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Friday, April 19, 2013

• Altis Semiconductor Introduces the Next Generation of Embedded CBRAM Technology

Friday, April 19, 2013

• Lattice Semiconductor Reports First Quarter 2013 Results

Friday, April 19, 2013

• Rambus Reports First Quarter Financial Results

Friday, April 19, 2013

• North American Semiconductor Equipment Industry Posts March 2013 Book-to-Bill Ratio of 1.14

Friday, April 19, 2013

• Netronome Secures $19 Million in Series E Financing

Thursday, April 18, 2013

• Dolphin Integration - Semester Growth Rate of 14% Sales Turnover

Thursday, April 18, 2013

• TSMC Reports First Quarter EPS of NT$1.53

Thursday, April 18, 2013

• CEVA Introduces AMF - Android Multimedia Framework for Energy Efficient Multi-Core Systems

Thursday, April 18, 2013

• Arasan Chip Systems Announces the Industry's First SD 4.1 Total IP Solution

Thursday, April 18, 2013

• VP8 support comes to Imagination's popular PowerVR VXE multi-standard video encoder IP

Thursday, April 18, 2013

• Cheap smartphone boom bodes ill for Intel

Thursday, April 18, 2013

• ARM's low end undercut by Andes core

Thursday, April 18, 2013

• Vivante Gets Top Score in YOUi Labs GPU Quality Calibration Suite for Rendering Accuracy

Wednesday, April 17, 2013

• Elliptic Technologies Launches Hardware Enforced End-to-End Protection for Premium Content Sharing with its tVault DTCP+ Compliant Solutions

Wednesday, April 17, 2013

• New Ultra-Efficient Processor Core for Low Power Applications

Wednesday, April 17, 2013

• ARM and Arteris Extend Partnership to Deliver Additional Interconnect Options to SoC Designers

Wednesday, April 17, 2013

• ARM Introduces New License Model For Big.Little Technology to Enable Wider Adoption

Wednesday, April 17, 2013

• Leadcore Technology License CEVA DSP Technologies for Mobile Devices

Tuesday, April 16, 2013

• Arasan Global Support Program Emphasizes Fastest Possible Problem Resolution

Tuesday, April 16, 2013

• Accellera Announces Standard for Tracking Soft Intellectual Property Usage through the Semiconductor Design and Development Process

Tuesday, April 16, 2013

• Flexras Technologies Enhances Wasga Compiler Partitioning Tool, Adds Support for Virtex-7 FPGA-based FPGA Platforms

Tuesday, April 16, 2013

• Systemcom Ltd. and JVD, Inc. Form Working Relationship

Tuesday, April 16, 2013

• Could Intel's new CEO be blast from past?

Tuesday, April 16, 2013

• LSI Introduces Axxia 4500 Family of ARM Technology-based Communication Processors to Accelerate Enterprise and Datacenter Networks

Tuesday, April 16, 2013

• Evatronix Enhances Its MIPI SLIMbus Device IP with New Customization Options

Tuesday, April 16, 2013

• Leadcore Adopts Hantro Video IP

Tuesday, April 16, 2013

• S3 Group is First to Market with 28nm Power Management IP Products

Tuesday, April 16, 2013

• HDL Design House appoints Airics as representative for the Nordic region

Tuesday, April 16, 2013

• TI introduces new Tiva C Series ARM Cortex-M4 microcontrollers (MCUs) for connected applications

Tuesday, April 16, 2013

• Rockchip Leverages Arteris FlexNoC Interconnect IP for Next Generation SoCs

Tuesday, April 16, 2013

• ComplexIQ Partners with Tensilica for Multimedia over Coax (MoCA) Network Interface

Tuesday, April 16, 2013

• Altera and TSMC Collaborate on 55 nm EmbFlash Process

Tuesday, April 16, 2013

• IP Workshop at DAC: "Driving Quality to the Desktop of the DAC Engineer"

Monday, April 15, 2013

• LG Adopts In-Design Physical Verification with IC Compiler and IC Validator after Multiple Successful Tapeouts

Monday, April 15, 2013

• Altera Expands OTN Solution Capabilities with Acquisition of TPACK

Monday, April 15, 2013

• Altera and AppliedMicro will Cooperate on Joint Solutions for High Growth Data Center Market

