Search News

Tuesday, January 24, 2006

• VeriSilicon Tapes out Flip-Chip Design With Cadence Encounter

Tuesday, January 24, 2006

• Arteris Continues Global Expansion, Names European and North American Sales Management

Tuesday, January 24, 2006

• Toshiba Adds Multi-Protocol High-Speed SERDES I/O Core Family That Meets High Speed Requirements of Storage, Networking, Consumer and Gaming Markets

Tuesday, January 24, 2006

• Synopsys DesignWare IP Enables Next-Generation PCI Express 2.0 Products

Tuesday, January 24, 2006

• Silicon Image Selects Denali's Verification IP Products for Development Efforts

Tuesday, January 24, 2006

• Embedded Systems Institute To Become ARM Approved Training Center In China

Tuesday, January 24, 2006

• Actel's Axcelerator FPGAs Tapped as Core Controller for BP Microsystems' Enhanced Seventh-Generation Programmers

Tuesday, January 24, 2006

• CEVA Announces First Available Silicon of Mobile-Media2000 Solution for High-End Mobile Multimedia Applications

Monday, January 23, 2006

• TransEDA announces the first production release of Assertain, the next generation verification closure solution

Monday, January 23, 2006

• Amino Technologies Plc: Acquisition of SJ Consulting for GBP 1.3M

Monday, January 23, 2006

• Altium introduces new TASKING VX-toolset for ARM

Monday, January 23, 2006

• Infineon Enables Accton's New Portable WLAN VoIP Gateway

Monday, January 23, 2006

• Conexant Announces Executive Transition Plan; President Matt Rhodes to Leave Company in June 2006

Monday, January 23, 2006

• Availability of PCI Express PHY and Bridge products through HiTech Global

Monday, January 23, 2006

• Renesas Technology Releases ''WMA/DRM Decode Middleware'' SH-Mobile software supporting ''Windows Media DRM 10 for Portable Devices''

Monday, January 23, 2006

• Elixent appoints new VP of worldwide sales

Monday, January 23, 2006

• CoWare Launches New Modeling Solution for Platform-driven ESL Design

Monday, January 23, 2006

• Magma Welcomes Five New IP Partners into MagmaTies Program

Monday, January 23, 2006

• SNOWBUSH microelectronics Announces 10-Bit, 140 MSPS, ADC IP Core in Foundry Standard 0.18 um CMOS Process

Monday, January 23, 2006

• ProDesign Sets New Standards for High-Speed Verification with CHIPit Platinum V4

Monday, January 23, 2006

• Hewlett-Packard Becomes First System Manufacturer to License Moore Microprocessor Patent(TM) Portfolio

Monday, January 23, 2006

• Advanced Micro Devices Licenses Embedded Memory From Innovative Silicon

Monday, January 23, 2006

• Rambus Announces Five Million Share Increase to Stock Repurchase Authorization

Monday, January 23, 2006

• Innovative Silicon Inc. Announces Silicon Validation of Z-RAM Technology

Friday, January 20, 2006

• Xilinx Announces December Quarter Results; New Product Sales Increase 24% Sequentially

Friday, January 20, 2006

• MIPS Technologies Reports Second Quarter Fiscal 2006 Financial Results

Friday, January 20, 2006

• Rambus Reports Fourth Quarter Earnings

Thursday, January 19, 2006

• HelloSoft Receives Funding From Intel Capital

Thursday, January 19, 2006

• Juniper Networks Selects Denali Verification IP for Design and Verification of its Products

Thursday, January 19, 2006

• Ultrawideband task group agrees to disagree

Thursday, January 19, 2006

• STMicroelectronics Completes Transition of Small Page NAND Flash Family to 90nm Technology

Thursday, January 19, 2006

• CEO interview: with Andre Auberton-Herve of Soitec

Thursday, January 19, 2006

• New VIA Eden and Eden ULV Processors Take Fanless Computing to 1.5GHz with Industry-Leading Power Efficiency

Thursday, January 19, 2006

• Via Licensing Expands Call for Patents for Its IEEE 802.16 Patent Licensing Program

Wednesday, January 18, 2006

• IPWireless Launches TDtv, the Mobile TV Solution That Delivers Broadcast Performance in Existing 3G Spectrum

Wednesday, January 18, 2006

• Bluespec Joins The SPIRIT Consortium to Advance IP Reuse Interoperability Standards for SoC Design

