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Sunday, March 3, 2024

• Credo to Present at 36th Annual Roth Conference
• Siemens Unveils EcoTech Label for Enhanced Product Sustainability Transparency
• French cloud Scaleway starts renting Alibaba's RISC-V SoC
• Scaleway launches its RISC-V servers in the cloud, a world first and a firm commitment to technological independence
• Accellera Approves Verilog-AMS 2023 Standard for Release
• Agnisys to Showcase Expertise at DVCon US with Exclusive Short Workshop and Tutorial Sessions
• VeriSilicon's industry-leading embedded GPU IP powers HPMicro's high-performance HPM6800 series RISC-V MCU
• Intel Launches Altera, Its New Standalone FPGA Company
• Unleash Next-Gen Speeds with Silicon-Proven USB 3.0 PHY IP Cores with Type-C Support in Multiple Process Nodes
• Interview: Mahesh Tirupattur, executive VP of Analog Bits - "Be Passionate, Fail Fast and Recover Quick"
• Agile Analog's Christelle Faucon: "Diversity and Equality Are Critical"

Thursday, February 29, 2024

• Rambus Initiates Accelerated Share Repurchase Program
• European Union Seeks Chip Sovereignty Using RISC-V
• Partners Applaud Intel Foundry's Wider Ecosystem Approach
• ADTechnology and CoSignOn/CoreLink Sign MOU to Further Collaborate on High-Bandwidth Memory for Next-Generation HPC
• Sondrel announces two new design contract wins plus two existing Design Consultancy contracts extended

Wednesday, February 28, 2024

• Synopsys Launches Industry's First Complete 1.6T Ethernet IP Solution to Meet High Bandwidth Needs of AI and Hyperscale Data Center Chips
• VeriSilicon NPU IP is shipped in over 100 million AI-enabled chips worldwide
• Cadence Expands Tensilica Vision Family with Radar Accelerator and New DSPs Optimized for Automotive Applications
• proteanTecs Joins Arm Total Design, Brings Lifecycle Health and Performance Monitoring to Arm-based Custom SoCs

Tuesday, February 27, 2024

• Alliance aims to drive AI into the radio network
• FPT Corporation and Siemens Forge Partnership to Revolutionize Manufacturing and Digital Transformation
• AI for saving lives in automotive
• Cadence Expands Tensilica Vision Family with Radar Accelerator and New DSPs Optimized for Automotive Applications
• Alliance to drive AI into the radio network
• Intel puts 1nm process (10A) on the roadmap for 2027 - also plans for fully AI-automated factories with 'Cobots'
• Ceva Joins Arm Total Design to Accelerate Development of End-to-End 5G SoCs for Infrastructure and NTN Satellites
• QuickLogic Signs 7-Figure eFPGA IP Contract for GlobalFoundries' 12LP Process
• RAAAMâ„¢ Memory Technologies Expands Leadership Team With the Addition of Eli Leizerovitz as Chief Business Officer
• Cornell Tech Joins BrainChip University AI Accelerator Program

Tuesday, February 27, 2024

• Microchip's Low-Cost PolarFire® SoC Discovery Kit Makes RISC-V and FPGA Design More Accessible for a Wider Range of Embedded Engineers

Monday, February 26, 2024

• Bright minds wanted for chip design in Europe
• Intel Core Ultra Extends AI PCs to the Enterprise with New Intel vPro Platform
• EU Consortium Developing Next-Gen Edge-AI Technologies Is Accepting Design Proposals
• Xiphera and Missing Link Electronics Announce a Partnership for Encrypted Network Accelerator Solutions (ENAS)
• Andes and MachineWare Collaborate on Early RISC-V Software Development for AndesCore™ AX45MPV
• Microchip's Low-Cost PolarFire® SoC Discovery Kit Makes RISC-V and FPGA Design More Accessible for a Wider Range of Embedded Engineers
• LX Semicon Enters Mass Production with OPENEDGES' 22nm LPDDR4 PHY IP
• ASICFPGA releases new advanced Demosaicing core
• Tenstorrent RISC-V and Chiplet Technology Selected to Build the Future of AI in Japan

