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Wednesday, September 27, 2023

• Circular Economy, a Path to a Sustainable Ecosystem: Infineon's Security Solutions Support the Industry, the Consumer, and the Environment Alike
• Capgemini boosts its semiconductor capabilities in Europe with acquisition of HDL Design House
• Intrinsic ID Becomes World's First IP Vendor with PSA Certified Level 3 Root of Trust Component
• How the Worlds of Chiplets and Packaging Intertwine
• Keysight, Synopsys, and Ansys Accelerate RFIC Semiconductor Design with New Reference Flow for TSMC's Advanced 4nm RF FinFET Process
• EU Turns Rivals into Allies
• M31 Announces Low-Power IP Solutions for TSMC's N12e Process
• Microchip FPGAs Speed Intelligent Edge Designs and Reduce Development Cost and Risk with Tailored PolarFire® FPGA and SoC Solution Stacks
• Nanusens technology is key to enabling AI to be smarter
• Percepio Enables Trace Observability for All RTOS, Middleware and Silicon Vendor APIs
• China Gears Up for Chip Dumping, Ex-DoC Official Says
• TSMC Announces Breakthrough Set to Redefine the Future of 3D IC

Wednesday, September 27, 2023

• GlobalFoundries Unveils Power-Efficient Advancements to 22FDX® Platform at Annual Tech Summit

Wednesday, September 27, 2023

• Chips&Media Announces the Release of "WAVE-N," the New Neural Processor IP

Tuesday, September 26, 2023

• AT&S conducts green electronics research for Europe
• Accelerating RISC-V development with network-on-chip IP
• Cadence Expands Support for 3Dblox 2.0 Standard with New System Prototyping Flows
• Siemens and TSMC collaborate to help mutual customers optimize designs using foundry's newest advancements
• Synopsys and TSMC Streamline Multi-Die System Complexity with Unified Exploration-to-Signoff Platform and Proven UCIe IP on TSMC N3E Process
• GlobalFoundries Unveils Power-Efficient Advancements to 22FDX® Platform at Annual Tech Summit
• GlobalFoundries and Microchip Announce Microchip's 28nm SuperFlash® Embedded Flash Memory Solution in Production
• Analog Bits to Demonstrate Automotive Grade IP's Including a Novel High Accuracy Sensor at TSMC 2023 North America Open Innovation Platform Ecosystem Forum
• PrimisAI Forms to Revolutionize Hardware Design with Leading AI Solutions
• Cadence Digital and Custom/Analog Design Flows Achieve the Latest TSMC N2 Certification

Tuesday, September 26, 2023

• QuickLogic Announces New eFPGA Contract Targeting GlobalFoundriesâ„¢ 22FDX® Platform

Tuesday, September 26, 2023

• Ashling's RiscFreeâ„¢ SDK Now Supports RISC-V® Processor Cores from CAST

Monday, September 25, 2023

• Infineon's Circular Economy Security Advancing Sustainability for All
• Intel Develops Glass Substrate for Next Gen Advanced Chip Packaging Needs
• QuickLogic Announces New eFPGA Contract Targeting GlobalFoundries 22FDX® Platform
• Cadence AI-Powered Virtuoso Studio Supports RF and mmWave Design Reference Flows for TSMC N16RF, N6RF and N4PRF
• Unlocking IoT Security: Crypto Quantique Introduces QuarkLink Ignite - A Free IoT Security SaaS Platform
• Ashling's RiscFree™ SDK Now Supports RISC-V® Processor Cores from CAST
• Cadence Custom/Analog Design Migration Flow Accelerates Adoption of TSMC Advanced Process Technologies
• Codasip selects Verilock to provide secure hardware authentication technology
• Synopsys Unveils Industry's Broadest Portfolio of Automotive-Grade IP on TSMC's N5A Process Technology
• Introducing Tomi Jalonen - Xiphera's Sales Representative for Central European Markets
• SambaNova Unveils New AI Chip, the SN40L, Powering its Full Stack AI Platform
• Kneron Announces $49M in Additional Funding, Bringing Total Series B to $97M
• GlobalFoundries Announces Opening of New Malaysia Office to Support Global Manufacturing Operations

