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Thursday, July 14, 2011

• Setting the record straight on the Intel-TSMC 3-D 'race'

Thursday, July 14, 2011

• IC Knowledge's Cost Modeling of Semiconductor Manufacturing Shows Fully Depleted Silicon-on-Insulator Technology to be the Most Cost-effective Approach at the 22nm Node

Thursday, July 14, 2011

• A million ARM cores to host brain simulator

Thursday, July 14, 2011

• Socle Licenses Cortex A9 MPCore for Next Generation Platform Solutions

Wednesday, July 13, 2011

• Semicon keynoter urges new biz models

Wednesday, July 13, 2011

• ST lays out strategy for analysts in HK

Tuesday, July 12, 2011

• ARM Forecast to Significantly Increase Lead over MIPS, Power Architecture and x86 in the Battle for the Digital Home

Tuesday, July 12, 2011

• Cadence Acquires Azuro

Tuesday, July 12, 2011

• Cavium Networks Licenses Arteris FlexNoC Network on Chip Interconnect IP

Tuesday, July 12, 2011

• Gennum Snowbush IP Group Launches New Multi-Standard PHY IP Platform on TSMC 28nm

Tuesday, July 12, 2011

• GLOBALFOUNDRIES Fabs in New York and Dresden Achieve "Ready for Equipment" Milestone

Tuesday, July 12, 2011

• Thunderbolt: A lot of noise, but very little spark

Tuesday, July 12, 2011

• Dream Chip Technology Becomes Tensilica System-on-Chip (SOC) Design Center Partner

Tuesday, July 12, 2011

• Cadence Encounter Digital Flow Instrumental in Tapeout of Samsung 20-Nanometer Test Chip

Tuesday, July 12, 2011

• S2C Distributes Snowbush PCIe and SATA IP in China

Tuesday, July 12, 2011

• Synopsys Leads the Way in Delivering Dual-Patterning-Compliant 20nm IC Implementation Support

Tuesday, July 12, 2011

• Synopsys Announces Critical Milestone in 20-nm Design Enablement Collaboration With Samsung Electronics

Tuesday, July 12, 2011

• Samsung, in Collaboration with Physical IP and Design Enablement Partners, Confirms 20nm Design Infrastructure with Test Chip Tape-out

Tuesday, July 12, 2011

• Aldec Adds UVM Transaction-Level Visual Debugging

Monday, July 11, 2011

• Synopsys and GLOBALFOUNDRIES Collaborate to Deliver Interoperable Process Design Kits (iPDKs)

Monday, July 11, 2011

• New Freescale i.MX platform extends to advanced, low-power display applications

Monday, July 11, 2011

• LSI Now Shipping in Volume Second-Generation 40nm LDPC Read Channel for Hard Disk Drives

Monday, July 11, 2011

• Alvand Technologies Ships 1 Million Silicon Tuners for Digital TV

Monday, July 11, 2011

• Posedge Inc Appoints Richard Timpa as Vice President Sales

Monday, July 11, 2011

• SiliconBlue launches "Los Angeles", Custom Mobile Device platform for high-speed sensor management, custom connectivity and video and image solutions

Sunday, July 10, 2011

• TSMC June 2011 Sales Report

Friday, July 8, 2011

• Energy efficiency company Amantys secures significant funding from Fidelity International's Moonray Investors and ARM

Friday, July 8, 2011

• TowerJazz Sells its Holdings in HHSL for $32 Million

Friday, July 8, 2011

• Microtronix Introduces Camera Link IP Core Solution for Altera's Cyclone FPGAs

Friday, July 8, 2011

• Dolphin Integration's flexible audio converters allow minimum cost with the freedom of the Analog Front-End to be on a separate die

Thursday, July 7, 2011

• Taifatech Selects Elliptic Technologies' HDCP 2.0 Content Protection Solution To Deliver High Performance Streaming Media For The Digital Home

Thursday, July 7, 2011

• Innovative Logic announces free licensing of their USB 3.0 SuperSpeed IP

Thursday, July 7, 2011

• Microsemi Acquires ASIC Advantage, Inc.

Thursday, July 7, 2011

• MOSAID Sues HTC and Sony Ericsson on Newly Acquired Cellular Handset Patents

Wednesday, July 6, 2011

• VIA Technologies Announces Sale of Stake in S3 Graphics

Wednesday, July 6, 2011

• Valens Semiconductor Closes $14 Million Investment B Round

Wednesday, July 6, 2011

• Xilinx ISE Design Suite 13.2 Steps Up Designer Productivity and Brings Partial Reconfiguration to Kintex-7, Virtex-7 FPGAs

Wednesday, July 6, 2011

• MegaChips Selects Arteris High-Speed Inter-Chip Communications IP

Wednesday, July 6, 2011

• CEVA Enhances its CEVA-XC DSP Product Offering With HSPA+ Software IP

Wednesday, July 6, 2011

• Cortus APS3 Processor at the Heart of PointChips Touch Screen Controller Chip

Tuesday, July 5, 2011

• Lattice Announces First PCI Express 2.0 Compliant Low Cost FPGA

Tuesday, July 5, 2011

• Steady and Modest Growth Mark May 2011 Sales for Semiconductor Industry

Tuesday, July 5, 2011

• X-FAB Adds eFlash to High-Voltage 0.18 Micrometer Foundry Offering

Tuesday, July 5, 2011

• Imagination Technologies enables META connected processor embedded system development by University of Southampton students

Tuesday, July 5, 2011

• Logicview Selects Xilinx Virtex-6 FPGAs for Next Generation SoC Prototyping System & Emulation Platform

Monday, July 4, 2011

• HDL Design House Joins the Cadence IP Alliance Program

Monday, July 4, 2011

• Dolphin Integration revolutionizes subsystem performance validation with Application Hardware Modeling

Monday, July 4, 2011

• WiLAN and Texas Instruments Reach Agreement to End Litigation

Monday, July 4, 2011

• Cosmic Circuits M-PHY Silicon Proven in 40nm

Monday, July 4, 2011

• MTI Radiocomp enables 'base station on a chip' with JESD-solution

Monday, July 4, 2011

• Chips&Media's Video Codec Technology Used in Freescale’s Latest i.MX 6 Series