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Thursday, September 14, 2023

• TSMC Accelerates Renewable Energy Adoption and Moves RE100 Target Forward to 2040
• Driving EuropeÂ’s Chip Renaissance: TSMCÂ’s Vision with ESMC

Wednesday, September 13, 2023

• Lawo and intoPIX Partner to Deliver Edge-Compute JPEG XS Support at IBC 2023
• Realtek and V-Nova Announce Support for MPEG-5 Part 2 LCEVC on Set-Top-Box SoCs
• X-Fab adds new passive integration technology for RF
• Arm Announces Pricing of Initial Public Offering
• Fraunhofer IIS and IHSE announce their partnership for new JPEG XS implementations at IBC 2023

Tuesday, September 12, 2023

• TSMC's semiconductor foundry in the United States will begin trial production in Q1 2024
• Cadence Accelerates On-Device and Edge AI Performance and Efficiency with New Neo NPU IP and NeuroWeave SDK for Silicon Design
• Efabless Design Challenge Winners Advance the Power of AI in Chip Design
• Optima Design Automation Receives ISO 26262 ASIL D Ready Certification from SGS-TÃœV Saar
• Alchip Collaborates With Arteris To Expand ASIC Design Services
• Marquee Semiconductor Achieves ISO 9001 Certification for Exemplary Management System
• Optima Design Automation Receives ISO 26262 ASIL D Ready Certification from SGS-TÜV Saar
• intoPIX and Cobalt unveil the future of content delivery with JPEG XS: Introducing the Sapphire mini-converters and Sapphire openGear card powered by intoPIX technology
• Fraunhofer IIS introduces Application Support Package to facilitate JPEG XS Integration
• Esperanto Technologies Introduces First Generative AI Appliance Based on RISC-V, Enabling Developers to Easily Create and Deploy Purpose-Built Vertical Applications
• TSMC Special Board of Directors Meeting Resolutions

Monday, September 11, 2023

• From Synopsys to Google, New EDA Tools Apply Advanced AI to IC Design
• Cadence Unveils Next-Generation AI-Driven OrCAD X Delivering Up to 5X Faster PCB Design and Enabled with Cadence OnCloud
• 2024 Global Fab Equipment Spending Recovery Expected After 2023 Slowdown, SEMI Reports
• Bluespec's Accelerate-HLS Leverages RISC-V to Simplify and Speed the Development of HLS Applications
• Tachyum Offers Its TPU Inference IP to Edge and Embedded Markets
• Allegro DVT Launches a New Generation of High-Performance Multi-Format Video Encoder IP for 4K/8K Video Resolutions
• Faraday Unveils 2.5D/3D Advanced Package Service for Chiplets
• Meet T2M at IBC 2023 to explore High Performance, Cost-effective, and Innovative Semiconductor IP Cores for your next generation SoCs
• GlobalFoundries Officially Opens US$4 Billion Expansion Facility in Singapore, Creating 1,000 New Jobs
• Hailo Selected VeriSilicon's ISP and Video IP for its AI Vision Processors Empowering Intelligent Surveillance Cameras
• intoPIX showcases the new lightweight video compression standards and technologies driving automotive innovation at AutoSens 2023
• Signature IP Extends Global Footprint to Israel with Local Sales and Application Engineering Presence

Sunday, September 10, 2023

• Is Quantum Computing The Key To a Greener AI Future?
• Getting to grips with RF design
• Blue Pearl Adds Design Verification and Methodology Services to its Product Portfolio
• Flex Logix Announces Upgraded Emulation Models For EFLXâ„¢ eFPGA
• Renesas Commences Tender Offer for All Outstanding Shares and ADSs of Sequans
• SK hynix's memory chips next in Huawei's 5G phone saga
• Q2 2023 Global Semiconductor Equipment Billings Dip 2% Year-Over-Year, SEMI Reports
• NR-5G Polar Decoder and Encoder FEC IP Core Available For Licensing and Implementation from Global IP Core
• CAST adds Ascon Lightweight Encryption Engine to Security IP Cores Line
• Semiconductor industry sees revenue increase for the first time since 2021
• Enhanced Artel SMART openGear® Leverages intoPIX JPEG XS Technology for Ultimate Low-Latency Transport Solutions
• TSMC August 2023 Revenue Report

