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Friday, April 5, 2013

• ARM and Cadence Partner to Implement Industry's First Cortex-A57 64-bit Processor on TSMC 16nm FinFET Process

Thursday, April 4, 2013

• JEDEC Publishes Test Standard For Universal Flash Storage (UFS)

Thursday, April 4, 2013

• More Than One Fourth of Industry Wafer Capacity Dedicated to <40nm Process Geometries

Thursday, April 4, 2013

• Cryptography Research and StarChip sign patent license agreement for DPA countermeasures

Thursday, April 4, 2013

• TSMC expected to begin 20-nm line early

Thursday, April 4, 2013

• Cisco Announces Intent to Acquire Ubiquisys

Thursday, April 4, 2013

• Yoshida in China: Imagination dumps MIPS sales team

Thursday, April 4, 2013

• Spreadtrum Announces Commercial Launch of Dual-Core Smartphone Chipsets for TD-SCDMA and EDGE

Wednesday, April 3, 2013

• Accellera Systems Initiative Launches Working Group to Standardize Interoperability of Multiple Language Verification Environments and Components

Wednesday, April 3, 2013

• Worldwide Semiconductor Revenue Declined 2.6 Percent in 2012, According to Final Results by Gartner

Wednesday, April 3, 2013

• Xilinx Vivado Design Suite Accelerates Time to Integration and System-Level Design to Stay a Generation Ahead

Wednesday, April 3, 2013

• China fabless: Actions Semi targets 'non-Apple market'

Wednesday, April 3, 2013

• Hybrid Memory Cube Consortium Heralds 2013 as Turning Point for High-Performance Memory ICs, Gains Rapid Consensus for Final Specification and Decision to Renew Consortium

Tuesday, April 2, 2013

• Imagination Technologies announces Caustic ray-tracing hardware certification on Lenovo workstations

Tuesday, April 2, 2013

• Ittiam unveils a full HD low latency streaming solution with a glass-to-glass latency of less than 70ms

Tuesday, April 2, 2013

• GLOBALFOUNDRIES Demonstrates 3D TSV Capabilities on 20nm Technology

Tuesday, April 2, 2013

• ARM and TSMC Tape-Out First ARM Cortex-A57 Processor on TSMC's 16nm FinFET Technology

Tuesday, April 2, 2013

• DI2CMS, I2C Master - Slave Bus Interface from Digital Core Design

Tuesday, April 2, 2013

• Yoshida in China: What's Calxeda doing here?

Tuesday, April 2, 2013

• Would the real Apple A5 please stand up?

Tuesday, April 2, 2013

• Global Semiconductor Sales Remain Ahead of 2012 Pace in February

Monday, April 1, 2013

• Sankalp Semiconductor Appoints Samir Patel as CEO

Monday, April 1, 2013

• EDA Consortium Reports Revenue Increase for Q4 2012

Monday, April 1, 2013

• Sidense 1T-OTP NVM Qualified for 150 Degrees C Automotive High-Reliability Requirements on TSMC's BCD Process

Monday, April 1, 2013

• Lenovo to design own chips

Thursday, March 28, 2013

• Next ARM CEO's 10 toughest tasks

Thursday, March 28, 2013

• Elliptic Technologies to Present Embedded Networking Security Solutions at Ethernet Technology Summit 2013

Thursday, March 28, 2013

• Intel and Samsung Forecast to Represent 42% of Semiconductor Capital Spending in 2013

Thursday, March 28, 2013

• Michael Noonen Appointed New Chair of Socle Technology to Expand Advanced Market

Thursday, March 28, 2013

• Pure-Play Foundries and Fabless Suppliers are Star Performers in Top 25 2012 Semiconductor Supplier Ranking

Wednesday, March 27, 2013

• Algo-Logic Systems Launches 2nd Generation Ternary Search Engine (TSE2) Solutions for the new Tabula ABAX2 P-Series of 3PLD

Wednesday, March 27, 2013

• Tabula Sets New Industry Benchmarks with a Suite of 100G Programmable Solutions Based on the Company's ABAX2 P-Series of 3PLDs

Wednesday, March 27, 2013

• 3-D integration takes spotlight at ISPD

Wednesday, March 27, 2013

• Global Consumer Electronics Industry Revenue Fell by 2 percent in 2012

Wednesday, March 27, 2013

• Synopsys bullish despite rising chip complexity

Wednesday, March 27, 2013

• OCP-IP Releases OCP Debug Socket Specification 2.0

Tuesday, March 26, 2013

• Kilopass Appoints Tatsuya Yamazaki Vice President of Business Development Asia-Pacific To Accelerate International Expansion

Tuesday, March 26, 2013

• eSilicon elevates Rob Cadman to vice president of sales, North America and EMEA

Tuesday, March 26, 2013

• Tabula Releases Groundbreaking EDA Technologies in Support of its Suite of High-Performance Packet Processing Solutions

Tuesday, March 26, 2013

• Renesas Electronics Announces R-Car H2, Offering Highest CPU and Graphics Performance for the Automotive Infotainment Market

Monday, March 25, 2013

• Microsemi Integrates Inicore Enhanced Reliability CAN IP into SmartFusion2 SoC FPGA

Monday, March 25, 2013

• INRIA and KALRAY strengthen their scientific collaboration on the MPPA MANYCORE processor and parallel computing

Monday, March 25, 2013

• Sidense Qualifies 1T-OTP Non-Volatile Memory for MagnaChip 180nm Mixed-Signal and HV CMOS Process

Monday, March 25, 2013

• Xilinx Extends Leadership in Avionics with Certifiable, All Programmable Design Solutions and Dedicated Support

Monday, March 25, 2013

• Exar Corporation Acquires Altior Inc. to Provide Additional Growth in Data Compression

Monday, March 25, 2013

• Imagination delivers latest version of leading tools for game development at GDC 2013

Monday, March 25, 2013

• Imagination and TSMC Strengthen Technology Collaboration

Monday, March 25, 2013

• Algotochip Becomes Tensilica Design Center Partner

Monday, March 25, 2013

• Noesis Technologies Announces ComLab Platform, a New Paradigm Towards Communication Systems Hardware Emulation

Monday, March 25, 2013

• MorethanIP Releases the Industry First IP for 100GBase-CR4 and 100GBase-KR4 Applications

Monday, March 25, 2013

• Truechip Partners with Avant Technology to Market Verification IP Products in Asia