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Friday, October 27, 2023

• RISC-V Releases Abound Ahead of 2023 RISC-V Summit

Wednesday, October 25, 2023

• Multielement Ink is Promising for Sustainable Semiconductor Manufacturing
• Synopsys Honored at TSMC 2023 OIP Ecosystem Forum with Multiple Partner of the Year Awards
• Weebit Nano's ReRAM IP Awarded "Embedded Solution Product of the Year" in the Electronic Industry Awards
• Global Silicon Wafer Shipment Growth to Bounce Back in 2024 After 2023 Decline, SEMI Reports
• MosChip Technologies announces its new Managing Director & CEO

Tuesday, October 24, 2023

• SiFive lays off 20% of staff, re-aligns business
• SEMICON Europa 2023 to Highlight Chip Industry Investments, Sustainability and Talent Strategies to Shape $1 Trillion Era
• Layoffs at SiFive as RISC-V upstart faces a crossroads
• Stanley Electric Taps Siemens Platform for Latest MEMS IC Design
• Rambus Boosts AI Performance with 9.6 Gbps HBM3 Memory Controller IP
• China's FD-SOI ecosystem needs more engagement to work as a leapfrogging strategy
• NeuReality and Veriest Achieve Great Engineering Feat to Advance AI Chips for World's Largest Data Centers
• DVB-C2 LDPC/ BCH Decoder FEC IP Core From Global IP Core
• Cadence Expands Tensilica IP Portfolio with New HiFi and Vision DSPs for Pervasive Intelligence and Edge AI Inference

Monday, October 23, 2023

• Modular mobile devices for less electronic waste
• AI Silicon IP Provider Expedera Opens R&D Office in Singapore
• How 'E-Waste Mining' Can Pay Off
• Plastic Fischer Adopts Siemens Xcelerator to Reduce Plastic Waste in World Oceans
• Infineon to pilot new AI developer model to enhance sensor innovation
• Codasip's New RISC-V Processor Family Dials In on Custom Compute
• Intrinsic ID Looks Back on 15 Years of Building Digital Trust
• Sofics releases its ESD technology on TSMC 3nm process
• Cadence Reports Third Quarter 2023 Financial Results
• PCI-SIG® Announces Authorized Test Labs Now Available for PCI Express® Technology
• Faraday Reports Third Quarter 2023 Results
• PCI-SIG® Announces Authorized Test Labs Now Available for PCI Express® Technology
• Semidynamics launches first fully-coherent RISC-V Tensor unit to supercharge AI applications

Sunday, October 22, 2023

• lowRISC Announces Expansion of OpenTitan Project with New Hardware
• Renesas Extends Tender Offer for Proposed Acquisition of Sequans
• Green Mountain Semiconductor Inc. awarded a contract from NASA to Pave the Way for Space-Ready Neural Processors
• Qualinx's Series A Financing for All-Digital GNSS IoT Wireless Technology Hits $20 Million
• Alphawave Semi Announces Appointment of Rahul Mathur as Chief Financial Officer
• Socionext Begins Development of SoCs for Advanced ADAS and AD Using 3nm Automotive Process
• Revolutionizing Automotive Connectivity: Cutting-Edge Silicon IP Cores Now Available with T2M

Saturday, October 21, 2023

• Adopting IEC 62443 standards for infrastructure cybersecurity

Friday, October 20, 2023

• CXL Gets Off the Drawing Board

Thursday, October 19, 2023

• Neurxcore Introduces Innovative NPU Product Line for AI Inference Applications, Powered by NVIDIA Deep Learning Accelerator Technology
• Orthogone Technologies Unveils FPGA-Based Lightning-Fast PCIe DMA Controller Solution
• New POLYN Patent Covers Smart Tires, Industrial IoT Applications
• How Arm Total Design is built around 5 key building blocks
• Cadence Wins Four 2023 TSMC OIP Partner of the Year Awards

Wednesday, October 18, 2023

• Analysts Debate Latest U.S. Export Controls
• CXL Gets Off the Drawing Board
• SEMIFIVE Signs MOU with TeraPixel Technologies to Collaborate on Semiconductor Design
• Samsung Electronics Unveils Automotive Process Strategy at Samsung Foundry Forum 2023 EU
• Ansys Semiconductor Simulation Solutions Certified for UMC's 3D Chip Technology
• Prophesee launches the world's smallest and most power-efficient event-based vision sensor, bringing more intelligence, privacy and safety than ever to consumer Edge-AI devices
• US extends China chip ban
• Weebit Nano licenses ReRAM to DB HiTek, a global top-10 foundry

Tuesday, October 17, 2023

• GlobalFoundries Awarded $35 Million Funding from U.S. Government to Accelerate Manufacturing of Next-Generation GaN Chips
• Microelectronics for sustainability and technological sovereignty
• Ensuring security legislation compliance in IoT applications
• Cadence Collaborates with Broadcom to Implement AI-Driven Solutions with Impressive Quality of Results
• ARM edges closer to full 2nm chip designs with Total Design
• Socionext Announces Collaboration with Arm and TSMC on 2nm Multi-Core Leading CPU Chiplet Development
• Cadence Joins Arm Total Design to Accelerate Development of Arm-Based Custom SoCs
• M31 Opens Bangalore R&D Design Center in India Expands Recruitment of Global Talent
• Qualcomm to Bring RISC-V Based Wearable Platform to Wear OS by Google
• Harnessing the power of the ecosystem in the era of custom silicon on Arm
• Arm and Synopsys Strengthen Partnership to Accelerate Custom Silicon on Advanced Nodes
• Andes Technology Unveils Andes D23 and N225 Cores Pioneering the Next Generation of Compact, Performant, and Secure RISC-V Processor Technology
• Alphawave Semi Elevates Chiplet-Powered Silicon Platforms for AI Compute through Arm Total Design

Monday, October 16, 2023

• Chipmakers Fail to Meet Carbon-Emission Target, Experts Say
• TSMC abandons plans for 2nm chip plant after Taiwanese locals protest
• CEA-Leti Launches R&D Program to Improve "Cooperation" Between Autonomous Vehicles Via V2X Communication
• CEVA Joins Intel Foundry Services Accelerator IP Alliance Program to Empower Cutting-Edge SoCs
• Codasip announces next-generation RISC-V processor family for Custom Compute
• Silicon Creations Named 2023 TSMC OIP Partner of the Year for Analog / Mixed-Signal IP
• Fraunhofer IESE Partners With Arteris To Accelerate Advanced Network-on-chip Architecture Development for AI/ML Applications
• Synopsys Partners with Indian Institute of Technology Bombay to Develop Talent for Semiconductor Industry

Sunday, October 15, 2023

• The Path to A Sustainable Semiconductor Industry
• Fraunhofer-Roadmap: European Commission and expert community discuss a sustainable and competitive bioeconomy for the EU
• LeapMind's New AI Chip Paves the Way for Unprecedented Cost-Effective AI Computing
• Electronic System Design Industry Posts $4 Billion in Revenue in Q2 2023, ESD Alliance Reports
• Access Advance Announces Newest VVC Advance Licensors and Licensees
• eMemory Won TSMC OIP Partner of the Year Award for the 14th Consecutive Year
• 14-bit, 4.32GSps Wide Band ADC with Time-Interleaved Pipeline Architecture, Now Available for WhiteBox Licensing - Unlimited Usage and Modification Rights Included
• OPENEDGES Extends Partnership with InnoGrit Corp for 6nm LPDDR5/4X/4 Memory Controller IP
• GOWIN Semiconductor Expands its GW1NZ Series of Low-Cost, Small-Size, and Low-Power Devices