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Friday, March 8, 2013

• Google and MPEG LA Announce Agreement Covering VP8 Video Format

Friday, March 8, 2013

• Cadence Announces First Commercially Available Design IP and Verification IP for Mobile PCI Express

Friday, March 8, 2013

• Digital Core Design Announces DuART, tiny UART IP Core

Friday, March 8, 2013

• TSMC February 2013 Sales Report

Thursday, March 7, 2013

• Moortec Semiconductor Announce Technology for Robust 4G LTE Mobile Communications

Thursday, March 7, 2013

• January DRAM, NAND Flash Sales Point to Promising Year

Thursday, March 7, 2013

• Imagination reports enthusiastic response to latest PowerVR Series6 GPUs and MIPS CPUs at MWC 2013

Thursday, March 7, 2013

• Renesas Electronics Develops and Supplies Multi-Format Video Codec Hardware IP that Supports Low-Delay Processing

Thursday, March 7, 2013

• Design & Reuse's IP Management Enterprise Platform adds IP-centric revision control front end for targeting IP under development

Wednesday, March 6, 2013

• How Conexant ended up filing for Chapter 11

Wednesday, March 6, 2013

• GUC Monthly Sales Report - February 2013

Wednesday, March 6, 2013

• Chips&Media Partners Ship Over 120 Million Video Devices To-Date

Wednesday, March 6, 2013

• Fab Equipment Spending: Flat in 2013; Up 24% in 2014

Wednesday, March 6, 2013

• Jasper Signs Up Cavium for its Next Generation Modeling App

Wednesday, March 6, 2013

• eMemory's eNVM SIPs Reach 5 Million Wafer Production Record

Wednesday, March 6, 2013

• CHIPIDEA extends its 90nm CMOS portfolio with a Low Power and Very Compact 1GHz ADC for Blu-ray and UWB systems

Tuesday, March 5, 2013

• Evatronix Joins the Series of Live Workshops on MIPI SLIMbus organized by LnK

Tuesday, March 5, 2013

• Kilopass Receives $8 Million Funding to Expand Technology Roadmap

Tuesday, March 5, 2013

• Dongbu HiTek and Cortus to develop joint Platform Solution for the Microcontroller (MCU) Market

Tuesday, March 5, 2013

• ARM Launches Keil MDK-ARM Version 5

Monday, March 4, 2013

• Xilinx Solutions Target Growing ASIC and ASSP Gaps for Next-Generation Smarter Networks and Data Centers

Monday, March 4, 2013

• Global Semiconductor Sales Increase in January Year-over-Year

Monday, March 4, 2013

• Atmel Expands Third-Party Ecosystem of Tools and Software Partners for Recently Launched ARM Cortex-A5 Processor-based Family

Monday, March 4, 2013

• Dolphin Integration announces the availability of the new generation of Foundry Sponsored SpRAM generator at 55 nm

Monday, March 4, 2013

• MegaChips Completes Design Center Agreement with Tensilica to Enhance R&D and Expand Marketing Collaboration

Monday, March 4, 2013

• Spansion and UMC Announce Joint Technology Development and Licensing Agreement

Monday, March 4, 2013

• Recore Educational Webinar, March 14: Why use the Xentium DSP IP core ?

Friday, March 1, 2013

• Mobiveil announces the availability of Freescale P3041 AMC board for embedded and networking applications

Friday, March 1, 2013

• Avant Technology Inc to represent Recore Systems' IP products in Asia

Friday, March 1, 2013

• ARM announces mbed version 2.0 and releases open source SDK and development board HDK

Friday, March 1, 2013

• ARM Mali GPUs Submitted for OpenGL ES 3.0 Conformance

Thursday, February 28, 2013

• Dreamchip Electronics Announces Plan for India's Own Processor Based Tablet SoC

Thursday, February 28, 2013

• Methodics Unveils Industry First Complete Verification Management System for Analog Design

Thursday, February 28, 2013

• Freescale eyes ARM server play

Thursday, February 28, 2013

• Arasan Announces eMMC 5.0 Total IP Solution at Mobile World Congress

Thursday, February 28, 2013

• Violin Memory Selects eASIC for Flash Memory Arrays

Thursday, February 28, 2013

• PLDA and ReFLEX CES announce new line of System-on-Module (SoM) products, combining the ease of programming of a CPU with the configurability of an FPGA

Wednesday, February 27, 2013

• Cryptography Research Signs License Agreement with EchoStar for CryptoFirewall Security Technology to Combat Piracy