Sunday, September 24, 2023

• Efabless Launches 3rd AI-Generated Open-Source AI Contest to Extend the Caravel SoC Platform with AI-Generated Peripherals
• Synopsys tools tape out 2nm chips at TSMC
• Alphawave Semi: Interim results for the six months ended 30 June 2023
• Arm shares return to offer price
• Synopsys and TSMC Collaborate to Accelerate 2nm Innovation for Advanced SoC Design with Certified Digital and Analog Design Flows
• Synopsys and TSMC Advance Analog Design Migration with Reference Flow Across Advanced TSMC Processes
• proteanTecs Joins TSMC 3DFabric™ Alliance, Expanding Its Support of the 3D IC Ecosystem
• Flex Logix Expands Upon Industry-leading Embedded FPGA Customer Base
• Unlock the Power of DisplayPort v1.4 Tx/Rx PHY and Controller IP Cores: Maximize the Potential of Your Next-Generation Products
• proteanTecs Joins TSMC 3DFabricâ„¢ Alliance, Expanding Its Support of the 3D IC Ecosystem
• GlobalFoundries Submits Applications for U.S. CHIPS and Science Act Funding

Thursday, September 21, 2023

• MEEP: An HPC Systems Development Platform for RISC-V Based HW/SW Co-Design
• Q2 Revenue for Top 10 Global IC Houses Surges by 12.5% as Q3 on Pace to Set New Record, Says TrendForce
• Sustainable Innovation Month - Fostering Innovation Action
• Analog Bits to Join Intel Foundry Services Chip Design Ecosystem Expanding 3nm IP Offerings
• Rambus MACsec-IP-361 is Certified ASIL-B Ready

Wednesday, September 20, 2023

• Report: TSMC Could Push 2nm Node Back to 2026
• U.S. Government Awards GlobalFoundries New $3.1 Billion, 10-Year Contract for Secure Chip Manufacturing
• Kalray announces the availability of its new processor "Coolidgeâ„¢2", the first DPU optimized for AI and data intensive processing
• Inuitive Adopts VeriSilicon's Advanced ISP IP for its Vision AI Processor
• Alphacore Recognized for its TID Results of 22-nm FDSOI SRAM Published in IEEE Transactions on Nuclear Science journal
• SMIC Well on Its Way to 5-nm Breakthrough, Observers Say
• Global 200mm Fabs to Reach Record High Capacity by 2026, SEMI Reports
• Cadence Advances Hyperscale SoC Design with Expanded IP Portfolio for TSMC N3E Process Featuring Next-Generation 224G-LR SerDes IP
• CEVA, Inc. Appoints Iri Trashanski as Chief Strategy Officer
• BrainChip Engages VVDN to Deliver Industry's First Commercial Edge Box Based on Neuromorphic Technology
• Nordic combines Arm and RISC-V for "remarkable" EEMBC benchmarks
• Infineon heads European research project for advancing the circular economy and sustainability of the electronics industry

Tuesday, September 19, 2023

• OpenHW Group Appoints Florian 'Flo' Wohlrab as New CEO to Spearhead Open-Source Ecosystem Advancement
• SEMI Semiconductor Climate Consortium and BCG Issue First Insider Report of Semiconductor Value Chain's Carbon Emissions
• AccelerComm, Radisys, RFDSP & TTP unveil LEO Regenerative 5G RAN solution
• Intel launches compact RISC-V Nios processor core
• Nordic combines Arm and RISC-V for 'remarkable' EEMBC benchmarks
• UXL looks to standardise heterogeneous compute
• AiM Future Introduces Next-Generation NeuroMosAIc Processors, Expands Partnerships
• Cadence to Acquire Intrinsix Corporation from CEVA
• Thalia expands footprint in China with appointment of Business Partner Fionn Liu
• ADTechnology and BOS Semiconductor Collaborate to develop 5nm automotive semiconductors

Monday, September 18, 2023

• New RISC-V Market Report Will Provide 5-year Growth Projections for Semiconductor Devices and Insights on the Enabling Ecosystem
• Synopsys Aims to Advance IC Design Workforce in Vietnam
• Intel Innovation 2023: Empowering Developers to Bring AI Everywhere
• Cadence Accelerates On-Device and Edge AI Performance and Efficiency with New Neo NPU IP and NeuroWeave SDK for Silicon Design
• TSMC in talks about chiplet packaging in Arizona
• QuickLogic and Xiphera Partner to Pioneer Post-Quantum Cryptography on eFPGAs
• Creonic Expands Satellite IP Core Portfolio with DVB-S2X Multi-Carrier Demodulator
• SandBox Semiconductor Adds Hybrid Metrology Capabilities to Industry's Leading Physics-based, AI-enabled Process Optimization Platform, Creating the First Software Solution to Holistically Address Process Development Challenges
• OPENEDGES and VisioNexT Shapes the Future of Vision AI SoCs
• Rambus Added to PHLX Semiconductor Sector Index (SOX)
• Arm Announces Closing of Initial Public Offering and Full Exercise of Underwriters' Option to Purchase Additional American Depositary Shares