Wednesday, January 18, 2006

• Altium announces support for Xilinx MicroBlaze processor

Wednesday, January 18, 2006

• TSMC in Production with 80nm Process

Wednesday, January 18, 2006

• MIPS Technologies Customers and Licensees Spearhead Innovation at CES 2006

Wednesday, January 18, 2006

• Mentor Graphics Provides Platform Express Solution for LSI Logic RapidChip Platform ASIC Partner Program

Wednesday, January 18, 2006

• ARM Powered TTPCom Modem Delivers Market-Leading Size and Performance Advantages

Wednesday, January 18, 2006

• Sun Microsystems Launches OpenSPARC Project - Ignites New Open Source Community for Breakthrough UltraSPARC T1 Processor

Wednesday, January 18, 2006

• The SoC Leopard Pro Core Compiler from Socle Improves SoC Design Flow Efficiency

Tuesday, January 17, 2006

• Grace Semiconductor Readies 0.15um+HV for Small Panel Applications

Tuesday, January 17, 2006

• MIPS32 4KEc Core Powers High-Speed 802.11n WLAN Chipset from Metalink

Tuesday, January 17, 2006

• Cypress Delivers PRoC (Programmable Radio-on-a-Chip) Development Kit To Help Customers Streamline Transition To Wireless Connectivity

Tuesday, January 17, 2006

• ARC International Introduces ConfigCon 2006: The First-Ever Series of Developers Conferences for Configurable SoC Design

Tuesday, January 17, 2006

• Actel Unveils Development Ecosystem for Industry's First Mixed-Signal FPGAs

Monday, January 16, 2006

• Mercury Computer Systems Introduces the First Rugged Cell BE Processor-Based Computer - the PowerBlock 200

Monday, January 16, 2006

• Renesas Technology Releases R8A66597 Two-Port Hi-Speed (480 Mbps) USB Host Controller Suitable for Embedded Use

Monday, January 16, 2006

• Aplix Deploys JBlend(TM) in the First Commercial Handset Using TI's OMAP(TM) 2 Processor

Monday, January 16, 2006

• Leakage takes priority at 65 nm

Monday, January 16, 2006

• Europractice and UMC Offer 90nm Multi-Project Wafer Prototyping and Production Service

Monday, January 16, 2006

• Are DSPs disappearing?

Monday, January 16, 2006

• Silistix Announces CHAINworks(TM) for Self-Timed Interconnect Design and Synthesis for SoCs

Monday, January 16, 2006

• Olympus Renews and Expands License of Tensilica's Xtensa Microprocessor

Monday, January 16, 2006

• Rambus Files Patent Infringement Suit Against Micron

Monday, January 16, 2006

• Xilinx Acquires DSP Design Tool Leader AccelChip

Monday, January 16, 2006

• Xilinx and Tokyo Electron Device Announce Programmable Development Platform for Digital Displays

Monday, January 16, 2006

• Tower Semiconductor Announces Successful Raising of Approximately $48 Million Through Sales of Convertible Debentures

Monday, January 16, 2006

• Innovative Silicon Announces Jeff Lewis Will Head Worldwide Marketing; IP Industry Innovator Rounds Out Executive Team for Z-RAM Embedded Memory Company

Monday, January 16, 2006

• TTPCom reveals its converged mobile device strategy

Friday, January 13, 2006

• Aware, Inc. Announces Ikanos Communications, Inc. as New Licensee

Thursday, January 12, 2006

• TTPCom announces first customer for 3G chipset design

Thursday, January 12, 2006

• Philips Semi CEO expounds on merger option

Thursday, January 12, 2006

• Enuclia Semiconductor Secures $13 Million in Series B Financing Led by Menlo Ventures

Thursday, January 12, 2006

• MathStar, Inc. and Summit Design, Inc. Extend Partnership With SystemC Design Tools for Field-Programmable Object Arrays(TM)

Thursday, January 12, 2006

• IBM, Sony, Toshiba Broaden and Extend Successful Semiconductor Technology Alliance

Thursday, January 12, 2006

• QuickLogic Continues Push into Portable Applications Arena by Embedding SDIO Interfaces into Low Power FPGAs

Thursday, January 12, 2006

• Air Broadband Communications to Use the Fujitsu WiMAX SoC for Its New WiMAX Access Control Routers and Base Stations

Thursday, January 12, 2006

• The Linley Group Seminar Targets Advances in CPU Cores and Intellectual Property for Networking and Communications ASICs and SoCs

Thursday, January 12, 2006

• Faraday Adopts Mentor Graphics Eldo as Their Internal SPICE Simulator

Thursday, January 12, 2006

• TTPCom Adopts ARC's Configurable CPU for 3G Cellular Baseband Engines