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Wednesday, October 13, 2010

• Broadcom Corporation to Acquire Beceem Communications Inc., a Leader in 4G Wireless

Wednesday, October 13, 2010

• Vitesse Leverages MIPS Processor IP for New Eco-Ethernet Switch Families

Wednesday, October 13, 2010

• HDL Design House announces high performance serializer deserializer (SerDes) for Serial Rapid IO protocol 2.1 (HIPA 21000) IP core

Wednesday, October 13, 2010

• Patriot Scientific Corporation Releases First Fiscal Quarter Report

Wednesday, October 13, 2010

• PMC-Sierra reportedly in talks to buy Wintegra

Wednesday, October 13, 2010

• Lattice Semiconductor Appoints Darin Billerbeck President and CEO

Wednesday, October 13, 2010

• GLOBALFOUNDRIES Expands Design Services Ecosystem with Three New Partners

Tuesday, October 12, 2010

• IUNIKA Licenses MIPS Technologies' Coherent Multiprocessing Systems for Computing and Mobile Computing Devices

Tuesday, October 12, 2010

• EDA Consortium Reports Revenue Increase for Q2 2010

Tuesday, October 12, 2010

• OCP-IP Partners with Duolog Technologies to Provide OCP Performance Analysis Solution

Tuesday, October 12, 2010

• Arteris Joins TSMC Soft IP Alliance

Tuesday, October 12, 2010

• Recore Systems Selects Synopsys' Galaxy Implementation Platform for Reconfigurable SoC Development

Tuesday, October 12, 2010

• S2C Represents Allegro DVT H.264/AVC Certification Streams and IP in China

Tuesday, October 12, 2010

• Altera Launches Embedded Initiative with New System Level Integration Tool for Embedded Systems Configurability

Tuesday, October 12, 2010

• Chips&Media Joins TSMC's Soft-IP Alliance Program

Tuesday, October 12, 2010

• Hyperstone selects Toshiba's ASIC technology, IP and services for development and manufacture of fabless semiconductor company's next-generation ICs

Tuesday, October 12, 2010

• Accent Closes 5 Million Euro In Series B Funding To Expand Smart Grid Technology Offering

Tuesday, October 12, 2010

• Sonics Teams With Chinese Systems Innovator to Deliver High-Performance, Low Power Laptop, Tablet SoCs

Tuesday, October 12, 2010

• Lattice Announces Update to ispLEVER FPGA Design Tool Suite

Tuesday, October 12, 2010

• New Lattice "Platform Manager" Transforms Board Power and Digital Management

Tuesday, October 12, 2010

• Cosmic Circuits receives TSMC's "Analog/Mixed Signal IP Partner of the Year" Award

Monday, October 11, 2010

• Jungo and Renesas Electronics America partner on USB for SuperH MPUs

Monday, October 11, 2010

• Evatronix Receives USB-IF Certification for Its SuperSpeed USB 3.0 Device IP Core

Monday, October 11, 2010

• MIPS Technologies Joins TSMC IP Alliance to Speed Customers' Time-to-Market

Monday, October 11, 2010

• Sonics Joins TSMC's Soft IP Alliance Program

Monday, October 11, 2010

• C-Compiler Support Now Available for LatticeMico8 Microcontroller

Monday, October 11, 2010

• ARM and SMIC Extend Comprehensive Product Portfolio of Free Libraries of Physical IP to 65nm and 40nm LL Process Technology

Monday, October 11, 2010

• TowerJazz and Crocus Complete First Stage Integration of TAS MRAM into 130nm CMOS Platform

Monday, October 11, 2010

• NXP Introduces New Energy Metering Chip

Monday, October 11, 2010

• SMIC CEO: China foundry vendor back on track

Monday, October 11, 2010

• Vivante Joins TSMC IP Alliance Program

Friday, October 8, 2010

• intoPIX delivers its high performance 4K JPEG 2000 decoder to Sony Corporation

Friday, October 8, 2010

• Dolphin Integration releases the evaluation kit for benchmarking at once Libraries and Memories

