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Tuesday, December 19, 2023

• 2023 MRAM Forum Shows MRAM For Automotive And Other Applications
• 2023 in Review: AI Takes Center Stage in the Eternal Quest for Innovation
• Intel Announces the Company's Largest Architectural Change in 40 Years
• SensiML launches Data Studio - sensor data management for AI/ML
• Samsung Seen Stumbling at Silicon's Leading Edge
• Siemens collaborates with sureCore and Semiwise to pioneer quantum computing ready cryogenic semiconductor designs
• Reed Solomon Encoder and Decoder FEC IP Core From Global IP Core
• TSMC Announces Dr. Mark Liu Not to Participate in Next Board of Directors Election
• GlobalLogic Announces Acquisition of Mobiveil
• Top Ten IC Design Houses Ride Wave of Seasonal Consumer Demand and Continued AI Boom to See 17.8% Increase in Quarterly Revenue in 3Q23, Says TrendForce

Monday, December 18, 2023

• Intrinsic ID to Showcase New Embedded Security Solutions at CES 2024
• Takashi Yamada, Memory Industry Expert Joins OPENEDGES to Lead Japan Business
• ST Engineering Acquires D'Crypt to Strengthen its Cyber Capabilities
• VeriSilicon and Google Collaborate on the Open-Source Project Open Se Cura

Sunday, December 17, 2023

• Siemens to tap EU chip cash with Cre8Ventures
• Infineon commits to set a science-based target and expands its climate strategy towards the supply-chain
• World's first UCIe heterogeneous chiplet test chip
• Apple-TSMC-Amkor Pact Bolsters U.S. Chip Supply Chain
• Igniting Innovation: Siemens EDA launches Cre8Ventures in support of the EU Chips Act
• Infineon, POLYN to Collaborate on Advanced Tire Monitoring Products
• BrainChip and Unigen Partner to Deliver Powerful, Energy-Efficient Edge AI Server

Saturday, December 16, 2023

• BrainChip and Unigen Partner to Deliver Powerful, Energy-Efficient Edge AI Server

Friday, December 15, 2023

• Siemens honours its best Inventors of 2023

Thursday, December 14, 2023

• CEA-Leti Reports Breakthrough 3D Sequential Integration (3DSI) Of CMOS Over CMOS with Advanced Metal Lines
• BSC presents Sargantana, the new generation of the first open-source chips designed in Spain
• BrainChip Previews Industry's First Edge Box Powered by Neuromorphic AI IP
• Alphawave Semi Partners with Keysight to Deliver Industry Leading Expertise and Interoperability for a Complete PCIe 6.0 Subsystem Solution

Wednesday, December 13, 2023

• Renesas Launches Cloud-Based Environment to Accelerate Automotive AI Software Development and Evaluation
• Cadence Managed Cloud Service Drives Automotive Sensor Solutions for Murata Finland
• Neurxcore leverages Aedvices VIPs for the verification of its neural processors
• QC Design announces launch of fault-tolerance design automation tool Plaquette+ and first sale to QuiX Quantum
• China and US Bolster Semiconductor Independence as Taiwan's Foundry Capacity Share Projected to Decline to 41% by 2027, Says TrendForce
• GigaDevice partners with SEGGER on Embedded Studio for RISC-V
• Imec's extremely scaled SOT-MRAM devices show record low switching energy and virtually unlimited endurance
• PUFsecurity and Himax Prioritize User Security and Data Protection in Endpoint AI with PUF-based Root of Trust
• Creonic GmbH Introduces Advanced 5G LDPC Encoder IP core for Enhanced Mobile Broadband Connectivity

Tuesday, December 12, 2023

• Maximize uptime, capacity utilization, and energy efficiency with always-ready CFD models and data center digital twin technology
• ST announces Edge AI Suite for Arm Cortex-M microcontrollers, sensors, and so on
• BrainChip Second-Gen Architecture: Transformers, TENNs and STDP
• Free development tools for Gigadevice RISC-V microcontrollers
• Xylon Offers ARTIEYE - a Complete Technology Suite for Customizable AI-based Driver Monitoring Systems
• Alchip Unveils AI 3DIC Design and IP Platform

Monday, December 11, 2023

• Logic Fruit Technologies Launches CAN Controller IP Core
• SCALINX and Arteris Partner on Advanced Communications Innovation
• AccelerComm Expands LDPC Accelerator IP Licenses for 5G Cloud RAN High-Capacity Solutions
• Continental and Synopsys Provide Vehicle Digital Twin Capabilities to Accelerate Software Development
• Rambus Wins 2023 "Most Respected Emerging Public Semiconductor Company" Award from Global Semiconductor Alliance
• Digital Core Design Presents DAES XTS Cryptographic CPU for Unparalleled Security
• Andes Awards Imperas 2023 Partner of the Year
• Visit Quadric at CES to Discover the GPNPU that Solves The Biggest ML Inference Chip Design Challenges

Sunday, December 10, 2023

• Infineon is one of the most sustainable companies globally
• Imec Presents Fundamentally New Way to Render Colors with Sub-micron Pixel Sizes that Revolutionizes Camera Performance
• EnSilica enters strategic partners with design and custom module developer IndesmaTech
• China Continues to Enhance AI Chip Self-Sufficiency, but High-End AI Chip Development Remains Constrained, Says TrendForce
• NEO Semiconductor Releases Technology CAD (TCAD) Simulation Data for Ground-Breaking 3D X-DRAM
• 12-bit 2GS/s high-speed ADC IP Core with Seamless Integration, Ultimate Precision is ready for Immediate Licensing

Thursday, December 7, 2023

• Layer transfer tech comes to high volume chiplet, 2nm manufacturing
• TSMC November 2023 Revenue Report
• Getting Ready for IoT Security in the AI Era