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Monday, January 16, 2012

• CAST Shipping New CAN Bus Controller IP Core

Monday, January 16, 2012

• ARM's East unimpressed with Medfield, design wins

Monday, January 16, 2012

• SuperSpeed USB-Enabled Device Shipments on Fast Track to 1 Billion in 2014

Monday, January 16, 2012

• IcyHeart EU project launch: Highly integrated ultra-low-power SoC solution for unobtrusive and energy-efficient wireless cardiac monitoring

Monday, January 16, 2012

• Scaleo chip and ARM Address the Need for Cleaner, More Energy-efficient Automotive Solutions

Monday, January 16, 2012

• Posedge Inc. Unveils "Multifunction Non-Volatile Memory Controller IP Platform" for SOC designers

Monday, January 16, 2012

• Silicon Harmony licenses PLL from Cosmic Circuits

Monday, January 16, 2012

• HomePlug Powerline Alliance Announces AV2 Specification for Next-Generation Broadband Speeds over Powerline Wires

Monday, January 16, 2012

• Windows on ARM will not be terribly successful says analyst

Monday, January 16, 2012

• Tensilica's ConnX Baseband Engine DSP Core Successfully Deployed by NXP Semiconductors

Friday, January 13, 2012

• Mentor Graphics Partners with Freescale to Deliver Vista-based Virtual Prototype Solution for Freescale Processors

Thursday, January 12, 2012

• EDA Consortium Reports Revenue Increase for Q3, 2011

Thursday, January 12, 2012

• Mentor Graphics Appoints Three New Executives

Thursday, January 12, 2012

• Multicore Security Processors Show Continued High Growth According to New Linley Group Report

Thursday, January 12, 2012

• AceThought introduces multi-threaded software video decoder suite for ARM Cortex-A9 MPCore and Cortex-A15 MPCore multi-core processors

Thursday, January 12, 2012

• Ridgetop Group Signs Contract with Boeing for Prognostic Condition-Based Maintenance Technology Development

Thursday, January 12, 2012

• IFI Announces Top Global Companies Ranked By 2011 U.S. Patents

Thursday, January 12, 2012

• PwC sees China growth despite IP fears

Wednesday, January 11, 2012

• Beijing Nufront Selects Arteris FlexNoC Interconnect IP and C2C for Mobile Phone Systems on Chip (SoC)

Wednesday, January 11, 2012

• Who are ARM's top ten customers?

Wednesday, January 11, 2012

• Vivante GPU Powers Leading Smart TV Platforms

Wednesday, January 11, 2012

• Intilop Corporation announces release of a whole new series of 4th Gen Ultra-Low latency; sub 100 ns, Full TCP Offload and UDP Offload Engines and System solutions for the entire Network Communication sector

Wednesday, January 11, 2012

• Kawasaki Microelectronics Licenses CAST 8051 IP Core for New Design Platform

Wednesday, January 11, 2012

• Imagination announces first PowerVR Series6 GPU cores

Wednesday, January 11, 2012

• Fab Spending Down in 2012 - Dip in First Half, but by Mid-Year Recovery Begins

Tuesday, January 10, 2012

• TSMC December 2011 Sales Report

Tuesday, January 10, 2012

• Multimedia and connectivity technologies transforming much wider markets than just smartphones, says Imagination

Tuesday, January 10, 2012

• Imagination's Ensigma UCCP330 delivers global broadcast TV demodulation plus Wi-Fi and Bluetooth

Tuesday, January 10, 2012

• Hua Hong NEC Deploys Springsoft's Laker IC Design and Verdi Debug to Accelerate PDK Development and Chip Verification

Tuesday, January 10, 2012

• Marvell and Tuxera Announce Industry's Fastest Full-Featured NAS Solution

Tuesday, January 10, 2012

• TCL and SENSIO announce planned integration of SENSIO Hi-Fi 3D technology in 3DTVs

Tuesday, January 10, 2012

• Aldec and SynthWorks deliver Randomization and Functional Coverage Capabilities to VHDL Designers with OS-VVM

Tuesday, January 10, 2012

• TI's OMAP platform powers Windows 8 tablets with advanced visual and computing capabilities

Tuesday, January 10, 2012

• IBM and GLOBALFOUNDRIES Begin First Production At New York's Latest Semiconductor Fab

Monday, January 9, 2012

• NXP Semiconductors Comments on Impact of Trident Microsystems Chapter 11 Filing Announces Conference Call to Review Fourth Quarter 2011 Financial Results

Monday, January 9, 2012

• SENSIO licenses its SENSIO Hi-Fi 3D decoding technology for 3DTV chips

Monday, January 9, 2012

• Memoir Systems Selects ChipStart as Global Sales Representative Company

Monday, January 9, 2012

• MIPS Technologies Teams with Leading Providers of Multimedia and Gaming Solutions to Enable Multi-screen Consumer Experience