Friday, October 8, 2010

• TSMC September 2010 Sales Report

Thursday, October 7, 2010

• Ensphere Leverages TowerJazz's 0.18-micron SiGe BiCMOS Process to Achieve Fully Integrated One Chip Optical Transceiver IC

Thursday, October 7, 2010

• EnSilica and Pebble Bay collaborate to target automotive electronics design

Thursday, October 7, 2010

• Atego Ships its first Multi-core Virtual Machine for ARM Processors

Wednesday, October 6, 2010

• MindTree Unveils IP Suite to Target Bluetooth Low Energy Market

Wednesday, October 6, 2010

• LSI Accelerates Innovation with 28nm Custom Silicon Platform

Wednesday, October 6, 2010

• Qualcore Successfully validates USB 2.0 PHY in TSMC 90nm Technology

Wednesday, October 6, 2010

• First look inside iPhone 4 reveals high reuse

Wednesday, October 6, 2010

• 4M Wireless Completes LTE Protocol Stack Software Port For Tensilica's 3GPP LTE Reference Architecture

Wednesday, October 6, 2010

• eASIC Enables Early Rollout of On-Ramp Wireless' eNODE Solutions

Wednesday, October 6, 2010

• Sundance First to Combine FPGA and Power-PC440 with PCI Express for PC/104

Wednesday, October 6, 2010

• Semiconductor Intellectual Property Market Consolidating, Not Weakening

Tuesday, October 5, 2010

• WiLAN Initiates Litigation

Tuesday, October 5, 2010

• Elliptic Partners With Carbon Design Systems To Create Accurate System-Level Models

Tuesday, October 5, 2010

• Adesto Technologies Corporation Acquires Key Qimonda CBRAM Memory IP and Patents

Tuesday, October 5, 2010

• LSI Introduces Its First Standard Product System-on-a-Chip for Hard Disk Drive Manufacturers

Tuesday, October 5, 2010

• Xilinx ISE Design Suite 12.3 Introduces AMBA 4 AXI4 IP Cores, Enhances PlanAhead Design and Analysis Cockpit, Extends Power Optimization

Tuesday, October 5, 2010

• Appareo Systems Chooses Tuxera NTFS for Flight Data Monitoring Device

Tuesday, October 5, 2010

• TSMC Expands IP Alliance to Include Soft IP

Tuesday, October 5, 2010

• Moore Microprocessor Portfolio (MMP) Inventor Files Lawsuit against TPL Group

Tuesday, October 5, 2010

• NetLogic Microsystems licenses Imagination Technologies' visual IP technologies

Tuesday, October 5, 2010

• Microsemi CEO would kill some Actel products

Tuesday, October 5, 2010

• Why the Microsemi-Actel deal makes complete sense

Monday, October 4, 2010

• Silicon Image Unveils First MHL Products

Monday, October 4, 2010

• MOSAID Signs Wireless Patent License Agreement With a Top-Ranked Semiconductor Supplier

Monday, October 4, 2010

• Microsemi Corporation to Acquire Actel

Monday, October 4, 2010

• Microelectronics Technology Inc. and RadioComp ApS Sign Equity and Intellectual Property Acquisition Agreements

Friday, October 1, 2010

• A dynamic adaptation of libraries to performance with Dolphin Integration's mixing of standard cells stems

Friday, October 1, 2010

• OptNgn Delivers 2D-FFT FPGA Library Elements for use in Imaging and DSP applications

Friday, October 1, 2010

• SiliconBlue's New Paradigm Breaks Through the Volume Barrier

Friday, October 1, 2010

• CEA-Leti Makes a R&D 20nm Fully Depleted SOI Process available through CMP

Friday, October 1, 2010

• Acacia Subsidiary Enters into Settlement Agreement with Hynix

Friday, October 1, 2010

• TSMC gets nod for 130-nm production in China