Sunday, February 25, 2024

• Quantum Computing Insights: Exploring the Latest Breakthroughs
• Crypto Quantique IoT security solutions expands to support cellular connectivity
• New Wave Design and Verification Appoints Darlene Weiss as Director of Human Resources
• Microchip Launches PolarFire RISC-V and FPGA Development Board
• Renesas Develops Embedded MRAM Macro that Achieves over 200MHz Fast Random-Read Access and a 10.4 MB/s Fast Write Throughput for High Performance MCUs
• Sequans Provides Statement on Renesas Termination of MOU and Announces Conference Call to Review Fourth Quarter and Full Year 2023 Results and Outlook for Full Year 2024
• Noesis Technologies releases its Ultra High Speed FFT/IFFT processor IP Core
• PQShield showcases high-performance PQC on AMD Versal at Mobile World Congress
• Largest CHIPS Act Awards Seen Coming for U.S. Companies
• Ceva Introduces its Next Generation Low Power Ultra-Wideband IP for FiRa 2.0 to Provide Highly Accurate and Reliable Wireless Ranging Capabilities for Consumer and Industrial IoT Applications
• M31 Powers Intel's IFS Alliance to Promote Advanced SoC Development and Innovation

Friday, February 23, 2024

• TSMC Celebrates the Opening of JASM in Kumamoto, Japan

Thursday, February 22, 2024

• Renesas Announces Termination of Memorandum of Understanding and Tender Offer for Proposed Acquisition of Sequans

Wednesday, February 21, 2024

• Intel Foundry Services Head Sees Advanced Packaging as "On Ramp" to Growth
• Faraday Reports Full-Year 2023 Results
• Arm Updates CSS Designs for Hyperscalers' Custom Chips
• Andes Technology and MetaSilicon Collaborate to Build the World's First Automotive-Grade CMOS Image Sensor Product Using RISC-V IP SoC
• M31 Promotes Advanced SoC Development and Innovation at Intel Foundry's Direct Connect Event
• Synopsys Posts Financial Results for First Quarter Fiscal Year 2024
• Arm and Nuro Partner to Deliver AI-first Autonomous Technology for Commercial Scale
• Weebit Nano demonstrates performance of its ReRAM under extended automotive conditions

Tuesday, February 20, 2024

• Vervesemi launches Made-in-India semiconductor ASIC
• The Future of Sustainability: How Semiconductors Pave the Way for a Stable Economy
• How Semiconductor Companies Can Help Drive Net Zero by 2050
• CEA-Leti Develops Novel Architecture for Keyword-Spotting (KWS) In Always-On, Voice-Activated Edge-AI Systems
• Intel Launches World's First Systems Foundry Designed for the AI Era
• Taiwan's 5-Bit Superconducting Quantum Computer Goes Online
• Tessolve's Ambitious Leap: Championing RISC-V's Global Surge from India
• BrainChip Begins Accepting Pre-Orders of the Akida Edge AI Box
• Siemens collaborates with Intel Foundry to contribute 3D-IC technology leadership for Intel's EMIB reference flow
• Siemens' breakthrough Veloce CS transforms emulation and prototyping with three novel products
• Siemens qualifies industry-leading IC design solutions for Intel Foundry processes
• Analog Bits Expands Engineering Presence by Opening a Design Center in Europe
• Synopsys and Intel Foundry Accelerate Advanced Chip Designs with Synopsys IP and Certified EDA Flows for Intel 18A Process
• Intrinsic ID Joins Intel Foundry Accelerator IP Alliance to Secure Leading-Edge Semiconductors
• Arteris Announces Financial Results for the Fourth Quarter and Full Year 2023 and Estimated First Quarter and Full Year 2024 Guidance