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Monday, February 27, 2012

• Intel's Ivy Bridge delayed says senior executive

Monday, February 27, 2012

• Tensilica Baseband DSPs and Dataplane Processors (DPUs) Power LTE/HSPA/3G Multimode Modem IC from NTT DOCOMO, Fujitsu, NEC, and Panasonic Consortium

Monday, February 27, 2012

• Tensilica HiFi Audio DSP Supports Dolby Digital Plus for Surround Sound on Mobile Devices

Monday, February 27, 2012

• Spreadtrum Licenses CEVA-XC DSP for LTE Baseband

Monday, February 27, 2012

• RivieraWaves Adds 802.11n and 802.11ac Silicon IP to Portfolio

Monday, February 27, 2012

• Posedge Announces NVM Express Compliant Flash Controller IP Core

Friday, February 24, 2012

• MoSys Appoints John Monson as Vice President of Marketing

Friday, February 24, 2012

• Arkamys Audio Enhancement Software and Services Being Ported To Tensilica's HiFi Audio DSPs

Friday, February 24, 2012

• Renesas Mobile Partners with NVIDIA to Deliver Next-Generation LTE Ultraphones

Friday, February 24, 2012

• North American Semiconductor Equipment Industry Posts January 2012 Book-to-Bill Ratio of 0.95

Thursday, February 23, 2012

• First 28nm ARM Cortex-A9 Processor Optimization Pack now Available for GLOBALFOUNDRIES 28nm-SLP HKMG Process

Thursday, February 23, 2012

• Movea Launches Industry's First Motion Processing IP Cores designed for mobile devices

Thursday, February 23, 2012

• MediaTek and ARM Extend Relationship with Access Agreement for a Broad Range of the Latest ARM IP

Thursday, February 23, 2012

• Magma's Madhavan won't join Synopsys

Thursday, February 23, 2012

• Will Nvidia have more success with Windows 8 than Android?

Thursday, February 23, 2012

• MPEG LA Offers MVC Patent Portfolio License

Thursday, February 23, 2012

• Chips&Media shows Next Generation of Video Processing Technologies at MWC 2012

Thursday, February 23, 2012

• InterDigital and Sierra Wireless Expand Worldwide Patent License Agreement to Cover 4G Standards

Thursday, February 23, 2012

• Imec and Renesas Electronics report record ADC for next-generation high-bandwidth wireless receivers

Thursday, February 23, 2012

• VeriSilicon Releases New Generation of Hantro Video IP Products to Promote WebM and WebRTC

Thursday, February 23, 2012

• Digital Core Design: World's fastest 80C51 CPU @ CeBIT

Thursday, February 23, 2012

• Sensory and Tensilica Partner to Offer Complete Speech Recognition Subsystem

Wednesday, February 22, 2012

• Synopsys Completes Acquisition of Magma Design Automation

Wednesday, February 22, 2012

• Altair Semiconductor to Bring its Leading LTE Chipset to MIPS-Based Android 4.0 "Ice Cream Sandwich" Tablets from Ingenic

Wednesday, February 22, 2012

• Samsung positions its fab to take on TSMC

Wednesday, February 22, 2012

• Altera Demonstrates First FPGAs to Interoperate with 100-Gbps Optical Module

Wednesday, February 22, 2012

• Accellera Systems Initiative Announces IEEE 1666 SystemC Language Standard for Electronic System-Level Design Is Available for Download at No Charge

Wednesday, February 22, 2012

• Agilent Technologies Completes Acquisition of Accelicon Technologies' Solutions for Semiconductor Device Modeling

Wednesday, February 22, 2012

• TES announces the availability of the D/AVE HD Graphics Processor for Embedded Systems

Wednesday, February 22, 2012

• Tensilica's Leadership in Mobile Audio/Voice and Baseband IP Cores Demonstrated at Mobile World Congress 2012

Wednesday, February 22, 2012

• K-micro to Sample IEEE 1901 Compliant, Single Chip HD-PLC for 240Mbps High-Speed Power Line Communications

Wednesday, February 22, 2012

• AuthenTec Extends Content Protection Offerings with Solution Suite for HDCP

Wednesday, February 22, 2012

• Arasan Chip Systems Sees Rapid Market Growth for MIPI IP products

Tuesday, February 21, 2012

• Magillem and Green Hills Software to build a bridge and help software teams debug with MULTI IDE based on accurate automatically updated IEEE1685 compliant hardware description

Tuesday, February 21, 2012

• Intilop TCP Offload Engine Delivers Full TCP Offload in Less than 100 nanoseconds Using Altera's Stratix IV FPGA

Tuesday, February 21, 2012

• MIPS Technologies and Intrinsic-ID Team to add Top-level Security to Mobile Platforms

Tuesday, February 21, 2012

• Sidense 1T-OTP Helps Calibrate Aptina's Advanced Imaging Products

Tuesday, February 21, 2012

• Intel confirmed as foundry for second FPGA startup

Tuesday, February 21, 2012

• Tabula Confirms Move to Intel's 22nm Process Featuring 3-D Tri-Gate Transistors

