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Friday, September 21, 2012

• Could Apple's A6 be a 'big-little' processor?

Friday, September 21, 2012

• Digital Blocks Announces UDP/IP Hardware Stack / UDP/IP Off-Load Engine (UOE) Targeting High-Frequency Trading Systems

Thursday, September 20, 2012

• Xylon logicBRICKS Graphics Processing Unit (GPU) Now Runs on the ZedBoard Development Kit from Avnet Electronics Marketing

Thursday, September 20, 2012

• GLOBALFOUNDRIES Unveils FinFET Transistor Architecture Optimized for Next-Generation Mobile Devices

Thursday, September 20, 2012

• Samsung Begins Mass Producing Industry's Highest Density (128GB) Embedded NAND Storage

Thursday, September 20, 2012

• China Fabless: Going it alone, GigaDevice targets 'no-growth' NOR flash market

Thursday, September 20, 2012

• eSilicon Korea Now Open for Business

Thursday, September 20, 2012

• MIPI Alliance M-PHY Physical Layer Gains Dominant Position for Mobile Device Applications

Thursday, September 20, 2012

• The A6: Apple's SoC Design Team Finally Gets Serious

Wednesday, September 19, 2012

• Long-Term Forecast Improves for IC Market

Wednesday, September 19, 2012

• Silicon Image Announces Advanced DTV Port Processor Solution With InstaPrevue Technology

Wednesday, September 19, 2012

• Sisvel Advances Toward Formation of DVB-C2 Patent Pool

Wednesday, September 19, 2012

• Synopsys Completes Major Steps Toward Acquisition of SpringSoft, Inc.

Wednesday, September 19, 2012

• Hitachi Selects Synopsys' Discovery Verification IP for ARM AMBA Interconnect for Verification of its Storage Systems

Wednesday, September 19, 2012

• Sunplus Achieves Volume Shipments of New Home Entertainment SoCs powered by the CEVA-TeakLite-III Audio DSP

Wednesday, September 19, 2012

• SMIC Unveils 0.13um-1.2V Low-Power Embedded EEPROM Platform

Wednesday, September 19, 2012

• iPhone 5 Carries $199 BOM, Virtual Teardown Reveals

Tuesday, September 18, 2012

• Kilopass Announces Breakthrough Technology to Quadruple Memory Capacity for Embedding Non-Volatile Data in SoC Products

Tuesday, September 18, 2012

• PCI-SIG and MIPI Alliance Collaborate to Extend PCI Express Technology to Mobile Devices

Tuesday, September 18, 2012

• Synopsys Announces DesignWare DDR4 Memory Interface IP

Tuesday, September 18, 2012

• Kawasaki Microelectronics Achieves First-Silicon Success with Mixel's MIPI and MIPI/LVDS Unified Solutions

Tuesday, September 18, 2012

• EVE Unveils Wireless SoC Accelerated Validation Platforms

Tuesday, September 18, 2012

• Novocell Semiconductor Announces NVM IP Tape Out at Trusted Foundry 32nm

Tuesday, September 18, 2012

• Barco Silex Opens Design Center in Ghent

Tuesday, September 18, 2012

• Vote for DCD's DQ80251, the world's fastest 8051 CPU

Tuesday, September 18, 2012

• SK Hynix Introduces DDR3L-Reduced Standby for Mobile Solutions

Tuesday, September 18, 2012

• Renesas: Software is new battlefront in MCUs

Tuesday, September 18, 2012

• China Fabless: Resurgent Spreadtrum looks to expand

Tuesday, September 18, 2012

• Predictable semiconductor cycle ahead?

Monday, September 17, 2012

• InterNiche Technologies Announces Immediate Availability of Network Object Code Protocol Libraries for STMicroelectronics STM 32 Family

Monday, September 17, 2012

• The iPhone 5's A6 SoC: Not A15 or A9, a Custom Apple Core Instead

Monday, September 17, 2012

• MoSys Announces Second Generation Bandwidth Engine IC Delivering up to 384 Gbps Throughput in a Single Device

Monday, September 17, 2012

• Peraso Introduces Industry's Smallest Fully Integrated 60 GHz Transceiver

Monday, September 17, 2012

• Kalray claims 25 customers for 256-core processor

Monday, September 17, 2012

• Aquantia Acquires 10GBASE-T Assets From PLX Technology

Monday, September 17, 2012

• ClariPhy Announces Enhanced 40G LightSpeed Coherent SoC to Boost Performance of Coherent Optical Transport in Metro and Regional Networks

Monday, September 17, 2012

• LFoundry launches several technology enhancement projects in R&D and innovations

Monday, September 17, 2012

• Xilinx Acquires Wireless Backhaul Solutions Provider Modesat Communications

Monday, September 17, 2012

• S3 Group and Siano Mobile Silicon Collaborate on Mobile TV Receiver Chips

Monday, September 17, 2012

• WiLAN and SENSIO Technologies Enter Licensing Partnership

Monday, September 17, 2012

• WiLAN Announces Consolidation of Cases Involving Apple, HTC and Other Parties

Monday, September 17, 2012

• Aldec Enters the ASIC Prototyping Market with HES-7

Monday, September 17, 2012

• Intel's Haswell: a viable platform for tablets?

