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Monday, February 13, 2012

• Acoustic Technologies Noise Reduction and Echo Cancellation Software Now Available on Maxim's MAX98095 Based on Tensilica's HiFi Audio/Voice DSPs

Monday, February 13, 2012

• Apple claims Motorola misusing Qualcomm license

Monday, February 13, 2012

• Imagination technologies to see big royalty uptick

Friday, February 10, 2012

• TSMC January 2012 Sales Report

Friday, February 10, 2012

• Latest Linaro GCC Toolchain Release Supports Full Range of ARM Cortex-A Processors

Friday, February 10, 2012

• Analyst: UMC 28-nm roll out beating expectations

Friday, February 10, 2012

• Microsoft: Windows 8 on ARM to be 'no-compromise' experience

Thursday, February 9, 2012

• Evatronix Strengthens its Multimedia IP Portfolio with a Complete Series of MIPI SLIMbus Products

Thursday, February 9, 2012

• CSR Selects Synopsys for Advanced-Node SoC Design

Thursday, February 9, 2012

• Next-gen video codec hits milestone

Thursday, February 9, 2012

• Mobile Communications Revenue to Rise by Double-Digit Margin in 2012

Thursday, February 9, 2012

• Aliathon Ltd. Announces the immediate availability of their 100G OTN Transponder Reference Design For XILINX FPGAs.

Thursday, February 9, 2012

• ON Semiconductor Standardizes on ClioSoft SOS Hardware Configuration Management Platform Enterprise-wide

Thursday, February 9, 2012

• GUC Monthly Sales Report - January 2012

Thursday, February 9, 2012

• SMIC Reports Results for the Three Months Ended December 31, 2011

Thursday, February 9, 2012

• UMC to boost 2012 capex to $2 billion

Thursday, February 9, 2012

• UMC Reports Sales for January 2012

Thursday, February 9, 2012

• Intilop's CTO, K. Masood to Present "How TCP Offload Engines scale up the TCP traffic bandwidth by up to 8x on existing Ethernet Networks", at the Ethernet Summit

Thursday, February 9, 2012

• Chips&Media Partners with Solomon Systech to Build Leadership Position in Projector Market

Wednesday, February 8, 2012

• Semiconductor Industry Posts Record-Breaking Revenues Despite 2011 Challenges

Wednesday, February 8, 2012

• MoSys, Inc. Reports Fourth Quarter and 2011 Financial Results

Wednesday, February 8, 2012

• Rambus and NVIDIA Sign Patent License Agreement

Wednesday, February 8, 2012

• Methodics Announces Support for Latest Release of Subversion Version Control System to Enable More Efficient IC Design

Wednesday, February 8, 2012

• Elliptic Technologies Partners With ADSTEC Corporation To Offer Embedded Security Solutions To The Japanese Market

Tuesday, February 7, 2012

• Elliptic Unveils Innovative tVault Security Architecture For Trusted Execution Environments

Tuesday, February 7, 2012

• Ingenic Licenses Arteris Chip-to-Chip (C2C) IP Solution for Mobile Application Processors

Tuesday, February 7, 2012

• Ultra High-Performance MIPS64 Architecture Powers Cavium's New Multi-Core Processors

Tuesday, February 7, 2012

• CEVA to Showcase Leadership in Mobile DSP Technologies for Advanced Communication and Multimedia Applications at Mobile World Congress 2012

Tuesday, February 7, 2012

• Juniper Networks Adopts Jasper Formal Technology to Mitigate Design and Verification Risk

Tuesday, February 7, 2012

• eSilicon Expands SerDes IP Licensing Agreement with Avago Technologies

Tuesday, February 7, 2012

• Kilopass XPM Non Volatile Memory IP Qualified on TowerJazz 130nm CMOS

Tuesday, February 7, 2012

• ARM Mulls Non-Volatile Memory IP acquisition

Tuesday, February 7, 2012

• Zaltys ISDB-T Demodulator Core brings Digital Broadcast BER Testing Capability to Anritsu Spectrum Master and Cell Master Handheld Analyzers

