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Friday, July 31, 2009

• Agilent and Wi-LAN Enter Wireless License Agreement

Friday, July 31, 2009

• HDL Design House announces Serial Rapid IO soft IP core (HIP 3300)

Friday, July 31, 2009

• Imagination Technologies considers growth by acquisition

Thursday, July 30, 2009

• Possible offer for ARC International PLC

Thursday, July 30, 2009

• TSMC Reports Second Quarter EPS of NT$0.94

Thursday, July 30, 2009

• Mentor Graphics Unveils Android and Embedded Linux Strategy with Acquisition of Embedded Alley

Thursday, July 30, 2009

• Mentor Graphics Announces Nucleus Graphics and Linux Platform for ARM Mali GPUs

Wednesday, July 29, 2009

• Cadence Reports Q2 2009 Financial Results

Wednesday, July 29, 2009

• Virage Logic Reports Third Quarter Fiscal 2009 Results

Wednesday, July 29, 2009

• picoChip and Elliptic Collaborate on Comprehensive Security Solution for Femtocell SoC

Wednesday, July 29, 2009

• Altera Extends Temperature Range of Stratix III FPGAs to Support Military Applications

Wednesday, July 29, 2009

• CEVA, Inc. Announces Second Quarter 2009 Financial Results

Wednesday, July 29, 2009

• Arasan Chip Systems First to Announce e.MMC 4.4 Card Controller IP Core

Wednesday, July 29, 2009

• GLOBALFOUNDRIES Announces Strategic Customer Engagement with STMicroelectronics

Wednesday, July 29, 2009

• TSMC keynoter touts cooperative business models

Wednesday, July 29, 2009

• ARM Sees Demand For HD Mobile Media And Entertainment Grow As Mali GPU Licensing Momentum Continues

Wednesday, July 29, 2009

• MOSIS Marks Expanded Semiconductor Foundry Offerings With Shuttle Runs for Silicon-On-Insulator (SOI)

Wednesday, July 29, 2009

• eMemory's Neobit OTP reaches 1 million wafer production mark; IP solutions for 65 nm processes launched

Wednesday, July 29, 2009

• MoSys, Inc. Reports Second Quarter 2009 Financial Results

Wednesday, July 29, 2009

• Actel Announces Second Quarter 2009 Financial Results

Tuesday, July 28, 2009

• Physical layer and protocols provide complete MIPI IP solution for SoC development

Tuesday, July 28, 2009

• Altera's 40-nm Arria II GX FPGAs Achieve PCI-SIG Compliance for PCIe Express 2.0 Specification

Tuesday, July 28, 2009

• Mirics targets ARM processor-based smartphones with FlexiTV

Tuesday, July 28, 2009

• The TSMC Tsunami at DAC 2009

Tuesday, July 28, 2009

• Virage Logic Extends IP Technology Leadership to the 32/28nm Process

Tuesday, July 28, 2009

• Virage Logic Introduces Volume Production-Proven SiPro PCI Express PHY IP

Tuesday, July 28, 2009

• Fujitsu Launches USB 3.0 to SATA Bridge IC

Tuesday, July 28, 2009

• Leading EDA Companies Join New ARM Fast Models Enablement Program

Tuesday, July 28, 2009

• austriamicrosystems to manufacture Triad Semiconductor's Via-Configurable SoC Solution

Tuesday, July 28, 2009

• ARM Holdings plc Reports Results for the Second Quarter and Half Year Ended 30 June 2009

Monday, July 27, 2009

• ARM, Chartered, IBM, Samsung, and Synopsys Collaborate to Deliver Vertically Optimized Solution for 32/28nm Mobile SoC Designs

Monday, July 27, 2009

• Xilinx Virtex-6 FPGAs Enable Highest PCIe Bandwidth for Mainstream Applications With Compliant PCI Express 2.0 Endpoint

Monday, July 27, 2009

• Dolphin Integration launches moDAC95-LB combining smallest silicon area and optimized Bill-of-Material

Monday, July 27, 2009

• MediaTek Deploys CoWare Solutions to Improve Product Development Cycle

Monday, July 27, 2009

• ARM Announces Ultra Low-Power Physical IP Technology to Drive Next-Generation MCU Devices

Monday, July 27, 2009

• Atmel Standardizes on DDR2 for 400 MHz, High Speed-USB-enabled ARM9-based Embedded MPUs

Monday, July 27, 2009

• Calypto Delivers Fully Automated Sequential Optimization Flow for High-performance IP Blocks

Monday, July 27, 2009

• SMIC 130nm Process Used in Commercial Production of DisplayLink USB Graphics Chips

Monday, July 27, 2009

• Magillem Releases its Verification Solution to Complement Its Existing Suite of Tools

Monday, July 27, 2009

• Virtutech Announces Simics Full-System Checkpointing for SystemC Based Transaction-Level Modeling

Monday, July 27, 2009

• Altera Speeds Development of High-Performance 3-Gbps Applications With Arria II GX Development Kit

Monday, July 27, 2009

• FPGA startups stare down giants and ghosts

Monday, July 27, 2009

• Evatronix Releases JPEG 2000 Image Compression Encoder Optimized for FPGA Designs

