Search News

Sunday, March 24, 2024

• Europe invests in NeuReality's AI technology
• Synopsys Adds AI-Driven Tools, Acquires PUF Security Firm
• Ex-DoD Official Says Chinese-Made PCBs Plague U.S. Systems
• Arm Highlights Future of the Software-Defined Vehicle
• Edge Impulse Deploys its State-of-the-Art Edge AI Models to Arm Microcontrollers Tools
• Marvell Announces Industry's First 5nm Transmit-Only 800G PAM4 Optical DSP for AI and Cloud Interconnects
• Alpha Project: Secure-IC Leads the Cybersecurity Reinforcement in Baggage Transport
• ScaleFlux To Integrate Arm Cortex-R82 Processors in Its Next-Generation Enterprise SSD Controllers
• CoreHW, in Partnership with Unikie, Introduces a Novel RTLS Technology that Significantly Enhances Power Efficiency and Positioning Accuracy
• StarIC and GlobalFoundries announce strategic partnership, release high-Speed TIA and drivers to advance silicon photonics ecosystem
• Industry veteran Volker Politz joins Semidynamics as Chief Sales Officer

Wednesday, March 20, 2024

• Smart Manufacturing Paves the Way for Greener Electronics
• Tommi Lampila Is Xiphera's New Chief Revenue Officer
• indie Semiconductor Announces Strategic Investment in AI Processor Leader Expedera
• Seven Years of Uninterrupted Growth: Andes Technology Achieves Milestone Annual Revenue Exceeding NT$1 Billion
• StarFive's RISC-V based JH-7110 intelligent vision processing platform adopted VeriSilicon's Display Processor IP

Tuesday, March 19, 2024

• Empowering Sustainability: 4 Strategies To Significantly Reduce the Semiconductor Industry's Carbon Footprint
• Credo Technology Group To Showcase Latest Optical Solutions at OFC 2024
• Synopsys to sell Software Integrity business
• Alibaba's research arm promises server-class RISC-V processor due this year
• Synopsys Announces New AI-Driven EDA, IP and Systems Design Solutions At SNUG Silicon Valley
• Synopsys Expands Semiconductor IP Portfolio With Acquisition of Intrinsic ID
• 300mm Fab Equipment Spending Forecast to Reach Record $137 Billion in 2027, SEMI Reports
• MIPS Expands Global Footprint with New Design Center and Talent for Systems Architects and AI Compute
• Biden-Harris Administration Announces Preliminary Terms with Intel to Support Investment in U.S. Semiconductor Technology Leadership and Create Tens of Thousands of Jobs

Monday, March 18, 2024

• Credo Introduces HiWire AECS to Support 400G AI/ML Backend Networks
• Arm Unveils Its Largest Portfolio of Automotive Processors
• Synopsys Strengthens Polaris Software Integrity Platform with New Dynamic Security Testing Capabilities
• STMicroelectronics breaks the 20nm barrier for cost-competitive next-generation microcontrollers
• HCLTech and CAST expand partnership for custom chips
• Cycuity Sets New Standard for Semiconductor Chip Security Assurance with Next Generation of Radix Technology
• Synopsys Showcases EDA Performance and Next-Gen Capabilities with NVIDIA Accelerated Computing, Generative AI and Omniverse
• TSMC and Synopsys Bring Breakthrough NVIDIA Computational Lithography Platform to Production
• Spectral Releases Advanced Quality Assurance & Data Analytics tool to validate advanced node Memory Compilers
• Kudelski IoT and Dolphin Design unite to accelerate secure ASIC and IP projects
• Europe Leaps Ahead in Global AI Arms Race, Joining $20 Million Investment in NeuReality to Advance Affordable, Carbon-Neutral AI Data Centers

Sunday, March 17, 2024

• EU takes a step closer to regulating AI
• Cadence and NVIDIA Unveil Groundbreaking Generative AI and Accelerated Compute-Driven Innovations
• Siemens and NVIDIA expand collaboration on generative AI for immersive real-time visualization
• Revolutionary Cadence Reality Digital Twin Platform to Transform Data Center Design for the AI Era
• Weebit Nano to demo its ReRAM technology on GlobalFoundries' 22FDX® platform
• After TSMC fab in Japan, advanced packaging facility is next
• A System On Module (SoM) developed by Electra IC: BitFlex-SPB-A7 FPGA SoM

Friday, March 15, 2024

• Intel will bring a performance-improving feature to its chips one year ahead of TSMC

Thursday, March 14, 2024

• SoC Secure Boot Hardware Engine IP Core Now Available from CAST

Wednesday, March 13, 2024

• PrimisAI Unveils Premium Version of RapidGPT, Redefining Hardware Engineering
• embedded world 2024: Codasip demonstrates CHERI memory protection
• QuickLogic and Zero-Error Systems Partner to Deliver Radiation-Tolerant eFPGA IP for Commercial Space Applications
• Dolphin Design in Arm's Partner Catalog
• Canaan's RISC-V based edge AIoT SoC adopted VeriSilicon's ISP and GPU IPs

Tuesday, March 12, 2024

• New accelerated modeling for automotive development is here
• University of Western Australia Latest to Join the BrainChip University AI Accelerator Program
• Ecosystem Collaborations Bring Full Stack Software Solutions to Develop Leading-edge Automotive Applications From Day One
• Arm's Broadest Ever Automotive Enhanced IP Portfolio Designed for the Future of Computing in Vehicles
• Tenstorrent and MosChip Partner on High Performant RISC-V Design
• We'll Need Many More Fabs to Meet $1 Trillion by 2030 Goal
• Arteris Expands Ncore Cache Coherent Interconnect IP To Accelerate Leading-Edge Electronics Designs
• Siemens to demonstrate first pre-silicon simulation environment for Arm Cortex-A720AE for Software Defined Vehicles
• Arm Announces New Automotive Technologies to Accelerate Development of AI-enabled Vehicles by up to Two Years
• Arteris Expands Automotive Solutions for Armv9 Architecture CPUs
• HBM3 Initially Exclusively Supplied by SK Hynix, Samsung Rallies Fast After AMD Validation, Says TrendForce
• Cadence Collaborates with Arm to Jumpstart the Automotive Chiplet Ecosystem
• Arasan proudly releases its Radiation Hardened NAND Flash IP
• Arasan proudly introduces the VESA VDC-M Encoder and Decoder IP