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Friday, March 15, 2024
Intel will bring a performance-improving feature to its chips one year ahead of TSMC
Thursday, March 14, 2024
SoC Secure Boot Hardware Engine IP Core Now Available from CAST
Wednesday, March 13, 2024
PrimisAI Unveils Premium Version of RapidGPT, Redefining Hardware Engineering
embedded world 2024: Codasip demonstrates CHERI memory protection
QuickLogic and Zero-Error Systems Partner to Deliver Radiation-Tolerant eFPGA IP for Commercial Space Applications
Dolphin Design in Arm's Partner Catalog
Canaan's RISC-V based edge AIoT SoC adopted VeriSilicon's ISP and GPU IPs
Tuesday, March 12, 2024
New accelerated modeling for automotive development is here
University of Western Australia Latest to Join the BrainChip University AI Accelerator Program
Ecosystem Collaborations Bring Full Stack Software Solutions to Develop Leading-edge Automotive Applications From Day One
Arm's Broadest Ever Automotive Enhanced IP Portfolio Designed for the Future of Computing in Vehicles
Tenstorrent and MosChip Partner on High Performant RISC-V Design
We'll Need Many More Fabs to Meet $1 Trillion by 2030 Goal
Arteris Expands Ncore Cache Coherent Interconnect IP To Accelerate Leading-Edge Electronics Designs
Siemens to demonstrate first pre-silicon simulation environment for Arm Cortex-A720AE for Software Defined Vehicles
Arm Announces New Automotive Technologies to Accelerate Development of AI-enabled Vehicles by up to Two Years
Arteris Expands Automotive Solutions for Armv9 Architecture CPUs
HBM3 Initially Exclusively Supplied by SK Hynix, Samsung Rallies Fast After AMD Validation, Says TrendForce
Cadence Collaborates with Arm to Jumpstart the Automotive Chiplet Ecosystem
Arasan proudly releases its Radiation Hardened NAND Flash IP
Arasan proudly introduces the VESA VDC-M Encoder and Decoder IP
Monday, March 11, 2024
TI Commits to 100% Renewable Energy Worldwide by 2030
University of Western Australia Latest to Join the BrainChip University AI Accelerator Program
Pasqal aims for 10,000 qbit quantum computer in 2026
Cold Spin-Electronics for Quantum Technologies
The Imminent Arrival of 2-Nanometer Advanced Process
Global Top 10 Foundries Q4 Revenue Up 7.9%, Annual Total Hits US$111.54 Billion in 2023, Says TrendForce
Andes Technology: Cultivating Academic Collaboration for Over a Decade with Sustainable Spirit
Tiempo Secure's TESIC RISC-V IP Secure Element successfully characterized on GlobalFoundries' 22FDX technology node
Agile Analog delivers first full always-on IP subsystem
Monday, March 11, 2024
Omni Design Technologies Offers Swiftâ„¢ Data Converters for Advanced Software Defined Radio (SDR) Solutions
Sunday, March 10, 2024
Former Moortec executives create chip monitor startup
Free configurator puts the power of full core customisation into hands of customers
Elevate the performance of your Automotive Application by integrating the IP cores of a 14-bit wideband Time-Interleaved Pipeline Data Converters
Omni Design Technologies Offers Swift™ Data Converters for Advanced Software Defined Radio (SDR) Solutions
Alphawave Semi Demonstrates 3nm Silicon-Proven 24Gbps Universal Chiplet Express (UCIe) Subsystem for High-Performance AI Infrastructure
Re-imagining Imagination Technologies
OPENEDGES and SEMIFIVE Partnership Reinforce the SoC Platform
Thursday, March 7, 2024
TSMC February 2024 Revenue Report
M31's Revenue Grew Against the Trend by 18.5% Last Year and Will Increase Investment in Advanced Processes This Year
Credo Launches 112G PAM4 SerDes IP for TSMC N3 Process Technology
CAST Adds I3C Secondary Controller Core to MIPI IP Product Line
Wednesday, March 6, 2024
Samsung to use recycled neon gas in chip manufacturing
nepes corporation expands IC packaging capabilities for the 3D-IC era with advanced design flows from Siemens
Marvell Announces Industry's First 2nm Platform for Accelerated Infrastructure Silicon
sureCore announces ultra-low power memory IP for AI applications
SignatureIP announces PCIe Gen 6 Controller IP
Tuesday, March 5, 2024
QuickLogic (QUIK) Secures Five-year Contract for Its eFPGA IP
Revolutionizing Fuel Cell Production: Fraunhofer IPA and Partners Launch H2FastCell Robotics
Synopsys Supports AI-Bogged Data Centers With First 1.6T Ethernet IP
BrainChip Adds Edge Box to Chip and IP Offerings
Niobium and Veriest collaborate to develop the world's fastest complete FHE accelerator chip
Cadence to Acquire BETA CAE, Expanding into Structural Analysis
GUC Monthly Sales Report - February 2024
Industry Leading PPA DSP Available For All Existing EFLX eFPGA
Flex Logix Joins Intel Foundry USMAG Alliance
Ethernovia Unveils World's First Single and Quad Port, 10G to 1G Automotive PHY in 7nm
JEDEC Publishes GDDR7 Graphics Memory Standard
Imsys develops RISC-V core, looks to AI in space
Nuclei System Technology collaborates with Siemens to deliver RISC-V Processor Trace Encoder solution
Taalas emerges from stealth with $50 million in funding and a groundbreaking silicon AI technology
UMC Reports Sales for February 2024
Monday, March 4, 2024
The promise of OTS-only memories for next-gen compute
QuickLogic Announces eFPGA IP Contract for TSMC N12e™ Process Technology
Semidynamics puts the power of full core customisation into hands of customers
Scalable Extreme-Speed IPsec Added to Xiphera's Security Protocols Portfolio
BrainChip Boosts Space Heritage with Launch of Akida into Low Earth Orbit
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