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Thursday, April 4, 2024

• It Is Time To Take Intel Seriously As A Chip Foundry
• Semidynamics announces All-In-One AI IP for super powerful, next generation AI chips

Wednesday, April 3, 2024

• Japan Approves $3.9 Billion Subsidy for Rapidus
• Why Schneider Electric Backs AI & Data to Power Net Zero
• New RISC-V microprocessor can run CPU, GPU, and NPU workloads simultaneously
• RED Semiconductor announces VISCâ„¢ licensable high performance processor architecture for RISC-V
• Global Semiconductor Sales Increase 16.3% Year-to-Year in February
• Why have all broadcast powerhouses embraced intoPIX JPEG XS? Unraveling the secret behind industry leaders' unanimous adoption!
• NeuReality Boosts AI Acelerator Utilization With NAPU
• The Crucial Role Of Semiconductors In The Transition Toward A Greener World
• sureCore announces low power memory compiler for 16nm FinFET
• Defacto now part of Arm's Partner Catalog

Tuesday, April 2, 2024

• Chip production TSMC and United Microelectronics shut down after earthquake
• Electronic Waste Rising Five Times Faster than Documented E-waste Recycling: UN
• AI-generated Code: The Fourth Component of Software Development
• Intel and Synopsys Reveal First Heterogeneous Chiplet Design Based on UCIe Does This Chip Hold the Future of the Semiconductor Industry?
• Defacto part of ArmÂ’s Partner Catalog
• Intel Outlines Financial Framework for Foundry Business, Sets Path to Margin Expansion
• Think Silicon to Showcase its Latest Ultra-Low-Power 3D Graphics and AI in One IP Architecture at Embedded World 2024

Monday, April 1, 2024

• Battery passports for greater sustainability
• Microsoft-Funded Quantum Startup Plants Flags in Europe
• Red Semiconductor announces VISC extension to RISC-V
• Hailo Closes New $120 Million Funding Round and Debuts Hailo-10, A New Powerful AI Accelerator Bringing Generative AI to Edge Devices
• NEDO Approves Rapidus' FY2024 Plan and Budget for "Research and Development of 2nm-generation semiconductor integration technology and short TAT manufacturing technology based on Japan-US collaboration"
• Ezurio and Packetcraft Introduce Talking Sensor Rapid Prototyping Kit with Bluetooth Auracast Broadcast Audio Capability
• Proprietary Memories Are a High-Risk Endeavor

Sunday, March 31, 2024

• French backing for Sequans ahead of Embedded World
• Codasip to exhibit CHERI security, HW/SW co-optimization
• Synopsys SNUG: AI driven EDA momentum, new tools for multi-die
• JESD204B & JESD204C Tx-Rx PHY & Controller IP Cores in 28nm are available for immediate licensing with Proven Automotive Compatibility

Thursday, March 28, 2024

• First general-purpose 32-bit RISC-V MCUs with internally developed CPU core
• China's Intel, AMD Ban Helps Local Rivals, Analysts Say

Wednesday, March 27, 2024

• The Sustainability of AI
• STMicroelectronics Shrinks Microcontrollers to 20nm for Competitive Costs
• SEMIFIVE Starts Mass Production of its 14nm AI Inference SoC Platform based Product
• PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
• VeriSilicon's complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification

Tuesday, March 26, 2024

• Bright minds wanted for chip design in Europe
• New fabrication process, a major advance towards quantum computing
• TASKING and Andes Announce FuSa Compliant Compiler Support for Andes RISC-V ASIL Compliant Automotive IP
• Efabless Launches an "AI Wake Up Call" Open-Source Silicon Design Challenge
• SmartSoC Solutions Joins TSMC Design Center Alliance to Boost Semiconductor Innovation in India
• Efinix Rolls Out Line of FPGAs to Accelerate and Adapt Automotive Designs and Applications
• T2M IP Unveils Cutting-Edge HDMI 2.0 Tx PHY & Controller IP Cores are available for immediate licensing for your advanced diverse applications

Tuesday, March 26, 2024

• Alphawave Semi and InnoLight Collaborate to Demonstrate Low Latency Linear Pluggable Optics with PCIe 6.0® Subsystem Solution for High-Performance AI Infrastructure at OFC 2024

Monday, March 25, 2024

• TSMC's 3nm node will reportedly account for over 20% of its revenue in 2024, as Apple, AMD, and Intel adopt the technology
• Credo and Wistron to Demonstrate 800G Linear Receive Optics with 51.2Tbs Switch Platform at OFC 2024
• Samsung Demonstrates New CXL Capabilities and Introduces New Memory Module for Scalable, Composable Disaggregated Infrastructure at Memcon 2024
• ZeroPoint Technologies Signs Global Customer to Bring Hardware-Accelerated Compression to Hyperscale Data Centers
• Achronix FPGAs Add Support for Bluespec's Linux-capable RISC-V Soft Processors to Enable Scalable Processing
• Intel and Arm Team Up to Power Startups
• Renesas Introduces Industry's First General-Purpose 32-bit RISC-V MCUs with Internally Developed CPU Core
• Qualitas Semiconductor and Ambarella Sign Licensing Agreement
• Faraday Partnered with SONIX to Create a New Product Featuring Its SONOS eFlash Solution
• Alphawave Semi and InnoLight Collaborate to Demonstrate Low Latency Linear Pluggable Optics with PCIe 6.0® Subsystem Solution for High-Performance AI Infrastructure at OFC 2024
• Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips