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Friday, February 22, 2013

• ST-Ericsson brings PC speeds to mobile devices: First 3GHz smartphone prototype demo at Mobile World Congress

Friday, February 22, 2013

• North American Semiconductor Equipment Industry Posts January 2013 Book-to-Bill Ratio of 1.14

Friday, February 22, 2013

• Xilinx and TEKTELIC Reduce Cellular Radio Infrastructure Development Time with Scalable IP and High Performance Transceiver

Friday, February 22, 2013

• ARM and Synopsys Collaborate to Optimize ARM Mali GPU 20nm Implementation

Thursday, February 21, 2013

• IDT Announces Data Compression IP Offering Industry's Highest Performance for 3G and 4G Wireless Infrastructure Applications

Thursday, February 21, 2013

• Xylon Announces the Multi-Featured ADAS Kit for Vision-Based Driver Assistance

Thursday, February 21, 2013

• Allegro DVT showcases its HEVC/H.265 Video Decoder IP at Mobile World Congress 2013

Thursday, February 21, 2013

• Dialog Semiconductor delivers critical system power management for tablets based on the next generation Intel Atom processors

Thursday, February 21, 2013

• 1.9nJ/b Ultra-low power 2.4GHz multi-standard radio compliant to Bluetooth Low Energy and ZigBee

Thursday, February 21, 2013

• Ultra-low power processor operates at near-threshold voltage

Thursday, February 21, 2013

• LTE, quad-core apps processor wars begin

Thursday, February 21, 2013

• HIMA Licenses ColdFire V4 Technology from IPextreme

Thursday, February 21, 2013

• Mentor Graphics Expands Automotive Linux Infotainment Business

Thursday, February 21, 2013

• IAR Systems supports the XMC1000 low-price ARM Cortex-M0 microcontrollers from Infineon

Thursday, February 21, 2013

• Samsung Electronics Joins OSPT Alliance Board

Thursday, February 21, 2013

• Inside Secure Demonstrates End-To-End Security for Next-Generation Home Energy Gateways

Thursday, February 21, 2013

• Qualcomm and Samsung Dominate the LTE cellphone Modem Market but Tiny GCT Semiconductor, Renesas Mobile and Nvidia are New Players

Thursday, February 21, 2013

• Baidu taps Marvell for ARM storage server SoC

Thursday, February 21, 2013

• Synopsys Posts Financial Results for First Quarter Fiscal Year 2013

Thursday, February 21, 2013

• Xilinx Demonstrates 10 Leading Applications Showcasing ARM Processor-based Zynq-7000 All Programmable SoCs at Embedded World 2013

Thursday, February 21, 2013

• SimpLight Achieves First LTE Modem Silicon Success Using Tensilica's Complete ATLAS Reference Platform

Thursday, February 21, 2013

• Tensilica to Showcase Complete IP Solutions for Video, Imaging, Audio, Voice, DTV Demodulation and Baseband Communications at Mobile World Congress 2013

Thursday, February 21, 2013

• Lattice Semiconductor Names Mark Wadlington Corporate Vice President of World Wide Sales

Wednesday, February 20, 2013

• Elliptic Technologies to Exhibit Embedded Silicon Security Solutions Devoted to Content Protection and Networking Applications at RSA Conference 2013

Wednesday, February 20, 2013

• Achronix Now Shipping 22nm Speedster22i FPGAs to Customers

Wednesday, February 20, 2013

• Xilinx Launches Fully Adaptive Gbps Class Point-to-Point Microwave Modem IP for Backhaul Applications

Wednesday, February 20, 2013

• Imagination achieves OpenGL ES 3.0 conformance for PowerVR Series6 cores

Wednesday, February 20, 2013

• Reflex CES Demonstrates SoC FPGA-Based System-on-Module at Embedded World 2013; Highlights Prototyping Platform, Recorders, Customizable Rugged Systems

Wednesday, February 20, 2013

• Five IC Suppliers to Hold One-Third of 300mm Wafer Capacity in 2013

Wednesday, February 20, 2013

• Tensilica to Demonstrate Fujitsu Smartphone that Uses Multiple Tensilica DPUs Including ConnX BBE DSP and HiFi Audio/Voice at Mobile World Congress in Barcelona