Monday, September 17, 2012

• China IP debate: "Everyone's afraid their tech will be stolen..."

Monday, September 17, 2012

• Intilop to demo live Full TCP Offload based FPGA System for Financial Applications with Altera and BittWare at the HPC Wall Street Conference

Friday, September 14, 2012

• STMicroelectronics Announces New Appointments in the Executive Management Team

Friday, September 14, 2012

• Intel describes 22-nm SoC process, not chips

Friday, September 14, 2012

• Smartphone is next stop for PCI Express

Friday, September 14, 2012

• Chip design’s recycle cycle: Interview with Aart de Geus, chairman and co chief executive, Synopsys

Friday, September 14, 2012

• Chipus demonstrates silicon proven high performance IPs during Brazilian symposium on microelectronics

Friday, September 14, 2012

• Cortus APS3 Processor Deployed in Selected Discretix CryptoCell Security Platforms

Thursday, September 13, 2012

• Altera Expands Its OTN Portfolio with a Single-Chip 100G Muxponder Solution

Thursday, September 13, 2012

• Samsung begins building China fab

Thursday, September 13, 2012

• Intel sees quad-patterned path to 10 nm chips

Thursday, September 13, 2012

• Analyst: Apple A6 processor is dual-core Cortex-A15

Thursday, September 13, 2012

• Intel's Bohr sees at least 10 more years of scaling

Thursday, September 13, 2012

• IPhone 5 bill of materials estimate is $167.50

Thursday, September 13, 2012

• Maxim Integrated Launches Corporate Venture Group to Invest in Startups and Innovative Technologies

Thursday, September 13, 2012

• Imagination Technologies Group plc: Interim Management Statement

Wednesday, September 12, 2012

• Cosmic Circuits launches "Nebula 12" - Electronic Circuit Design Contest

Wednesday, September 12, 2012

• Samsung Invests $4 Million in Carbon Design Systems, Companies Enter into Strategic Partnership

Wednesday, September 12, 2012

• X-FAB Goes 3D

Wednesday, September 12, 2012

• Five Companies to Account for 64% of $61.4B Semiconductor Capex in 2012

Wednesday, September 12, 2012

• John Dickson, Former Agere CEO, Joins eSilicon Board

Wednesday, September 12, 2012

• Sigma Designs to Select the Cryptography Research CryptoFirewall Security Core for Next Generation System-on-Chip Solutions

Wednesday, September 12, 2012

• Secure Content Storage Association (SCSA) Selects Cryptography Research to Provide Security Expertise

Wednesday, September 12, 2012

• Logiways Licenses Cryptography Research CryptoFirewall Security Technology

Wednesday, September 12, 2012

• CEVA, Inc. Makes Strategic Equity Investment in Antcor, a Provider of Software-Based Wi-Fi IP

Wednesday, September 12, 2012

• IHS Downgrades Semiconductor Market Outlook

Tuesday, September 11, 2012

• Apple puts audio processor on hold for iPhone 5

Tuesday, September 11, 2012

• USB-IF Reaches SuperSpeed USB Certification Milestone, Industry-Wide Adoption

Tuesday, September 11, 2012

• The Linley Group Says Mobile Processor Market Grew 60 Percent in 2011

Tuesday, September 11, 2012

• Sidense Licenses 1T-OTP to Exar

Tuesday, September 11, 2012

• TSMC set to expand 2013 capex to $10bn

Tuesday, September 11, 2012

• Global Semiconductor Sales Increase Slightly in July

Tuesday, September 11, 2012

• Xilinx Demonstrates Industry's First QPI 1.1 Interface with FPGAs at Intel Developer Forum

Tuesday, September 11, 2012

• SEMI Reports Second Quarter 2012 Worldwide Semiconductor Equipment Figures; Billings US$ 10.3 Billion

Tuesday, September 11, 2012

• VESA Improves Mobile Device Battery Life and Display Performance with Upcoming Release of Embedded DisplayPort (eDP) Version 1.4

Tuesday, September 11, 2012

• IPhone 5 expected to sport quad-core, LTE

Tuesday, September 11, 2012

• GLOBALFOUNDRIES Appoints Joe Chen as New Sales Head for Greater China

Tuesday, September 11, 2012

• Mentor Graphics Extends UVM Connect to Support OVM

Tuesday, September 11, 2012

• Tensilica Reaches Audio/Voice DSP Milestone: Most Widely Licensed Audio Architecture for SOC Design

Monday, September 10, 2012

• IPextreme Announces Silicon Valley IP Users Conference

Monday, September 10, 2012

• Intel preps interconnect for server CPUs

Monday, September 10, 2012

• Renesas Electronics Introduces USB 3.0 Hub Controller with Industry-Leading Low Power Consumption and Small Mounting Area

Monday, September 10, 2012

• Kalray Announces First Samples of MPPA-256 Processor in 28nm

Monday, September 10, 2012

• TSMC August 2012 Sales Report

Monday, September 10, 2012

• intoPIX JPEG2000 technology selected for integration in the new "4K Gateway" product of Visual Unity

Monday, September 10, 2012

• As Wintel Dominance Wanes, the Microsoft/Intel Alliance Frays

Monday, September 10, 2012

• Why China still can't create the next Texas Instruments