Monday, April 15, 2013

• Dolphin Integration introduces first successful complete IP offering for Power Metering applications

Monday, April 15, 2013

• Lattice Introduces Image Sensor Extender Reference Design

Monday, April 15, 2013

• Kilopass Continues to Grows Despite Legal Setbacks

Monday, April 15, 2013

• What Imagination must do next

Monday, April 15, 2013

• 5 questions with TSMC founder Morris Chang

Friday, April 12, 2013

• TSMC starts FinFETs in 2013, tries EUV at 10 nm

Friday, April 12, 2013

• Microsemi Achieves NIST Certification on EnforcIT Cryptography IP Cores for FPGA and ASIC Designs

Thursday, April 11, 2013

• BlinkSight and imec announce world's first single-chip indoor GPS solution

Thursday, April 11, 2013

• Sidense Wins: United States Court of Appeals for the Federal Circuit Affirms District Court Decisions

Thursday, April 11, 2013

• New SuperSpeed USB Developments Increase Speed and Power Delivery

Thursday, April 11, 2013

• Multimode "Thin" Baseband Chip Market Grew 892% in 2012

Wednesday, April 10, 2013

• Fourth-Quarter Reprieve Brings Little Relief to Semiconductor Makers in 2012 - but Spurs 2013 Rebound

Wednesday, April 10, 2013

• Altera Demonstrates Industry's First QPI 1.1 FPGA Home Agent for Enhanced Server Capabilities

Wednesday, April 10, 2013

• TSMC March 2013 Sales Report

Wednesday, April 10, 2013

• ARM Announces POP IP for Cortex-A50 Series Processors on TSMC 28nm HPM and 16nm FinFET Processes

Wednesday, April 10, 2013

• IAR Embedded Workbench certified for functional safety development

Wednesday, April 10, 2013

• Analog Bits Surpasses 300 Customers Continuing their growth as the leading provider of mixed-signal IP

Wednesday, April 10, 2013

• UMC Reports Sales for March 2013

Tuesday, April 9, 2013

• Imperas Delivers ARM Cortex-A7 MPCore High-Performance Processor Model with Integrated Software Development Environment

Tuesday, April 9, 2013

• Fujitsu Semiconductor ASIC Design for 2G/3G/4G Baseband Processor in Volume Production with Synopsys 28-nm MIPI M-PHY

Tuesday, April 9, 2013

• SEMI Reports 2012 Global Semiconductor Materials Sales of $47.1 Billion

Tuesday, April 9, 2013

• GUC Monthly Sales Report - March 2013

Tuesday, April 9, 2013

• Inomize Becomes Newest Tensilica Design Center in Israel

Monday, April 8, 2013

• Mentor Graphics Announces the First IP to System, UPF-based Low-power Verification Solution

Monday, April 8, 2013

• Tata Elxsi unveils HEVC Ultra HD (4K) Decoder for Smartphones, Tablets, Set Top Boxes, Gaming consoles and other CE devices

Monday, April 8, 2013

• Cadence and TSMC Strengthen Collaboration on Design Infrastructure for 16nm FinFET Process Technology

Monday, April 8, 2013

• Altera Demonstrates Industry's First 32-Gbps Transceiver with Leading-Edge 20 nm Device

Monday, April 8, 2013

• Xilinx and its Ecosystem Showcase All Programmable and Smarter Vision Systems at NAB 2013

Monday, April 8, 2013

• Xilinx Enables OEMs to Develop Smarter Broadcast Solutions With Availability of its Real-Time Video Engine 2.1

Monday, April 8, 2013

• Barco Silex FPGA design speeds transactions in award-winning Atos Worldline Hardware Security Module (HSM)

Monday, April 8, 2013

• Open-Silicon Extends its TSMC VCA Partnership to Include Israel

Monday, April 8, 2013

• Brite's USB 2.0 OTG PHY Implementation Using SMIC 0.11um Process Receives USB-IF Certification

Monday, April 8, 2013

• intoPIX Launches New Ultra Compact JPEG2000 FPGA IP-cores at NAB2013

Monday, April 8, 2013

• Tata Elxsi unveils H.264 Ultra Low Latency Codecs with 13 ms end to end latency

Monday, April 8, 2013

• Altera Showcases 4K Video Processing and Multichannel Video-over-IP at 2013 NAB Show