Wednesday, February 27, 2013

• GainSpan Unveils Industry First Wi-Fi and ZigBee IP Single Chip

Wednesday, February 27, 2013

• VLSI Plus offers Multiple Video Source MIPI CSI2 Transmitter IP core

Wednesday, February 27, 2013

• Freescale Introduces Kinetis KL02, World's Smallest ARM Powered Microcontroller

Wednesday, February 27, 2013

• Freescale and ARM Extend Relationship with Cortex-A50 Processor License for Future i.MX and QorIQ Products

Wednesday, February 27, 2013

• PCI-SIG and MIPI Alliance Announce Mobile PCIe (M-PCIe) Specification

Wednesday, February 27, 2013

• MIPI Alliance Boosts Specifications for Camera and Transport Layers in Mobile Device Applications

Wednesday, February 27, 2013

• Silicon Image Announces New 60GHz WirelessHD RF Receiver for HD Displays

Wednesday, February 27, 2013

• AM3D Audio Enhancement Ported to Tensilica's HiFi Audio DSPs

Tuesday, February 26, 2013

• CEVA DSPs Continue to Lead the Way at Mobile World Congress

Tuesday, February 26, 2013

• ZTE and Imagination Technologies announce availability of VoLTE on commercial handsets

Tuesday, February 26, 2013

• Adoption of ARM big.Little Technology Accelerates

Tuesday, February 26, 2013

• Nextchip selects Cortus APS5 for Automotive and Security Applications

Tuesday, February 26, 2013

• videantis Announces Completion of New Financing Round

Tuesday, February 26, 2013

• OneSpin Solutions, Oasys Design Systems Ink OEM Agreement

Tuesday, February 26, 2013

• Socle Technology Now Offers Arteris FlexNoC Platform

Tuesday, February 26, 2013

• Altera and TSMC Continue Long-Term Partnership

Tuesday, February 26, 2013

• Altera to Build Next-Generation, High-Performance FPGAs on Intel's 14 nm Tri-Gate Technology

Monday, February 25, 2013

• Arasan Chip Systems Reaffirms Commitment to MIPI Alliance at the Mobile World Congress

Monday, February 25, 2013

• Marvell Selects Cryptography Research's CryptoFirewall Anti-Counterfeiting Technology for Use in Consumable Security Chip

Monday, February 25, 2013

• MagnaChip Selects Synopsys' Proteus LRC for Lithography Verification

Monday, February 25, 2013

• VESA Introduces Updated Dual-Mode Standard for Higher Resolution Interoperability with HDMI Displays

Monday, February 25, 2013

• MIPI® Alliance and VESA® Announce Liaison to Collaborate on Data Compression Schemes for Mobile Display Applications

Monday, February 25, 2013

• Expectations set by mobile devices are driving other consumer categories to "get smart", says Imagination

Monday, February 25, 2013

• PowerVR G6100 Series6 "Rogue" core enables mass-market OpenGL ES3.0

Monday, February 25, 2013

• Imagination joins Open Handset Alliance

Monday, February 25, 2013

• CSR Licenses aptX Low Latency Codec to Mad Catz for New Family of Bluetooth Wireless Gaming Headsets

Monday, February 25, 2013

• Rambus Unveils Binary Pixel Technology that Dramatically Improves Photo Quality in Mobile Devices

Monday, February 25, 2013

• LTE and LTE advanced baseband processing get performance boost from MIPS multi-threaded cores

Monday, February 25, 2013

• Power efficiency is now the dominant factor in mobile design says Imagination

Monday, February 25, 2013

• MIPS processor cores power Ceragon Networks' next generation multi-core packet radio

Monday, February 25, 2013

• Global Businesses Select ARM Mali GPU Technology

Monday, February 25, 2013

• Xilinx Announces Full Production of its Entire Zynq-7000 All Programmable SoC Family

Monday, February 25, 2013

• Altera Introduces FPGA-Based HSR/PRP Reference Design Targeting Smart Grid Automation Equipment

Monday, February 25, 2013

• ASOCS and CMCC team up to deliver mass market high capacity, commercially viable C-RAN solutions

Monday, February 25, 2013

• DSP Group License CEVA Audio DSP for HDClear Voice Enhancement Solution

Monday, February 25, 2013

• Silicon Image MHL Technology Featured on New MediaTek Quad-Core Mobile Computing Reference Platform

Monday, February 25, 2013

• Sequans introduces LTE-Advanced Chip

Monday, February 25, 2013

• Imec and Target present multi-standard low-power LDPC engine for multi-Gbps wireless communication

Monday, February 25, 2013

• Tensilica and Sensory Drive Industry's Lowest Power DSP-Based Voice Activation Solution

Monday, February 25, 2013

• Tensilica and Huawei Expand Strategic Relationship for Next-Generation Products