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Wednesday, February 6, 2013
Athena Announces Fastest Public Key Accelerator Core
Wednesday, February 6, 2013
SMIC Reports 2012 Fourth Quarter Results
Wednesday, February 6, 2013
GUC Monthly Sales Report - January 2013
Wednesday, February 6, 2013
ARM rates FDSOI process as 'good technology'
Wednesday, February 6, 2013
Chip market seen contracting again in 2013
Wednesday, February 6, 2013
Big-little is sweet 16
Wednesday, February 6, 2013
GLOBALFOUNDRIES and Samsung Support New Cadence Virtuoso Advanced Node for 20- and 14nm Processes
Wednesday, February 6, 2013
Faraday Reported 2012 Fourth Quarter Results
Wednesday, February 6, 2013
Semiconductors Down 2.7% in '12, May Grow 7.5% in '13
Wednesday, February 6, 2013
Silicon Image Announces Fourth Quarter and Fiscal Year 2012 Earnings
Wednesday, February 6, 2013
MIPS Stockholders to Receive $8.01 in Aggregate Net Proceeds from Recapitalization and Merger
Tuesday, February 5, 2013
GLOBALFOUNDRIES Details 14nm-XM FinFET Technology Performance, Power and Area Efficiency with a Dual-core Cortex-A9 Processor Implementation
Tuesday, February 5, 2013
GLOBALFOUNDRIES and Cyclos Semiconductor Partner to Develop High-Performance, Low-Power ARM Cortex-A15 Processors Using Resonant Clock Mesh Technology
Tuesday, February 5, 2013
GLOBALFOUNDRIES and Rambus Collaborate To Develop Broad IP Portfolio for 14nm-XM FinFET Process Technology
Tuesday, February 5, 2013
GLOBALFOUNDRIES and Synopsys Partner To Provide Comprehensive Design Environment for Foundry's 14 nm-XM FinFET Offering
Tuesday, February 5, 2013
GLOBALFOUNDRIES To Offer Adapteva's Processor IP For 28nm SoC Designs
Tuesday, February 5, 2013
Cadence and GLOBALFOUNDRIES Collaborate to Enable Custom/Analog and Digital Design of 20nm Manufacturing Process
Tuesday, February 5, 2013
Semiconductor R&D Spending Rises 7% Despite Weak Market
Tuesday, February 5, 2013
Analog Bits IP Now Shipping in Microsemi's SmartFusion2 SoC FPGAs IP products dramatically reduce power and area
Tuesday, February 5, 2013
ARM Holdings PLC Reports Results For The Fourth Quarter And Full Year 2012
Tuesday, February 5, 2013
Phison Licenses Tensilica's Dataplane Processor (DPU) for NAND Flash Memory Controllers and SSD Applications
Tuesday, February 5, 2013
Calypto Announces New President and CEO Sanjiv Kaul
Monday, February 4, 2013
TI power management front-end chip increases battery run-time in ARM Cortex A15-based designs
Monday, February 4, 2013
TOSHIBA Develops High Speed NANO FLASH-100 Flash Memory for ARM Core Based Microcontrollers
Monday, February 4, 2013
Atmel Introduces New Family of Cortex-A5 Processor-Based MPUs For Embedded Industrial and Consumer Applications
Monday, February 4, 2013
Semiconductor Industry Posts Near-Record Sales Total in 2012
Monday, February 4, 2013
TU Dresden Realized 28nm Low Power Test Chip with Tensilica Processor and RacyICs Power Management in GLOBALFOUNDRIES Process
Monday, February 4, 2013
Imagination submits PowerVR Series6 cores for OpenGL ES 3.0 conformance
Thursday, January 31, 2013
VESA Introduces Updated Dual-Mode Standard for Higher Resolution Interoperability with HDMI Displays
Thursday, January 31, 2013
Digital Core Design introduces Local Interconnect Network IP Core
Thursday, January 31, 2013
Cadence Releases Verification IP for USB SuperSpeed Inter-Chip Specification
Thursday, January 31, 2013
Imagination Technologies ships Caustic Series2 R2500 and R2100 ray tracing acceleration boards
Thursday, January 31, 2013
Daou InCube to offer Design Platforms based on Cortus processors
Thursday, January 31, 2013
Cadence Reports Fourth Quarter and Fiscal Year 2012 Financial Results
Thursday, January 31, 2013
EEMBC Undertakes Development of Industry-Standard Ultra-Low Power Microcontroller Benchmarks
Thursday, January 31, 2013
Mature Fabs Still Process 40% of all Silicon
Thursday, January 31, 2013
