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Friday, May 29, 2009

• Xilinx Announces Ninth Circuit Court Ruling

Friday, May 29, 2009

• New patented solutions from Dolphin Integration for pop-up noise reduction

Friday, May 29, 2009

• Sundance Boosts 4G Offer with New WiMAX Solution

Friday, May 29, 2009

• Mentor Graphics Reports Fiscal First Quarter Results

Friday, May 29, 2009

• MindTree Lists Bluetooth Health Device Profile (HDP)

Friday, May 29, 2009

• Denali MemCon Silicon Valley 2009 "Beacons of Innovation" Agenda Features Industry Leaders' Insight and Visions for Memory and Storage Solutions

Thursday, May 28, 2009

• Radiocomp releases their CPRI v4.0 compliant IP core for LTE, WCDMA, CDMA and WIMAX supporting speeds up to 6.144 Gbps independently from the selected silicon technology

Thursday, May 28, 2009

• Sarance Announces Availability of Complete Connectivity Solutions for Netronome's Network Flow Processors

Thursday, May 28, 2009

• Start-up claims breakthrough in reconfigurable logic

Thursday, May 28, 2009

• HDMI Licensing, LLC Announces Features of the Upcoming HDMI Specification Version 1.4

Wednesday, May 27, 2009

• SanDisk and Samsung Renew Patent Cross License and Flash Supply Agreements

Wednesday, May 27, 2009

• TSMC Launches Unified Interconnect Modeling Format for Advanced Process Technologies

Wednesday, May 27, 2009

• Synopsys Releases DesignWare SATA IP for New SATA 6Gbps Data Transfer Rate

Wednesday, May 27, 2009

• Jazz Semiconductor's DIRECT Multiproject Wafer (MPW) Shuttle Program Enables Rapid Design Verification and Faster Time-to-Market

Wednesday, May 27, 2009

• U.S. District Court Orders Hynix to Post Security for Infringing Rambus Patents

Wednesday, May 27, 2009

• Netronome Licenses ARM Multiprocessing Technology For Next-Generation Network Flow Processor

Wednesday, May 27, 2009

• Netronome's Network Flow Processor Utilizes Denali's Suite of PCI Express 2.0 Products for Virtualized Servers and Network Equipment

Wednesday, May 27, 2009

• Feedback: 6 critical keys to IP licensing success

Tuesday, May 26, 2009

• Rambus Unveils New Innovations for Main Memory

Tuesday, May 26, 2009

• Xilinx & BEEcube to Unveil Next-Generation FPGA-based Multi-core SoC Development Platform for Sun OpenSPARC

Tuesday, May 26, 2009

• NXP Unveils Industry's Lowest Power Cortex-M3 based Microcontrollers

Tuesday, May 26, 2009

• SiliconXpress Provides One-Stop Design, Fab, Test, and Packaging Services as Newest Tensilica Design Center

Tuesday, May 26, 2009

• Dongbu HiTek Selects Kilopass Embedded NVM Solution for 0.18um BCD Process

Tuesday, May 26, 2009

• CEVA and mimoOn to Collaborate on Development of LTE Baseband Solutions

Tuesday, May 26, 2009

• ARC and Realtek Sign Agreement to Extend Reach of ARC Sonic Focus Audio Technology into PCs and Laptops

Monday, May 25, 2009

• Scaleo chip introduces easyBCU, new highly-integrated and powerful 32-bit Flash microcontroller family for next-generation car body electronics

Monday, May 25, 2009

• ELMOS Semiconductor and Dolphin Integration cooperate for innovation in schematics edition

Monday, May 25, 2009

• China's move to design creates IP worries

Monday, May 25, 2009

• ST considering sale of memory business, says report

Friday, May 22, 2009

• Vivante GPU IP Chosen By Leading Mobile Multimedia SoC Provider

Thursday, May 21, 2009

• IP Cores from Eureka Technologies Validated for Mentor Graphics' Precision FPGA Synthesis

Thursday, May 21, 2009

• Semiconductor Memory Start-Up Unity Semiconductor Closes $22M Series C Financing