Tuesday, February 21, 2012

• First Tegra-Powered Smartphone Announced With NVIDIA's Icera Modem Technology

Tuesday, February 21, 2012

• CEVA Unveils the CEVA-XC4000 - A Low-Power DSP Architecture Framework for the Widest Array of Advanced Wireless Standards

Tuesday, February 21, 2012

• Cadence Expands Proven Ethernet IP Offering With 40/100 Gigabit Ethernet Solution

Tuesday, February 21, 2012

• Cyclos Semiconductor Announces First Commercial Implementation of Resonant Clock Mesh Technology

Tuesday, February 21, 2012

• Tensilica Lays the Foundation for Software Programmable LTE-Advanced User Equipment PHY (Layer 1) in Less than 200mW

Tuesday, February 21, 2012

• CEVA Introduces Low Power, Multi-Mode LTE-Advanced Reference Architecture for the New CEVA-XC4000 DSP Architecture Framework

Tuesday, February 21, 2012

• CEVA and Antcor Announce Low Power, Wi-Fi 802.11ac Reference Architecture for the New CEVA-XC4000 DSP Architecture Framework

Tuesday, February 21, 2012

• Cortus announces Processor IP Roadmap for Embedded System on Chip (SoC) Applications

Monday, February 20, 2012

• Moortec Semiconductor Sign Representative Agreement with Red Shift Sales in Silicon Valley, US

Friday, February 17, 2012

• PLDA Introduces QuickPCIe - PCI Express Interface IP With Enhanced DMA

Friday, February 17, 2012

• Silicon Image Opens New Research & Development Center in Hyderabad, India

Friday, February 17, 2012

• Reports of Counterfeit Parts Quadruple Since 2009, Challenging US Defense Industry and National Security

Friday, February 17, 2012

• Faraday Reported 2011 Fourth Quarter Results

Friday, February 17, 2012

• Tower bids to build 300-mm wafer fab in India

Friday, February 17, 2012

• Black Sand closes $10M Series C Funding

Friday, February 17, 2012

• Magma Enables ZiiLABS to Double the Performance, Cut Power by Half on 100-Core ZMS-40 Processor

Thursday, February 16, 2012

• PTC and Tech-Clarity Unveil New Research on Developing Software-Intensive Products

Thursday, February 16, 2012

• STMicro causes financial analyst concerns

Thursday, February 16, 2012

• Elliptic Extends Leadership In Security IP With DVB CSA3 Descrambler For Digital TV Broadcasting

Thursday, February 16, 2012

• The new battleground for mobile processors

Thursday, February 16, 2012

• IC Companies Close 49 Wafer Fabs from 2009-2011

Thursday, February 16, 2012

• Gennum Reports Year End Results and Announces Dividend

Thursday, February 16, 2012

• Sital's Multi-Standard PMC and cPCI HyperBoard Available for Mil-Std-1553, WB-194, H009, ARINC-429 and Other Protocols

Wednesday, February 15, 2012

• MoSys Demonstrates Bandwidth Engine IC Interoperability with LSI SerDes

Wednesday, February 15, 2012

• Spin Transfer Technologies Raises $36 Million Led by Allied Minds and Invesco

Wednesday, February 15, 2012

• Synopsys and Arteris Enable Earlier Multicore SoC Architecture Optimization with Faster Turnaround Times

Wednesday, February 15, 2012

• Lattice Features New Products And Technologies For Embedded Design Applications

Wednesday, February 15, 2012

• Lattice Features Latest Mobile FPGA Platforms At Mobile World Congress

Wednesday, February 15, 2012

• CEVA, Dirac Partner to Offer Speaker Correction Audio Post-processing Technology for the CEVA-TeakLite-III Architecture

Wednesday, February 15, 2012

• MediaTek Launches MT6575 Android Platform

Wednesday, February 15, 2012

• VIA Chooses Tensilica for Solid State Drive (SSD) Chip Design

Wednesday, February 15, 2012

• Xilinx Reaches Industry Milestone with Record-Fast 28nm Product Rollout: $1B in Design Wins, Thousands of Device Shipments in First Year of Introduction

Wednesday, February 15, 2012

• Renesas Mobile Introduces First Integrated LTE Triple-Mode Platform Optimised for Full-Featured, High Volume Smartphones

Tuesday, February 14, 2012

• Synopsys Announces Industry's First HDMI 1.4 PHY IP in 28-nanometer Processes for Multiple Foundries

Tuesday, February 14, 2012

• NXP Releases World's First Dual Supply Voltage ARM Cortex-M0 Microcontrollers

Tuesday, February 14, 2012

• Synopsys Announces DesignWare Embedded Memories and Logic Libraries for TSMC 28-nanometer Processes

Tuesday, February 14, 2012

• NXP Semiconductors Announces New Refinancing