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Sunday, August 6, 2023

• CEVA Doubles Down on Generative AI with Enhanced NeuPro-M NPU IP Family
• Arteris Announces Financial Results for the Second Quarter 2023 and Estimated Third Quarter and Full Year 2023 Guidance
• CEVA Doubles Down on Generative AI with Enhanced NeuPro-M NPU IP Family
• Renesas to Acquire Cellular IoT Technology Leader Sequans Through Tender Offer
• DVB-C Demodulator IP Core Available For Immediate Implementation From Global IP Core
• CEO Interview: Intrinsic ID's Pim Tuyls on Embedded Security
• Tenstorrent Raises a $100M Strategic Up-round Co-led by Hyundai Motor Group and the Samsung Catalyst Fund
• GUC Monthly Sales Report - July 2023
• Global Semiconductor Sales Increase 4.7% in Q2 Compared to Q1
• Unlock seamless video transmission between graphics adapters and LCD displays with readily licensable, silicon-proven LVDS IP cores tailored for the advanced 22FDX process node

Wednesday, August 2, 2023

• Certifiably Secure - Xiphera Announces a First Batch of CAVP Validated IP Cores
• PCI-SIG® Exploring an Optical Interconnect to Enable Higher PCIe Technology Performance
• Cadence Advances Pervasive Intelligence at the Edge with Next-Generation Extensible Tensilica Processor Platform
• Arasan announces its CAN-XL IP with seamlessly integrated CANsec Accelerator IP
• CDAC, Arm partner to enable semiconductor startups in India through Arm Flexible Access for Startups

Tuesday, August 1, 2023

• Siemens Helps SK hynix Achieve ASPICE Certification
• University of Virginia Joins the BrainChip University AI Accelerator Program
• Mobiveil and Winbond Partner to Deliver HYPERRAM IP Controller to SoC Designers
• JEDEC Publishes New Standard to Support CXL Memory Module Implementation

Monday, July 31, 2023

• Synopsys Launches Software Risk Manager to Simplify Enterprise-Scale Application Security Testing
• Renesas adopts Visual Studio IDE across entire range
• Dolphin Design enables Orca's RF SoCs for direct-to-satellite communications
• Weebit Nano qualifies its ReRAM module for automotive grade temperature
• Rambus Reports Second Quarter 2023 Financial Results
• LeapMind's Ultra Low-Power AI accelerator IP "Efficiera" Achieved industry-leading power efficiency of 107.8 TOPS/W

Sunday, July 30, 2023

• Esperanto Merging HPC and ML in Upcoming RISC-V Processor
• Huawei plans to use SMIC's 'nearly-7nm' process
• America Faces Significant Shortage of Tech Workers in Semiconductor Industry and Throughout U.S. Economy
• Weebit Nano: Q4 FY23 Quarterly Activities Report
• Remi El-Ouazzane: "A Tsunami of TinyML Devices is Coming"
• Huawei planning on using SMIC to fab 7nm ICs this year
• PCIe Eyes Road Ahead with AI, Automotive
• Production-proven CAN Controller IP Core, equipped with a Safety package (Safe DCAN-FD, ISO 26262: Safety manual, FMEDA), tailored specifically for High-End Automotive and Consumer Applications is available for immediate licensing
• Terapines ZCC Toolchain Fully Supports Andes RISC-V Processors

Saturday, July 29, 2023

• PCIe Eyes Road Ahead with AI, Automotive

Thursday, July 27, 2023

• IPCEI: Germany and France bet on joint EU platform for sustainable industry
• Infineon Technologies Utilizes Recyclable PCBs for Sustainable Electronics
• TSMC opens global R&D centre for 1nm push

Wednesday, July 26, 2023

• Creonic Unveils CCSDS 131.2 Wideband Modulator IP Core Achieving 1 GSymb/s
• A methodology for turning an SoC into chiplets
• Intel Looks to Regain Semiconductor Chip Leadership from TSMC; Separates Manufacturing and Fabless Units

Wednesday, July 26, 2023

• YorChip launches UniPHYâ„¢ - the first dual-use PHY for Chiplets

Tuesday, July 25, 2023

• GlobalFoundries Criticizes Germany's Subsidy of TSMC
• Worldwide Silicon Wafer Shipments Rise in Q2 2023, SEMI Reports
• Arm and industry leaders launch Semiconductor Education Alliance to address the skills shortage
• Intrinsic ID Announces QuiddiKey 100 - Providing a Strong Root of Trust Solution for Internet Connected Devices
• Two IP announcements herald a new normal in chip world