Monday, July 27, 2009

• Samsung and Intrinsity Jointly Develop the World's Fastest ARM Cortex-A8 Processor Based Mobile Core in 45 Nanometer Low Power Process

Monday, July 27, 2009

• Kilopass Lowers Manufacturing Cost With ROM Conversion Option

Monday, July 27, 2009

• Agnisys announces an innovative tool for Verification Management and Requirement Tracking

Monday, July 27, 2009

• TSMC and Global Unichip Collaborate On Silicon Proven SiP Solution in TSMC Reference Flow 10.0

Monday, July 27, 2009

• Chips&Media and Innofidei Unveil New Chip Design for CMMB in China Market

Friday, July 24, 2009

• Atmel Introduces the AT697F Radiation-Hardened SPARC V8 Processor for Space Missions

Friday, July 24, 2009

• Grace announces a new cost-effective platform of 0.18um OTP for speech IC and micro controller

Friday, July 24, 2009

• Faraday Reported 2009 Second Quarter Results

Friday, July 24, 2009

• Lattice Semiconductor Reports Second Quarter 2009 Financial Results

Friday, July 24, 2009

• Silicon Image Reports Second Quarter 2009 Financial Results

Friday, July 24, 2009

• Denali Expands PureSpec Solution for Predictable Protocol Verification

Friday, July 24, 2009

• Rambus Reports Second Quarter Earnings

Thursday, July 23, 2009

• Six Early Adopters Select USB 3.0 Verification IP From Denali Software

Thursday, July 23, 2009

• Nangate Releases a New Version of the 45nm Open Cell Library

Thursday, July 23, 2009

• Ralink Employs MIPS32 74K Processors in New 802.11n Dual Band WLAN AP/Router SoC

Thursday, July 23, 2009

• Austereo licenses audio IP core portfolio from Coreworks including SPDIF, I2S/LJ/RJ serial interfaces and asynchronous sample rate converter for use in radio broadcasting equipment

Thursday, July 23, 2009

• Validity Sensors Licenses Two Tensilica Processors for High-Volume Fingerprint Sensors

Thursday, July 23, 2009

• Evatronix And Soft-Mixed Signal Announce USB 2.0 Total Solution

Thursday, July 23, 2009

• The business of IP: it ain't a bake sale

Thursday, July 23, 2009

• OVM World Collaborates on Accellera's Industry Solution for VIP Interoperability

Wednesday, July 22, 2009

• True Circuits Attends DAC, Features Complete Line of PLL and DLL IP

Wednesday, July 22, 2009

• MOSAID Now Sampling HLNAND Flash Memory Semiconductor Chip and Module

Wednesday, July 22, 2009

• Silicon Image Introduces New IP Core Product Family Supporting HDMI(R) 1.4 Features

Wednesday, July 22, 2009

• Silicon Image Introduces First Port Processor With 3D Over HDMI Capability

Wednesday, July 22, 2009

• Samsung First to Begin Mass Producing 2-Gigabit DDR3 Using 40nm Class Technology

Wednesday, July 22, 2009

• TSMC Extends Design Methodology Leadership to 28nm with Reference Flow 10.0

Tuesday, July 21, 2009

• Synopsys' New DesignWare IP Slashes Power in Datapath Circuits

Tuesday, July 21, 2009

• Key ASIC Collaboration to Expand Its ASIC Products and Licenses PowerPC

Tuesday, July 21, 2009

• Pigeon Point Systems Delivers First TCA Management Controller Solution with Advanced In-Shelf LAN Attachment

Tuesday, July 21, 2009

• Arasan Chip Systems Releases SuperSpeed USB 3.0 Software Stacks

Tuesday, July 21, 2009

• Virage Logic Offers Broadest Portfolio of Embedded Non-Volatile Memory (NVM) Solutions at TSMC

Tuesday, July 21, 2009

• TSMC Launches Unified Physical Verification Format for Advanced Process Technologies

Tuesday, July 21, 2009

• Chips&Media Delivers the Latest Full HD Codec IP Core Coda8550

Monday, July 20, 2009

• SiliconXpress Receives Series A Funding

Monday, July 20, 2009

• Sequence Launches PowerArtist-XP - Industry's First Automatic, Fully Integrated RTL Design For Power Platform

Monday, July 20, 2009

• Report: India to pursue homegrown microprocessor design

Monday, July 20, 2009

• CoFluent Design Closes the Modeling GAP for Virtual Platforms

Monday, July 20, 2009

• Siemens Uses CoFluent to Create Models for Virtual Platform Simulation

Monday, July 20, 2009

• NXP Successfully Deploys Integrated CoWare and ARM Cortex Processor-based Solution in its Virtual Prototyping Environment

Monday, July 20, 2009

• Calsoft Becomes Tensilica Software Design Center, Supporting Next-Generation Video/Audio and Security Oriented Application Designs

Monday, July 20, 2009

• Evatronix IP successfully implemented by HAPA AG to support their printer controllers

Monday, July 20, 2009

• Virage Logic Receives Letter of Reprimand From NASDAQ Department

Monday, July 20, 2009

• Study: FPGAs to grow faster than broader IC market