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Wednesday, May 1, 2013

• CircuitSutra releases SystemC Model Library for Virtual Platforms

Tuesday, April 30, 2013

• Athena Expands Extensive FFT/DFT Processor Line

Tuesday, April 30, 2013

• IPextreme Welcomes Ridgetop Group, Inc. to Constellations

Tuesday, April 30, 2013

• SILICONGATE TSMC Symposium in Moscow on 23th April 2013 Wrap-up

Tuesday, April 30, 2013

• Audio Semiconductor Market Achieves Loud and Clear Gains in Cellphones

Tuesday, April 30, 2013

• Recovery in 2013 Semiconductor Capex

Monday, April 29, 2013

• MCU Market on Migration Path to 32-bit and ARM-based Devices

Monday, April 29, 2013

• SMIC rides on China fabless growth

Monday, April 29, 2013

• Synopsys Announces Virtualizer Development Kit (VDK) for Freescale's Qorivva MCU Family

Monday, April 29, 2013

• Cadence and GLOBALFOUNDRIES Collaborate to Improve DFM Signoff for 20- and 14-Nanometer Nodes

Monday, April 29, 2013

• Top MEMS Foundries: TSMC passes specialty MEMS players in Yole's annual ranking

Monday, April 29, 2013

• French consortium announces development of a clockless smartcard chip

Monday, April 29, 2013

• Infineon and GLOBALFOUNDRIES Announce Joint Development and Production Collaboration for 40nm Embedded Flash Process Technology

Friday, April 26, 2013

• DOLPHIN INTEGRATION announces the best noise and linearity performances on the market of its circuit for space application

Friday, April 26, 2013

• Altera Announces First Quarter Results

Friday, April 26, 2013

• SMIC Reports 2013 First Quarter Results

Thursday, April 25, 2013

• Synopsys Unveils Embedded Vision Development System

Thursday, April 25, 2013

• Digital Core Design Announces New Release of its 8051

Thursday, April 25, 2013

• CEVA Introduces World's First Software-Based Super-Resolution Technology for Low Energy Mobile Applications

Thursday, April 25, 2013

• Xilinx Announces Fiscal 2013 Results; Q4 Sales Increase 4% Sequentially

Thursday, April 25, 2013

• NASA Selects Ridgetop Group to Develop an Innovative Modular SiGe 130 nm Cell Library

Thursday, April 25, 2013

• Cadence Reports First Quarter 2013 Financial Results and Completes Acquisition of Tensilica

Wednesday, April 24, 2013

• IPextreme and Stars of IP to Party Together at DAC 2013

Tuesday, April 23, 2013

• AMD will go embedded with ARM

Tuesday, April 23, 2013

• AMD Targets High-Growth, Embedded Markets with New AMD Embedded G-Series System-on-Chip

Tuesday, April 23, 2013

• ARM Releases Free Industry Standard Development Tools For Its Embedded Linux Community

Tuesday, April 23, 2013

• DMP 3D Graphics IP Core "SMAPH-S" is selected by Renesas Electronics

Tuesday, April 23, 2013

• HDL Design House Introduces JESD204B PCS IP Core

Tuesday, April 23, 2013

• S3 Group Announces Latest Release to its RF and Mixed Signal IP Product Guide

Tuesday, April 23, 2013

• ARM Holdings PLC Reports Results For The First Quarter 2013

Tuesday, April 23, 2013

• Altera Announces Availability of Cyclone V SoC Development Kit

Tuesday, April 23, 2013

• Will ASICs be replaced in comms gear?

Tuesday, April 23, 2013

• Chips&Media Announces New Generation HEVC Video Decoder

Monday, April 22, 2013

• Mobile SoCs still lacking good software model

Monday, April 22, 2013

• Mentor Graphics Accelerates SoC and Embedded System Delivery with a Native Embedded Software Environment for Pre- and Post-Silicon Development, Embedding QEMU, SystemC and Emulation

Monday, April 22, 2013

• Worldwide Semiconductor Manufacturing Equipment Spending Declined 16 Percent in 2012, According to Final Results by Gartner

Monday, April 22, 2013

• Space Codesign Establishes Presence in Eastern Asia through a Sales Representation Agreement with Avant Technology

Friday, April 19, 2013

• Altis Semiconductor Introduces the Next Generation of Embedded CBRAM Technology

Friday, April 19, 2013

• Lattice Semiconductor Reports First Quarter 2013 Results

Friday, April 19, 2013

• Rambus Reports First Quarter Financial Results

Friday, April 19, 2013

• North American Semiconductor Equipment Industry Posts March 2013 Book-to-Bill Ratio of 1.14

Friday, April 19, 2013

• Netronome Secures $19 Million in Series E Financing