Monday, January 9, 2012

• MIPS Technologies Teams with Gameloft to Bring Popular HD Games to MIPS-Based Android Tablets

Monday, January 9, 2012

• Cadence Expands Proven NAND Flash Design IP Offering With ONFI 3 PHY and Controller

Monday, January 9, 2012

• Microdul Adopts Advanced Mixed-signal Solution from DOLPHIN Integration and Tanner EDA and Leads Regional User Group to Drive Continued Innovation

Monday, January 9, 2012

• Why the semiconductor industry will rise again

Monday, January 9, 2012

• IP-Maker to deliver the first IP core compliant to the NVM Express specification

Monday, January 9, 2012

• Chips&Media to Exhibit its latest Video IP at CES 2012

Monday, January 9, 2012

• Enverv uses Cosmic Circuits ultra low-jitter PLL

Monday, January 9, 2012

• Tensilica's HiFi 3 DSP IP Core Provides Over 1.5x Better Performance for Audio Post Processing and Voice in Smartphones and Home Entertainment

Monday, January 9, 2012

• TranSwitch Corporation Provides Revised Guidance Regarding Fourth Quarter Results and Announces Extension to Agreement To Sublease Office Space

Monday, January 9, 2012

• Toshiba NAND Solutions Address Growing Demand for Error Correction

Monday, January 9, 2012

• JEDEC Publishes Breakthrough Standard for Wide I/O Mobile DRAM

Monday, January 9, 2012

• Toshiba Introduces Super Speed USB 3.0-Compliant USB Flash Memory

Monday, January 9, 2012

• UMC Reports Sales for December 2011

Saturday, January 7, 2012

• Needed: A U.S. manufacturing renaissance

Friday, January 6, 2012

• Cypress Announces USB-IF Certification of SuperSpeed USB 3.0 Controllers

Thursday, January 5, 2012

• Alvand Technologies Analog IP Portfolio Availability in TSMC’s 28nm Process

Thursday, January 5, 2012

• CEVA Announces Availability of CEVA-MM3101, a Programmable, Low Power Imaging and Vision Platform for Camera-Enabled Devices

Thursday, January 5, 2012

• TranSwitch Introduces HDwire, The World's Fastest, High Definition Video Panel Interface Solution

Thursday, January 5, 2012

• Mindspeed Technologies to Acquire Picochip

Thursday, January 5, 2012

• Xilinx Making Immersive 3D and 4K2K Displays Possible with 7 Series FPGA System Integration

Thursday, January 5, 2012

• RDA Microelectronics Signs Digital TV IP License and Development Agreement With Trident Microsystems

Thursday, January 5, 2012

• MoSys Partners with Macnica, Inc. Division, TecStar Company, to Strengthen Representation in Japan for its Bandwidth Engine(R) ICs

Thursday, January 5, 2012

• Socle Technology Develops ARM Mali Graphics Based SOC Designs Targeting 28nm Technology

Thursday, January 5, 2012

• Xilinx Paves the Way for a New Generation of Automotive Driver Assistance and Infotainment Systems at CES 2012

Thursday, January 5, 2012

• Lattice Semiconductor and Aptina Announce Dual Image Sensor Stereo Camera Reference Design for CES 2012

Thursday, January 5, 2012

• Semiconductor Inventory Declines as Suppliers Adjust to Slow Market Conditions

Thursday, January 5, 2012

• Tensilica HiFi Audio DSP Supports Dolby Volume to Eliminate Volume Fluctuations in Home Entertainment Systems and DTVs

Thursday, January 5, 2012

• Arasan Chip Systems Announces opening of two new Sales offices in Europe

Wednesday, January 4, 2012

• LSI Completes Acquisition of SandForce, Inc.

Wednesday, January 4, 2012

• Trident Microsystems, Inc. and Cayman Subsidiary File for Chapter 11 Protection

Wednesday, January 4, 2012

• Entropic Communications Files Intent to Purchase Trident Microsystems' Set-Top Box Business Unit

Wednesday, January 4, 2012

• EnSilica announces new design centre in India focusing on verification

Wednesday, January 4, 2012

• Cosmic Circuits announces silicon-proven PLL portfolio

Wednesday, January 4, 2012

• Test and Verification Solutions Limited (TVS) Announces Opening of German Office

Wednesday, January 4, 2012

• NVE Files Patent Infringement Suit Against Everspin Technologies

Wednesday, January 4, 2012

• Moortec Extend Temperature Sensor IP Offering to Global Foundries 28nm

Wednesday, January 4, 2012

• Tensilica Showcases Latest Customer Innovations in Smartphones, DTV, and Other Consumer Electronics Equipment at CES 2012