Tuesday, February 7, 2012

• A cloudy future for AMD

Tuesday, February 7, 2012

• Silicon Wafer Revenues Up in 2011

Monday, February 6, 2012

• eoSemi secures $2.3 million second tranche of funding

Monday, February 6, 2012

• AMD Strategy Transformation Brings Agile Delivery of Industry-Leading IP to the Market

Monday, February 6, 2012

• Cadence Collaborates With Samsung Foundry to Deliver Design-for-Manufacturing Solution for 32-, 28- and 20-Nanometer Chip Design

Monday, February 6, 2012

• Rambus Acquires Unity Semiconductor

Monday, February 6, 2012

• Sequans Communications Selects S3 Group's Power Management Solution for WiMAX / LTE System on Chip

Monday, February 6, 2012

• INSIDE Secure chosen by leading Smartphone manufacturer To Power NFC Services with a major open operating system platform

Friday, February 3, 2012

• Nethra Imaging Introduces Ultra-Low-Power High Definition 1080p60 Visual and Computing Platform System-on-Chip

Friday, February 3, 2012

• TranSwitch Corporation Announces Fourth Quarter 2011 Financial Results

Friday, February 3, 2012

• IPextreme's Warren Savage to speak at GSA IP Summit

Friday, February 3, 2012

• Silicon Image Announces Fourth Quarter and Fiscal Year 2011 Earnings

Thursday, February 2, 2012

• Keil MDK-ARM support for Freescale MQX software provides greater choice and improved flexibility for designers using Kinetis microcontrollers based on the ARM Cortex-M4 processor

Thursday, February 2, 2012

• Sonics and Tensilica Team to Increase IP Integration, SoC Efficiencies

Thursday, February 2, 2012

• Qualcomm Chipset Powers First Successful VoIP-Over-LTE Call With Single Radio Voice Call Continuity

Thursday, February 2, 2012

• TSMC plans 3-D IC assembly launch early in 2013

Thursday, February 2, 2012

• Express Logic Brings High Performance to Cortex-M4 with ThreadX RTOS and NetX Duo TCP/IP Stack

Thursday, February 2, 2012

• Cadence Reports Fourth Quarter and Fiscal Year 2011 Financial Results

Thursday, February 2, 2012

• Mali graphics to lead in smart TVs, says ARM's East

Thursday, February 2, 2012

• Triad Semi Introduces Three New Via Configurable ASIC Arrays

Thursday, February 2, 2012

• Think Silicon GPUs get JPEG decoding from Alma Technologies

Wednesday, February 1, 2012

• Kilopass Announces Record Revenue for the Third Straight Year

Wednesday, February 1, 2012

• ARM Leading Intel In Process, Architecture And Design

Wednesday, February 1, 2012

• New Integration Between SpaceStudio Hardware Software Co-design and European Space Agency’s TASTE Tool Set

Wednesday, February 1, 2012

• ARM tips 'gods and giants' roadmap

Wednesday, February 1, 2012

• CEVA Announces Availability of Silicon-Based CEVA-XC Software Development Kit for the Rapid Design of Multi-Mode, Software-Defined Modems

Wednesday, February 1, 2012

• Sonics Responds to Arteris Complaint

Wednesday, February 1, 2012

• Faraday and UMC Strengthen IP Alliance for Advanced Nodes

Tuesday, January 31, 2012

• Breadth of MIPS-Based Products at CES 2012 Shows Strength of MIPS Architecture in Connected Home; Growing Presence in Mobile

Tuesday, January 31, 2012

• LTE Expected to Dominate Wireless Infrastructure Spending by 2013

Tuesday, January 31, 2012

• Semiconductor Industry Revenue to Endure Slow Growth in 2012

Tuesday, January 31, 2012

• CEVA, Inc. Announces Record Fourth Quarter and Year End 2011 Financial Results

Tuesday, January 31, 2012

• Xilinx Launches First Design Platforms for Accelerating 7 Series FPGA Design Productivity and System Integration