark

Monday, July 15, 2013

• GEO Semi GW3300 integrates eWARP core, Tensilica CPU and Apical ISP