Wednesday, February 20, 2013

• Rambus Updates First Quarter Revenue Guidance

Wednesday, February 20, 2013

• Rambus and LSI Corporation Sign Patent License Agreement

Wednesday, February 20, 2013

• GLOBALFOUNDRIES Offers Enhanced 55nm CMOS Logic Process with ARM Next-Generation Memory and Logic IP Support for Low Voltage

Tuesday, February 19, 2013

• ARM and STMicroelectronics Join with Mathworks to Enable Code Generation, Debug and Modelling For STM32 Microcontrollers

Tuesday, February 19, 2013

• Tilera Announces TILE-Gx72, the World's Highest-Performance and Highest-Efficiency Manycore Processor

Tuesday, February 19, 2013

• LSI Introduces Axxia 5500 Communication Processors with ARM Technology for High-Performance, Power-Efficient Networks

Tuesday, February 19, 2013

• AnSem announces the availability of an Analog Front End that makes Power Line Communication for smart grids more reliable

Tuesday, February 19, 2013

• Kilopass Receives Frost & Sullivan Award for Non-Volatile Memory Innovator

Tuesday, February 19, 2013

• Lantiq Introduces Lowest Power GPON SoC Solution for SFP Optical Module Form Factor

Tuesday, February 19, 2013

• CEVA and Sensory Partner to Deliver Lowest Power Voice Activation Solution Based on CEVA-TeakLite-4 DSP Platform

Tuesday, February 19, 2013

• CEVA and Mindspeed Extend Relationship to Address LTE-Advanced Small Cells

Tuesday, February 19, 2013

• CEVA Introduces MUST Multi-core System Technology, Adds Vector Floating-point Capabilities for CEVA-XC DSP Architecture Framework

Tuesday, February 19, 2013

• CAST Adds Multicast and AXI to UDP/IP Core for Streaming Media Systems

Tuesday, February 19, 2013

• New mimoOn Library for Tensilica's Baseband DSP IP Cores Speeds Up LTE and LTE-Advanced Chip Designs

Tuesday, February 19, 2013

• Sensory's New TrulyHandsfree 3.0 Speaker Verification and Speaker Identification Optimized Port Available on Tensilica HiFi Audio/Voice DSPs

Monday, February 18, 2013

• Mentor Graphics Nucleus Innovate Program Adds NXP Semiconductors and Expands Device Support

Monday, February 18, 2013

• S3 Group Launches 10 new Silicon Proven IP Cores

Monday, February 18, 2013

• Vitesse Introduces IP Cores for Consumer, Enterprise and Industrial Applications

Monday, February 18, 2013

• Nuvoton NuMicro Family 32-bit Cortex-M0 MCU Debuts A New Series - NUC123

Monday, February 18, 2013

• Toshiba to Launch New Structured Array with Short Turnaround-Time Samples

Monday, February 18, 2013

• Actel's CorefIR v4.0 Delivers Configurable Digital Filter Generation for Rtax-DSP with On-Chip Math Blocks

Monday, February 18, 2013

• DS-5 Supports Boot Code, Kernel, Driver and Application Development for ARM Linux-Based Products

Monday, February 18, 2013

• Actel's New Core1553 Development Kit Gives Access to MIL-STD-1553B Bus Evaluation System Based on Fusion Mixed Signal FPGAs

Monday, February 18, 2013

• Creonic Announces WiGig (802.11ad) LDPC Decoder IP and Closes License Deal with Blu Wireless Technology

Friday, February 15, 2013

• STARCHIP Announces the Sampling of its SCF670H SIM Controller to tackle the 4G/LTE market

Friday, February 15, 2013

• Elliptic Technologies Secure HDCP 2.2 Content Protection Solutions Selected by ST-Ericsson For Miracast Wi-Fi Display Applications

Friday, February 15, 2013

• Renesas Mobile Introduces Ground-Breaking Quad Core ARM Cortex-A15/Cortex-A7 CPU-based Communication Processor with Integrated LTE Cat-4 Modem

Friday, February 15, 2013

• Univa Brings Enterprise Workload Management to ARM-based Servers, Speeding Delivery

Friday, February 15, 2013

• Bwave and Ubiso to Demonstrate World's First Licensable Multi-Standard DVB-T2 DTV Demodulation IP Subsystem Based on Tensilica's ConnX BBE16 DSP

