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Thursday, October 12, 2023

• Semiconductor startup, Enosemi, launches with a committed commercial license to key silicon photonics design IP created by Luminous Computing
• Imagination Optimizes PPA and Speeds the Delivery of Low-Power GPUs Using AI-Driven Cadence Cerebrus in the OnCloud Platform

Wednesday, October 11, 2023

• Denso invests $500 million in silicon carbide wafer company
• European Innovation Award EARTO 2023 for sustainable and cost-effective manufacturing process of aerogels
• Ericsson Antenna Technology Germany starts research project for 6G communication technologies
• Workshop Sustainable and Greener Manufacturing of ECS
• Chips JU Consultation Workshop : "Sustainable and Greener Manufacturing of ECS"
• Credo Joins with Industry Players to Announce Effort to Standardize CXL Active Electrical Cables & Optics at OCP Global Summit 2023
• Thalia appoints Sou Bennani-McCord as Global VP of Sales

Tuesday, October 10, 2023

• Artificial Intelligence (AI) Utilizing Deep Learning Techniques to Enhance ADAS
• Soitec inaugurates new plant for SmartSiC wafer production
• ADTechnology to start 3nm 2.5D ASIC design project for HPC application
• Embedded Flash memory developer Floadia has raised 1.05 billion yen from INABATA and others
• Tasking, Synopsys team for safer automotive virtual ECUs
• Achronix Announces FPGA-Powered Accelerated Automatic Speech Recognition Solution
• Highly configurable 32-Bit MCU features embedded hardware security module
• SiFive Announces Differentiated Solutions for Generative AI and ML Applications Leading RISC-V into a New Era of High-Performance Innovation
• JEDEC and Open Compute Project Foundation Pave the Way for a New Era of Chiplet Innovation
• BrainChip and Circle8 Clean Technologies/AVID Group Work to Reduce and Recycle Waste Through Joint Development of Intelligent "Smart Bins"
• Arteris Interconnect IP Deployed in NeuReality Inference Server for Generative AI and Large Language Model Applications

Tuesday, October 10, 2023

• GlobalFoundries and Microchip Announce Microchip's 28nm SuperFlash® Embedded Flash Memory Solution in Production

Monday, October 9, 2023

• New Synopsys Research Reveals Vast Majority of Organizations Report DevOps Delays Due to Critical Security Issues
• RISC-V group says export ban on open-source chip standard would slow innovation
• Siemens launches Tessent tool for Verilog and RTL design for test
• AMD to Acquire Open-Source AI Software Expert Nod.ai
• Accellera Releases Portable Test and Stimulus Standard 2.1
• Efabless Raises $6.3 Million in Series A-1 Extension, Featuring Investments from GlobalFoundries, Synopsys, and New North Ventures
• Update on Israel situation; Weebit's operations unaffected
• Omni Design to Present Next Generation LiDAR Solutions at CadenceLIVE Europe
• Leti Innovation Days Tokyo 2023

Sunday, October 8, 2023

• Siemens extends leadership in EDA design-for-test with the launch of Tessent RTL Pro
• TSMC looks to standardise chiplet protocols in "world changing" move
• TSMC September 2023 Revenue Report
• 1G Ethernet PHY IP Core is now available in 14nm LPP for Blackbox License and in 28FDSOI as Whitebox License for maximum flexibility

Thursday, October 5, 2023

• Samsung Electronics and TSMC Grapple with 3-Nano Yield Challenges
• GUC Monthly Sales Report - September 2023
• UMC Reports Sales for September 2023
• Marquee Semiconductor Expands Presence in India with New Location at Veer Surendra Sai University of Technology Campus in Odisha
• ADTechnology and Zaram Technology to develop the next-generation of telecommunications semiconductor chips
• Arteris Wins Autonomous Vehicle Technology of the Year Award
• EDGX Announces Collaboration with BrainChip to Develop Disruptive Data Processing Solutions for Space

Wednesday, October 4, 2023

• JUPITER Exascale Supercomputer, lead customer for SiPearl
• Global Semiconductor Sales Increase 1.9% Month-to-Month in August
• Using Open-Source Hardware to Speed Product Development
• Swiss-Based Enclustra Announces US Operations in San Diego to Realize the Full Potential of Embedded Chip Technologies
• SmartDV Rolls Out Multi-Phase Expansion Plan
• MachineWare announces new ARM processor simulation and SystemC profiling products, adds Windows support
• Renesas Extends Tender Offer and Receives CFIUS Clearance for Proposed Acquisition of Sequans
• Tenstorrent Selects Samsung Foundry to Manufacture Next-Generation AI Chiplet
• Cadence Completes Acquisition of Intrinsix
• ELES and proteanTecs Partner to Enhance Reliability Testing with Deep Data Analytics
• Marquee Semiconductor Joins Singapore Semiconductor Industry Association to Catalyze Development of Singaporean Hub

Tuesday, October 3, 2023

• imec looks to automotive chiplet programme
• Renesas partners with EdgeCortix to streamline AI/ML development
• TSMC's 3Dblox 2.0 and 3DFabric Alliance Achievements Set the Stage for the Future of 3D IC
• TSMC selects IC'Alps for its Design Center Alliance (DCA)
• EdgeCortix Closes $20 Million in Additional Funding Round
• Intel Announces Intent to Operate Programmable Solutions Group (PSG) as Standalone Business

Monday, October 2, 2023

• Soitec Opens New Plant, Positioning SmartSiC™ as a Future EV Standard
• Tachyum Books Purchase Order to Build System with 25,000x ChatGPT4 Capacity and 25x Faster than Current Supercomputers
• BrainChip Makes Second-Generation Akida Platform Available to Advance State of Edge AI Solutions
• CEA and Siemens collaborate on research to expand applications of Digital Twin for industry
• Semidynamics and SignatureIP create a fully tested RISC-V multi-core environment and CHI interconnect

Monday, October 2, 2023

• Alphawave Semi Earns Great Place to Work® Certificationâ„¢ for 2023-24

Sunday, October 1, 2023

• Alphawave Semi Earns Great Place to Work® Certification™ for 2023-24