MIPS Technologies Reports Second Quarter Fiscal 2013 Financial Results
Wednesday, January 30, 2013
Real Intent Unveils Major Performance Enhancements in Ascent IIV and Ascent XV Tools for Early Functional Verification of Digital Designs
Wednesday, January 30, 2013
Sidense Exhibiting at Common Platform Technology Forum
Wednesday, January 30, 2013
Imagination Technologies Selects Synopsys as Advanced Verification Technology Partner
Wednesday, January 30, 2013
Posedge Launches 2x2 MIMO WLAN MAC and Baseband IP
Wednesday, January 30, 2013
Intilop delivers true Ultra-low latency 10G NIC with their 5th Gen 76 ns TCP & UDP Offload technology breaking yet another record in latency and bandwidth
Wednesday, January 30, 2013
Kilopass NVM IP Achieves JEDEC Qualification on High-Demand SMIC 65/55/40nm Processes
Wednesday, January 30, 2013
CEVA, Inc. Announces Fourth Quarter and Year End 2012 Financial Results
Wednesday, January 30, 2013
Recore Systems Joins Constellations Program, Adds DSP IP to Constellations Semiconductor IP Center
Wednesday, January 30, 2013
Xilinx Stays a Generation Ahead with Multiple 20nm Firsts
Wednesday, January 30, 2013
DesignCon: Nvidia's engineering VP wants better design tools
Wednesday, January 30, 2013
Accent Extends Its Market Leading Position In ZigBee Solutions With ZigBee IP and SEP 2.0
Tuesday, January 29, 2013
MegaChips Licenses Arteris FlexNoC Fabric IP for Next-Generation Imaging SoCs
Tuesday, January 29, 2013
Flash Forward at the leading edge?
Tuesday, January 29, 2013
Freescale Semiconductor partners with IAR Systems to reach new performance high
Tuesday, January 29, 2013
Oasys Design Systems Joins the TSMC Soft-IP Alliance Program
Tuesday, January 29, 2013
Synopsys Announces Energy-Efficient 28-nm PCI Express 3.0 PHY with Support for 10GBASE-KR
Tuesday, January 29, 2013
New 32-bit BA25 Application Processor Adds More Performance to Royalty-Free BA2x Family
Tuesday, January 29, 2013
STATS ChipPAC and UMC Unveil World's First 3D IC Developed under an Open Ecosystem Model
Tuesday, January 29, 2013
Intel says no LTE-processor integration until 2014
Tuesday, January 29, 2013
GUC Successfully Validates a 28nm GPU/CPU Platform
Monday, January 28, 2013
The Linley Group Releases First Report Exclusively Focused on Wireless Modem Silicon
Monday, January 28, 2013
China's IC Market Growth Continues to Outpace Its IC Manufacturing
Monday, January 28, 2013
Cadence Unveils New Virtuoso Advanced Node for 20nm Design
Monday, January 28, 2013
Rambus Introduces R+ Enhanced Standard Memory and Interface Solutions
Monday, January 28, 2013
Rambus Introduces R+ LPDDR3 Memory Architecture Solution
Monday, January 28, 2013
SENSIO announces its first SENSIO Autodetect integration deal with major semiconductor manufacturer
Monday, January 28, 2013
JDSU Adopts Altera Stratix V GT FPGA for Production of Next-Generation Optical Testers
Monday, January 28, 2013
Pengwyn open development platform from SILICA targets industrial applications
Monday, January 28, 2013
VESA Finalizes Requirements for Display Stream Compression Standard
Monday, January 28, 2013
intoPIX Launches new compact JPEG2000 Encoder and Decoder FPGA IP-cores at ISE 2013
Monday, January 28, 2013
Phoenix Systems ports Phoenix-RTOS to EnSilica's eSi-RISC processor family
Monday, January 28, 2013
S2C Boasts Largest Prototype Ready Interfaces Library for Virtex-7 2000T FPGA based Rapid ASIC Prototyping
Monday, January 28, 2013
WXIC names industry veteran Simon Yang as CEO
Monday, January 28, 2013
Evatronix Adds the Scaling Capabilities to its PANTA DP20 Display Processor
Monday, January 28, 2013
Qualcomm preps ARM server SoCs--and they want to hire you
Friday, January 25, 2013
Lattice Semiconductor Reports Fourth Quarter 2012 Results
Friday, January 25, 2013
Cadence Receives TSMC's Customers' Choice Award
Friday, January 25, 2013
Intel's 450-mm wafer spend starts in 2013
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