Thursday, February 14, 2013

• Wireless Leads of Growth for OEM Semiconductor Spending in 2013

Thursday, February 14, 2013

• 10 IC Product Segments to Exceed Total IC Market Growth in 2013

Thursday, February 14, 2013

• Yoshida in Japan: Renesas' cuts are GloFo's gain

Thursday, February 14, 2013

• Gartner Says Worldwide Mobile Phone Sales Declined 1.7 Percent in 2012

Thursday, February 14, 2013

• Smartphones and Tablets Drive Continued Double-Digit Growth in MEMS Motion Sensor Market

Thursday, February 14, 2013

• Constellations Educational Webinar Series Brings Together Leading Companies to Inform Customers

Thursday, February 14, 2013

• RFEL Launches a Video Image Stabilisation IP Core

Thursday, February 14, 2013

• NXP HD Voice Processing Smartphone Software Now Available for Tensilica's HiFi Audio/Voice DSPs

Wednesday, February 13, 2013

• Cadence Elects Young K. Sohn to Board of Directors

Wednesday, February 13, 2013

• Why we need an imaging IP core

Wednesday, February 13, 2013

• Tensilica and Acoustic Technologies Extend Partnership to Deliver Complete Wideband HD Voice Processing Solution for Smartphones, Tablets and Other Mobile Computing Devices

Wednesday, February 13, 2013

• CEVA to Showcase Industry-Leading Platform IP for Communications, Vision, Imaging, Audio and Voice at Mobile World Congress 2013

Tuesday, February 12, 2013

• Forte Design Systems Becomes First High-Level Synthesis Software Provider to Support IEEE 1666-2011 SystemC

Tuesday, February 12, 2013

• Tensilica vs. Ceva in imaging/vision IP core battle

Tuesday, February 12, 2013

• Xilinx Accelerates Design Productivity for High Volume Applications

Tuesday, February 12, 2013

• Tensilica Unveils IVP - A New Imaging/Video DSP IP Core for Mobile Handsets, DTV, Automotive and Computer Vision Applications

Tuesday, February 12, 2013

• Dream Chip and Tensilica Partner for Imaging/Video Development on the New IVP DSP

Tuesday, February 12, 2013

• Almalence Ports Optimized Image Processing Software onto Tensilica's New IVP Imaging/Video DSP

Tuesday, February 12, 2013

• Irida Labs and Tensilica Partner for Computer Vision Applications on Tensilica's New IVP Imaging/Video DSP

Tuesday, February 12, 2013

• Morpho and Tensilica Partner for Image Processing Solutions for Mobile Devices

Tuesday, February 12, 2013

• Actions Semiconductor Licenses Arteris FlexNoC Interconnect IP for Multimedia Application Processors

Tuesday, February 12, 2013

• Silicon Wafer Revenues Decline in 2012

Monday, February 11, 2013

• Nujira releases new 16-band ET RF front-end for global LTE handsets

Monday, February 11, 2013

• Reflex CES Enters Mainstream FPGA-Prototyping Market; Offers 25-Million Gates or More ASIC Prototyping Platform With Partitioning Software

Monday, February 11, 2013

• Synopsys Signs Multiyear Collaboration Agreement with ARM for Early Software Development for ARMv8 Processors

Monday, February 11, 2013

• Tela Innovations, Inc. Files Complaint at the U.S. International Trade Commission for Unfair Trade Practices Stemming from Patent Infringement

Monday, February 11, 2013

• Calypto's Catapult Integrates with Real Intent's Ascent Lint for Reliable RTL Implementation Flow

Monday, February 11, 2013

• OneSpin Solutions Unveils OneSpin 360 DV Product Family

Monday, February 11, 2013

• OneSpin Solutions Adds RTL-to-RTL Equivalence Checking to Product Family

Monday, February 11, 2013

• Mobile and Cloud Computing Spur Tripling of Micro Server Shipments This Year

Monday, February 11, 2013

• Hitachi Information & Communication Engineering Selects Forte's High-Level Synthesis Software

Monday, February 11, 2013

• Fujitsu, Panasonic to form fabless chip firm

Monday, February 11, 2013

• Globalfoundries commits to FDSOI process

Monday, February 11, 2013

• Intel microserver leaves door open for ARM