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Wednesday, October 2, 2013

• Cadence Receives Three TSMC Partner of the Year Awards for Design IP, 16nm FinFET and 3D-IC Solutions

Wednesday, October 2, 2013

• Synopsys Selected as TSMC's 2013 "Interface IP Partner of the Year" for Fourth Consecutive Year

Tuesday, October 1, 2013

• PLDA announces enhanced SR-IOV support in their XpressRICH3 PCI Express Gen3 IP Solution, providing up to 512 virtual functions on a single PCIe instance

Tuesday, October 1, 2013

• Broadcom Completes Acquisition of LTE-Related Assets from Affiliates of Renesas Electronics Corporation

Tuesday, October 1, 2013

• GEO Deploys Mixel MIPI solution in its Geometric Processing IC for Ultra-Wide Angle Cameras

Tuesday, October 1, 2013

• Latest Synopsys Virtualizer Release Accelerates Creation and Deployment of VDKs for Software Development

Tuesday, October 1, 2013

• New automated online multi-project wafer quote system delivers instant pricing

Tuesday, October 1, 2013

• Analog Bits Announces New Family of Secure IP Subsystems

Tuesday, October 1, 2013

• The Growing Need for On-Chip PVT Die Monitoring Solutions

Tuesday, October 1, 2013

• ARM Servers Aim Higher Despite Currrent Miniscule Market

Monday, September 30, 2013

• Accellera Systems Initiative Enhances IP-XACT Standard with New Vendor Extensions for Analog/Mixed-Signal and Low-Power Designs

Monday, September 30, 2013

• Another negative year for Semiconductor CapEx

Monday, September 30, 2013

• Silicon Image Announces First 4K Ultra HD MHL 3.0 Receiver IC With HDCP 2.2 in Support of Secure Premium Content Transmission

Monday, September 30, 2013

• Altera Completes Latest Upgrade to IP Portfolio Targeting 28 nm Devices

Monday, September 30, 2013

• Imperas Releases the PowerPC 4xx Range of High-Performance Processor Models with Integrated Software Development Environment

Monday, September 30, 2013

• Silicon Vision partners with Mindtree for Bluetooth Low Energy intellectual property solution

Thursday, September 26, 2013

• InterDigital and Panasonic Mobile Communications Expand Patent License to Cover 4G

Thursday, September 26, 2013

• Digital Core Design Introduces 80390 CPU

Thursday, September 26, 2013

• Intilop's enhanced Dual 10G NIC powered by their 76 ns TCP accelerator beats Solarflare 10G NIC delivering 4x higher throughput and 4x lower latency

Thursday, September 26, 2013

• Americas Region Remains Largest Market for Pure-Play Foundry Sales

Thursday, September 26, 2013

• Micron Technology Ships First Samples of Hybrid Memory Cube

Thursday, September 26, 2013

• Fujisoft supports the development of Android-powered embedded devices with the launch of their Graphics Accelerator for Android supporting Altera SoC

Wednesday, September 25, 2013

• Apple Continues Familiar Design and Pricing Strategy with iPhone 5c, IHS Teardown Reveals

Wednesday, September 25, 2013

• Groundbreaking iPhone 5s Carries $199 BOM and Manufacturing Cost, IHS Teardown Reveals

Wednesday, September 25, 2013

• Imagination the Leader in GPU IP, ARM and Vivante Growing Rapidly

Wednesday, September 25, 2013

• Altera Begins Production Shipments of FPGA Industry's Highest Performance SoCs

Wednesday, September 25, 2013

• Undo and ARM Agreement Delivers First Commercial Reversible Linux and Android Application Debugger for ARM Processors

Wednesday, September 25, 2013

• videantis announces low-delay H.264 High 4:4:4 Intra profile video codec IP core

Tuesday, September 24, 2013

• OneSpin Solutions Offers Full Availability of its Cloud Computing System After Successful Beta Program

Tuesday, September 24, 2013

• VESA Refreshes DisplayID Standard to Support Higher Resolutions and Tiled Displays

Tuesday, September 24, 2013

• Micron and Imec Extend Strategic Research Collaboration

Tuesday, September 24, 2013

• Lattice Announces MachXO3 FPGA Family; Most Advanced, Lowest Cost per I/O Programmable Bridging and I/O Expansion Solution

Tuesday, September 24, 2013

• Rambus Expands Agreement with Freescale Semiconductor

Tuesday, September 24, 2013

• Xilinx and Analog Devices Achieve JEDEC JESD204B Interoperability

Tuesday, September 24, 2013

• M31 Announces MIPI M-PHY Passes TSMC IP Validation Center Program

Monday, September 23, 2013

• Synopsys Implementation Solution Included in TSMC 16-nm Reference Flow for FinFET Design

Monday, September 23, 2013

• SMIC Introduces Its Diversifying Embedded Non-Volatile Memory Platform

Monday, September 23, 2013

• SUNY College of Nanoscale Science and Engineering to develop Marcy Nanocenter site for 450mm computer chip manufacturing

Monday, September 23, 2013

• Inside the iPhone 5s

Monday, September 23, 2013

• New Xilinx OTN SmartCORE IP for High Capacity Combined Ethernet and 100G OTN Switching Platforms and Packet-Optical Transport Systems

Monday, September 23, 2013

• Mobile DRAM posts improved revenue in Q2 from dismal first quarter

Friday, September 20, 2013

• Arasan Chip Systems Announces Industry First Universal Flash Storage 2.0 Total IP Solution

Friday, September 20, 2013

• MOSAID Doubles In Size - and Becomes Conversant

Friday, September 20, 2013

• Ambiq Micro Closes $10M Series B Funding Led By Austin Ventures

Friday, September 20, 2013

• TSMC and Cadence Deliver 3D-IC Reference Flow for True 3D Stacking

Friday, September 20, 2013

• Cadence Digital and Custom/Analog Tools Included in TSMC Reference Flows to Enable 16nm FinFET Designs

Friday, September 20, 2013

• North American Semiconductor Equipment Industry Posts August 2013 Book-to-Bill Ratio of 0.98

Thursday, September 19, 2013

• Synopsys Announces Immediate Availability of Broad Portfolio of Interface IP for TSMC's 20SoC Process

Thursday, September 19, 2013

• Microsemi Licenses Secure Semiconductor Design Intellectual Property from Cryptography Research

Thursday, September 19, 2013

• Gartner Says Worldwide Semiconductor Manufacturing Equipment Spending to Decline 8.5 Percent in 2013

Thursday, September 19, 2013

• Vanguard Video Announces Multi-Platform Support for H.265/HEVC

Thursday, September 19, 2013

• Real Intent Unveils Major Enhancements in Ascent XV for Early Functional Verification of Digital Designs