Friday, September 8, 2023

• CEVA Bluetooth® 5.4 IP Achieves SIG Qualification, Includes New Features to Address Rapidly Growing Electronic Shelf Label (ESL) Market

Thursday, September 7, 2023

• The Future Of Renewable Energy Is Built On Semiconductors
• Samsung Says It Will Beat TSMC's 4nm Production Capacity
• intoPIX to Celebrate Successful Collaboration with Bridge Technologies at IBC 2023
• Andes Announces General Availability of the New AndesCoreâ„¢ RISC-V Multicore Vector Processor AX45MPV
• OneNav Closes $17 Million Round, Launches GNSS Augmentation Product
• GBT Receives Patent Grant Notification Covering its Integrated Circuits Reliability Verification Analysis and Auto-Correction Technology

Wednesday, September 6, 2023

• Creonic Introduces NCR Processor IP Core for DVB-S2X/DVB-RCS2 Satellite Communication
• Global Semiconductor Sales Increase 2.3% Month-to-Month in July
• Arm IPO Likely to Lag Early Expectations, Observers Say
• Numem Announces Series A Funding Led by Cambium Capital to Propel Memory Solutions for AI and IoT
• Synopsys Extends Synopsys.ai EDA Suite with Industry's First Full-Stack Big Data Analytics Solution
• Comcores now offers standalone Reed Solomon Forward Error Correction (RSFEC) IP cores
• BrainChip Showcases Foundation for next generation AI solutions at AI Hardware & Edge AI Summit
• MediaTek Successfully Develops First Chip Using TSMC's 3nm Process, Set for Volume Production in 2024
• Rambus Completes Sale of PHY IP Assets to Cadence
• Flanders Semiconductors: The New Hub for Semiconductor Ecosystem at the Heart of Europe
• Synopsys Extends Synopsys.ai EDA Suite with Industry's First Full-Stack Big Data Analytics Solution

Tuesday, September 5, 2023

• TSMC to decide this week whether to invest in Arm IPO
• Neural Networks Can Help Keep Connected Vehicles Secure
• Credo Introduces Industry's First Monolithically Integrated CMOS VCSEL Driver in an 800G DSP
• Intel and Tower Semiconductor announce new US foundry agreement
• New MIPS CEO Sameer Wasson to Drive Company's RISC-V Market Penetration and Innovation
• CEVA Bluetooth® 5.4 IP Achieves SIG Qualification, Includes New Features to Address Rapidly Growing Electronic Shelf Label (ESL) Market
• GUC Announced 5nm HBM3 PHY and Controller Silicon Proven at 8.4 Gbps
• VisualSim Secure Model Protector enables companies to collaborate in new product development
• UMC Reports Sales for August 2023

Monday, September 4, 2023

• Samsung To Take Major Step in Revolutionizing the Road Ahead at IAA MOBILITY 2023
• Codasip, Siemens to deliver trace for custom processors
• Toshiba sample software package expands microcontroller development tools ecosystem
• SEMI to License Server Certification Protocol to Help Combat Software Piracy
• Top Ten Semiconductor Foundries Report a 1.1% Quarterly Revenue Decline in 2Q23, Anticipated to Rebound in 3Q23, Says TrendForce
• Intel Foundry Services and Tower Semiconductor Announce New US Foundry Agreement
• Agile Analog joins TSMC Open Innovation Platform IP Alliance Program
• Codasip collaborates with Siemens to deliver trace solution for custom processors
• Arm Announces Launch of IPO Roadshow
• Cybertek Solution Wins Multiple Contracts in Asia
• GUC Monthly Sales Report - Aug 2023