Search News

Wednesday, December 6, 2023

• Ceva Wins Product of the Year Award at Prestigious EE Awards Asia Event
• What Is Holding Back Neuromorphic Computing?
• CEA-Leti Paper in Nature Communications Reports First Complete Memristor-Based Bayesian Neural Network Implementation For Real-World Task
• NovaSparks Expands Its Operations in Asia-Pacific
• Access Advance Announces Major Additions to its HEVC and VVC Patent Pools
• Bluetooth Channel Sounding: Achieving 10cm Ranging Accuracy
• Siemens' new Calibre DesignEnhancer boosts Samsung Foundry design quality and speeds time to market

Wednesday, December 6, 2023

• ProvenRun secures €15 million Series A to accelerate its growth in security-by-design for the Internet of Things (IoT)

Tuesday, December 5, 2023

• 3GPP to Officially Begin Development of the 6G Specification
• Pragmatic Semiconductor secures £182m ($231m) investment led by M&G and UK Infrastructure Bank
• Tech Alert: BrainChip's "This is Our Mission" Podcast Discusses Trends in Edge AI with Arm Fellow Ian Bratt
• Using AI to find microplastics
• Siemens And Intel To Collaborate On Advanced Semiconductor Manufacturing
• Renesas Champions the RISC-V Cause With Its Own 32-bit RISC-V CPU
• China's 'Big Fund' is investing $1 billion in another domestic foundry, to advance sub-10nm chip manufacturing
• Samsung Electronics Tense Over TSMC-Apple-Amkor 'Arizona Alliance'
• JEDEC Publishes New CAMM2 Memory Module Standard
• Breker Verification Systems Appoints Andy Stein Vice President of Worldwide Sales as Company Scales New Business Opportunities
• Top 10 Foundries Experience 7.9% QoQ Growth in 3Q23, with a Continued Upward Trend Predicted for Q4, Says TrendForce
• Ceva Launches New Brand Identity Reflecting its Focus on Smart Edge IP Innovation
• ProvenRun secures €15 million Series A to accelerate its growth in security-by-design for the Internet of Things (IoT)
• Intrinsic ID Launches First Hardware Root-of-Trust Solution to Meet Functional Safety Standards for Automotive Market
• Lattice Collaborates with NVIDIA to Accelerate Edge AI
• Global Semiconductor Sales Increase 3.9% Month-to-Month in October; Annual Sales Projected to Increase 13.1% in 2024
• Pragmatic Semiconductor secures £182m ($231m) investment led by M&G and UK Infrastructure Bank
• UMC Reports Sales for November 2023

Monday, December 4, 2023

• Keeping It 100: RISC-V Reality Check
• Applied Materials and CEA-Leti Unveil Joint Lab For Rapidly Growing Specialty Chip Markets
• Tenstorrent Strengthens Presence in Asia with Rapidus Partnership
• Agile Analog partners with sureCore on CryoCMOS Innovate UK project
• Xiphera Announces Support for Extreme-Speed IPsec
• Rambus Protects Data Center Infrastructure with Quantum Safe Engine IP
• GUC Monthly Sales Report - November 2023

Sunday, December 3, 2023

• Cadence Powers Samsung Foundry's Breakthrough Success on 5G Chip Design
• Quantum effect technology breakthrough in analogue circuit design
• BrainChip Attracts Former Intel AI Sales Executive to Head Up Sales
• Canonical joins the RISC-V Software Ecosystem (RISE)
• USPTO announces Semiconductor Technology Pilot Program in support of CHIPS for America Program
• Gartner Forecasts Worldwide Semiconductor Revenue to Grow 17% in 2024
• Silicon Proven DisplayPort v1.4 Tx PHY IP Core in 12nm, Alongside Production-Ready Controller IP core available for Immediate Licensing
• EMA Design Automation to Spin-Off IP & Services Group to Enable Digital Transformation for the Entire CAD Industry
• Q3 2023 Global Semiconductor Equipment Billings Drop 11% Year-Over-Year, SEMI Reports
• ADTechnology is accelerating its performance and targeting infrastructure markets by joining Arm Total Design.

Thursday, November 30, 2023

• Energy Collaborative to Help Accelerate Installation of Greener Energy Sources in APAC
• Leadership Spotlight: Sanjeev Kumar Earns Global CEO Business Excellence Award
• Lockheed Martin Prepares First 5G.MIL® Payload for Orbit
• Faraday Receives ISO/IEC 27001:2022 Certification for Information Security Management System

Wednesday, November 29, 2023

• Cadence Signoff Solutions Empower Samsung Foundry's Breakthrough Success on 5G Networking SoC Design
• BrainChip Details Olfactory Capabilities of Identifying Bacteria in the Blood in New Research Report
• Agile Analog's New VP Sales to Expand Ties With Foundries
• Credo Technology Group Holding Ltd Reports Second Quarter of Fiscal Year 2024 Financial Results
• Agnisys Announces Wacom Selects IDesignSpecâ„¢ to Automate Its IP and Chip Development Flow from Executable Specifications
• Synopsys Posts Financial Results for Fourth Quarter and Fiscal Year 2023
• QuickLogic Secures New eFPGA IP Contract on UMC's 22nm Process
• Renesas Unveils the First Generation of Own 32-bit RISC-V CPU Core Ahead of Competition

Tuesday, November 28, 2023

• Amidst export restrictions, RISC-V continues to advance
• European tech funding dropping but better than elsewhere
• AI Puts the "Ability" in Sustainability
• Crypto Quantique partners with Blaitek enabling quantum secure chip-to-cloud connection
• Omni Design Technologies Announces Expanded Silicon IP Solutions on Multiple TSMC Processes
• Unleashing Edge AI Potential: Eta Compute's New Collaboration with NXP Semiconductors
• M31 Completes Validation of 7nm ONFI 5.1 I/O IP - Targeting for the Global AI Big Data Storage Market
• Untether AI Joins UCIe Consortium to Drive Chiplet Technology and Energy-Centric AI Acceleration
• Manufacturers Anticipate Completion of NVIDIA's HBM3e Verification by 1Q24; HBM4 Expected to Launch in 2026, Says TrendForce
• Eliyan Appoints former head of Facebook/Meta AI infrastructure Dr. Jason Taylor to Board of Directors
• Quantum Effect Technology Breakthrough in Analog Circuit Design
• Intel to place US$14 billion orders with TSMC, says report
• Logic Fruit Technologies Launches LIN Master Slave IP Core

Monday, November 27, 2023

• Secure-IC Among The 50 Most Promising SMEs
• STMicroelectronics, ERG Sign Agreement for the Supply of Renewable Energy in Italy
• Corporates embrace sustainability
• Siemens revolutionizes engineering simulation with HEEDS AI Simulation Predictor and Simcenter Reduced Order Modeling
• Bridging the Talent Gap in Flanders' Semiconductor Industry
• Arteris Celebrates 3rd Year of Automotive ISO 26262 TCL1 Functional Safety Compliance for Magillem SoC Integration Automation
• Jayson Bethurem Joins Flex Logix as VP Marketing & Business Development
• Production Proven USB 3.2 Gen1/Gen2 IP Cores to ensure a seamless throughput for Next-Gen SoCs available for Immediate licensing

Monday, November 27, 2023

• Weebit Nano receives wafers manufactured in GlobalFoundries' 22FDX® process

Sunday, November 26, 2023

• Tenstorrent Gains Momentum in Asia With Rapidus Partnership
• Market Leaders Collaborate with Synopsys to Realize Gains of Generative AI Across Synopsys.ai Full EDA Stack