Thursday, May 21, 2009

• Unity Semiconductor, a Non-Volatile Memory Products Start-up, Exits Stealth Mode; World's First R/W Cross-Point Memory Array Requires No Transistor in Memory Cell

Thursday, May 21, 2009

• Synopsys Posts Financial Results for Second Quarter Fiscal Year 2009

Wednesday, May 20, 2009

• ARM RealView Development Suite: Enhanced Platform Support For Atmel, Freescale, Samsung, ST and TI Devices

Wednesday, May 20, 2009

• Atmel and ARM Expand Strategic Relationship With Subscription License Agreement

Wednesday, May 20, 2009

• Virage Logic Introduces First Commercially Available Multi-Time Programmable Non-Volatile Memory Solution at 65-Nanometer Low Power

Wednesday, May 20, 2009

• ARC International plc -- Interim Management Statement

Wednesday, May 20, 2009

• GDA Technologies to Demonstrate 'Pravega' Family of Configurable USB 3.0 Controllers

Wednesday, May 20, 2009

• eMemory Announces Availability of Low Cost OTP Mass Production Solution - NeoROM

Wednesday, May 20, 2009

• WideSail Technologies announces availability of their 10 Gb Ethernet FEC Decoder

Wednesday, May 20, 2009

• Agilent Technologies to Demonstrate Industry-First USB 3.0 Tests with NEC Electronics’ USB 3.0 Host Controller

Wednesday, May 20, 2009

• Fresco Logic showcases World's First Working PCI Express to SuperSpeed USB xHCI Host Single-Chip Solution

Tuesday, May 19, 2009

• Tokyo Electron Device Announces ASIC/LSI Prototyping Board Released Featuring DDR3 SDRAM and LV-DDR2 SDRAM

Tuesday, May 19, 2009

• Mixel Celebrates 10 Years of Mixed-Signal Excellence

Tuesday, May 19, 2009

• ARM Selects Jasper for Formal Verification of IP

Tuesday, May 19, 2009

• Incoras Solutions announces MediaDesigner, an Eclipse-based Design and Test Workbench for OpenMAX IL Development

Tuesday, May 19, 2009

• T-RAM and GLOBALFOUNDRIES Enter into Joint Development Agreement for Application of T-RAM's Thyristor-RAM Embedded Memory to Advanced Technology Nodes

Tuesday, May 19, 2009

• Cadence and Virtutech Extend Metric-Driven Verification to Virtual Systems Development

Tuesday, May 19, 2009

• Cadence Speeds Systems Development with Automated Transaction-Level Verification

Tuesday, May 19, 2009

• Analysis: Dissecting the MIPS-Chipidea breakup

Monday, May 18, 2009

• The SPIRIT Consortium Announces Release of the SystemRDL Specification

Monday, May 18, 2009

• Innovision and NXP announce joint NFC marketing and licensing agreement

Monday, May 18, 2009

• NEC Electronics Introduces World's First USB 3.0 Host Controller

Monday, May 18, 2009

• NXP Semiconductors Accelerates Design Cycle using New Cadence Encounter Digital Implementation System for Industry’s First 45nm Digital TV Processor

Monday, May 18, 2009

• Hynix Semiconductor, LG Electronics, Samsung Electronics and Silicon Image Sign Long-Term Agreement to Create the Next-Generation Memory Interface Technology Specification

Monday, May 18, 2009

• Altera Ships Arria II GX FPGAs: High-Performance, Low-Cost Transceiver FPGAs for 3-Gbps Applications

Monday, May 18, 2009

• PLDA Achieves IP Success with Cadence SuperSpeed USB (USB 3.0) Verification IP

Monday, May 18, 2009

• SpringSoft Introduces Structured Method for SystemVerilog Testbench Debug and Analysis

Monday, May 18, 2009

• XMOS starts shipment of XS1-G2 devices

Monday, May 18, 2009

• ARM Welcomes TI Acquisition of Luminary Micro

Monday, May 18, 2009

• CEVA and Aricent to Demonstrate LTE PHY Platform for Cellular Handsets

Monday, May 18, 2009

• S3 and Percello Collaborate to Produce Latest Femtocell Baseband Processor