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Audio / Video
Wednesday, February 14, 2024
zeroRISC, Nuvoton and Winbond Join Forces to Deliver the First Commercial Product Based on the OpenTitan® Open-Source Secure Silicon Platform
Tuesday, February 13, 2024
ARM bids for chiplet dominance
Logic Fruit Welcomes Vishal Sinha as a People Management Consultant
OpenTitan® Partnership Makes History as First Open-Source Silicon Project to Reach Commercial Availability
zeroRISC, Nuvoton and Winbond Join Forces to Deliver the First Commercial Product Based on the OpenTitan® Open-Source Secure Silicon Platform
Ceva, Inc. Announces Fourth Quarter and Full Year 2023 Financial Results
OpenTitan® Partnership Makes History as First Open-Source Silicon Project to Reach Commercial Availability
Saankhya Labs receives approval under Semiconductor Design Linked Incentive (DLI) scheme for Development of a System-on-Chip (SoC) for 5G Telecom infrastructure equipment
Monday, February 12, 2024
What Role Will Open-Source Development Play in Quantum Computing?
EdgeQ Deploys Arteris IP for its 5G+AI Base Station-on-a-Chip for Wireless Infrastructure
Join Secure-IC at Mobile World Congress 2024 to discover our cutting-edge solutions for mobile and connectivity
Cadence Reports Fourth Quarter and Fiscal Year 2023 Financial Results
Sunday, February 11, 2024
DesignEuropa Awards 2024: Celebrating Europe's Creativity, Innovation, and Sustainability
Cadence and Dassault Systemes Unveil the First Cloud-Enabled, Collaborative Experience to Transform the Development of Electromechanical Systems
The next frontier in semiconductor innovation: Chiplets and the rise of 3D-ICs
Qualcomm asks Samsung Foundry and TSMC to each build 2nm Snapdragon 8 prototypes
T2M is excited to announce the successful licensing of our partner's Silicon-Proven 1G Ethernet PHY IP Cores on a Tier-1 Foundry in Korea, using the advanced 14LPP process, in collaboration with a leading Tier-1 Korean customer
Flex Logix Joins Intel Foundry Services Accelerator IP Alliance to Enable Fast, Low Power, Reconfigurable SoC's
Alphawave Semi Announces Appointment of Charlie Roach as Chief Revenue Officer
Biden-Harris Administration Announces Over $5 Billion from the CHIPS and Science Act for Research, Development, and Workforce
Thursday, February 8, 2024
Arm shares jump 50% on AI, China boosts to results
Fraunhofer IIS Director Albert Heuberger Defines Germany's Semiconductor Industry
Xiphera Receives Its First US Patent
Wednesday, February 7, 2024
SK hynix, TSMC Form AI Semiconductor Alliance: Challenge to Samsung Electronics?
Samsung Announces 2nm AI Chip Deal With HBM3 Memory
Post-Quantum Cryptography Alliance Launches to Advance Post-Quantum Cryptography
Innatera Productizes SNN Accelerator As "Neuromorphic Microcontroller"
Kalray and Arm to collaborate to bring data intensive processing and AI acceleration DPU solutions to the global Arm ecosystem
Dolphin Design announces the successful launch of its first silicon tape out in 12nm FinFet
Tuesday, February 6, 2024
ESK-SIC and Kyocera to cooperate on sustainable production of silicon carbide
SK hynix shows roadmap for using recycled materials
SMIC Reports 2023 Fourth Quarter Results
TSMC January 2024 Revenue Report
VeriSilicon and Innobase jointly launch a 5G RedCap/4G LTE dual-mode modem solution
Worldwide Silicon Wafer Shipments and Revenue Fall in 2023, SEMI Reports
Monday, February 5, 2024
Siemens brings the power of multi-discipline simulation to axial flux motor development for next-generation EVs
IMEC to site R&D fab in Malaga, Spain, say reports
Bridges of Innovation: Fraunhofer IPMS and NY CREATES strengthen cooperation
Innatera Productizes SNN Accelerator As 'Neuromorphic Microcontroller'
Why China is betting big on chiplets
Intel Foundry Announces 18A Design Win for 64-Core Arm SoC
Socionext showcase cutting-edge SoC solutions at Embedded World 2024
Trilinear Technologies Accelerates Innovation in Automotive Display Connectivity with DisplayPort Automotive Extensions Standard (DP AE)
Movellus Recognized by Frost & Sullivan for Improving System Performance and Optimizing Power with Its Aeonicâ„¢ IP Portfolio
Rambus Reports Fourth Quarter and Fiscal Year 2023 Financial Results
Arasan's 2nd Gen CAN IP achieves ISO26262 ASIL-C Certification
Tenstorrent Selects Blue Cheetah Chiplet Interconnect IP For Its AI and RISC-V Solutions
SKAIChips License Ceva Bluetooth IP for Electronic Shelf Label IC
Movellus Recognized by Frost & Sullivan for Improving System Performance and Optimizing Power with Its Aeonic™ IP Portfolio
UMC Reports Sales for January 2024
Sunday, February 4, 2024
Nordic Semiconductor signs multi-year deal to use Arm IP
Eliyan Breaks Chiplet Memory Wall With Standard Packaging
NoC configuration tool takes makes complex SoC design easier
Samsung Receives Maiden 2nm AI Accelerator Order, Including HBM and Advanced Packaging
AccelerComm Launches PUSCH Channel Simulator for 5G L1 Performance Evaluation
Global Semiconductor Sales Decrease 8.2% in 2023; Market Rebounds Late in Year
YorChip announces partnership with Digitho for enabling Secure Chiplets
syn1588® IP Cores: Setting the Gold Standard in Precision for Clock Synchronization
Eliyan Sets New Standard for Chiplet Interconnect Performance with Latest PHY Delivering Data Rate of 64Gbps on 3nm Process Using Standard Packaging
Faraday Announces Plans to Develop Arm-based 64-core SoC on Intel 18A Technology
Elevate Your Display and Camera SOC Capabilities with our latest Silicon Proven MIPI C-D Combo Tx/Rx PHY and DSI Controller IP Cores
GUC Monthly Sales Report - January 2024
Nordic Semiconductor and Arm reaffirm partnership with licensing agreement for latest low power processor designs, software platforms, and security IP
Friday, February 2, 2024
Both Samsung and TSMC will be keeping 2nm chip manufacturing in their home countries
Thursday, February 1, 2024
Cadence Unveils Millennium Platform - Industry's First Accelerated Digital Twin Delivering Unprecedented Performance and Energy Efficiency
Tenstorrent Engineers Talk Open-Sourced Bare-Metal Stack
SignatureIP launches its new iNoCulator NoC configuration tool with a free trial offer
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