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Sunday, February 11, 2024

• DesignEuropa Awards 2024: Celebrating Europe's Creativity, Innovation, and Sustainability
• Cadence and Dassault Systemes Unveil the First Cloud-Enabled, Collaborative Experience to Transform the Development of Electromechanical Systems
• The next frontier in semiconductor innovation: Chiplets and the rise of 3D-ICs
• Qualcomm asks Samsung Foundry and TSMC to each build 2nm Snapdragon 8 prototypes
• T2M is excited to announce the successful licensing of our partner's Silicon-Proven 1G Ethernet PHY IP Cores on a Tier-1 Foundry in Korea, using the advanced 14LPP process, in collaboration with a leading Tier-1 Korean customer
• Flex Logix Joins Intel Foundry Services Accelerator IP Alliance to Enable Fast, Low Power, Reconfigurable SoC's
• Alphawave Semi Announces Appointment of Charlie Roach as Chief Revenue Officer
• Biden-Harris Administration Announces Over $5 Billion from the CHIPS and Science Act for Research, Development, and Workforce

Thursday, February 8, 2024

• Arm shares jump 50% on AI, China boosts to results
• Fraunhofer IIS Director Albert Heuberger Defines Germany's Semiconductor Industry
• Xiphera Receives Its First US Patent

Wednesday, February 7, 2024

• SK hynix, TSMC Form AI Semiconductor Alliance: Challenge to Samsung Electronics?
• Samsung Announces 2nm AI Chip Deal With HBM3 Memory
• Post-Quantum Cryptography Alliance Launches to Advance Post-Quantum Cryptography
• Innatera Productizes SNN Accelerator As "Neuromorphic Microcontroller"
• Kalray and Arm to collaborate to bring data intensive processing and AI acceleration DPU solutions to the global Arm ecosystem
• Dolphin Design announces the successful launch of its first silicon tape out in 12nm FinFet

Tuesday, February 6, 2024

• ESK-SIC and Kyocera to cooperate on sustainable production of silicon carbide
• SK hynix shows roadmap for using recycled materials
• SMIC Reports 2023 Fourth Quarter Results
• TSMC January 2024 Revenue Report
• VeriSilicon and Innobase jointly launch a 5G RedCap/4G LTE dual-mode modem solution
• Worldwide Silicon Wafer Shipments and Revenue Fall in 2023, SEMI Reports

Monday, February 5, 2024

• Siemens brings the power of multi-discipline simulation to axial flux motor development for next-generation EVs
• IMEC to site R&D fab in Malaga, Spain, say reports
• Bridges of Innovation: Fraunhofer IPMS and NY CREATES strengthen cooperation
• Innatera Productizes SNN Accelerator As 'Neuromorphic Microcontroller'
• Why China is betting big on chiplets
• Intel Foundry Announces 18A Design Win for 64-Core Arm SoC
• Socionext showcase cutting-edge SoC solutions at Embedded World 2024
• Trilinear Technologies Accelerates Innovation in Automotive Display Connectivity with DisplayPort Automotive Extensions Standard (DP AE)
• Movellus Recognized by Frost & Sullivan for Improving System Performance and Optimizing Power with Its Aeonicâ„¢ IP Portfolio
• Rambus Reports Fourth Quarter and Fiscal Year 2023 Financial Results
• Arasan's 2nd Gen CAN IP achieves ISO26262 ASIL-C Certification
• Tenstorrent Selects Blue Cheetah Chiplet Interconnect IP For Its AI and RISC-V Solutions
• SKAIChips License Ceva Bluetooth IP for Electronic Shelf Label IC
• Movellus Recognized by Frost & Sullivan for Improving System Performance and Optimizing Power with Its Aeonic™ IP Portfolio
• UMC Reports Sales for January 2024

Sunday, February 4, 2024

• Nordic Semiconductor signs multi-year deal to use Arm IP
• Eliyan Breaks Chiplet Memory Wall With Standard Packaging
• NoC configuration tool takes makes complex SoC design easier
• Samsung Receives Maiden 2nm AI Accelerator Order, Including HBM and Advanced Packaging
• AccelerComm Launches PUSCH Channel Simulator for 5G L1 Performance Evaluation
• Global Semiconductor Sales Decrease 8.2% in 2023; Market Rebounds Late in Year
• YorChip announces partnership with Digitho for enabling Secure Chiplets
• syn1588® IP Cores: Setting the Gold Standard in Precision for Clock Synchronization
• Eliyan Sets New Standard for Chiplet Interconnect Performance with Latest PHY Delivering Data Rate of 64Gbps on 3nm Process Using Standard Packaging
• Faraday Announces Plans to Develop Arm-based 64-core SoC on Intel 18A Technology
• Elevate Your Display and Camera SOC Capabilities with our latest Silicon Proven MIPI C-D Combo Tx/Rx PHY and DSI Controller IP Cores
• GUC Monthly Sales Report - January 2024
• Nordic Semiconductor and Arm reaffirm partnership with licensing agreement for latest low power processor designs, software platforms, and security IP

Friday, February 2, 2024

• Both Samsung and TSMC will be keeping 2nm chip manufacturing in their home countries

Thursday, February 1, 2024

• Cadence Unveils Millennium Platform - Industry's First Accelerated Digital Twin Delivering Unprecedented Performance and Energy Efficiency
• Tenstorrent Engineers Talk Open-Sourced Bare-Metal Stack
• SignatureIP launches its new iNoCulator NoC configuration tool with a free trial offer

Wednesday, January 31, 2024

• Women in Electronics - Challenges Remain
• Wi-Fi Certified 7 Is Here. A Wave of Qualified Products Follow Suit
• Marquee Semiconductor Engages Industry Veteran Gideon Intrater as Strategic Advisor
• BellSoft releases Liberica JDK 21 for RISC-V with support
• Codasip achieves certification for automotive functional safety and cybersecurity

Tuesday, January 30, 2024

• Synopsys Inaugurates Chip Design Center in Noida
• Europe's home-grown processor
• Introduction to AccelerComm© PUSCH Channel End-to-End Simulator
• Cadence Significantly Advances ECAD/MCAD Convergence for Electronic Systems with New Celsius Studio AI Thermal Platform
• Satisfy Your Chiplet Craving at the Chiplet Summit
• Navigating the RISC-V Revolution in Europe
• Alphawave Semi and Teledyne LeCroy Unveil PCIe 7.0 Signal Generation and Measurement
• Nubis Communications and Alphawave Semi Showcase First Demonstration of Optical PCI Express 6.0 Technology