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Sunday, July 23, 2023
Sustainability and Digitalization: The Road to Tech-Positive
Promising Returns For Synopsys.ai Suite Of AI Solutions
Siemens launches assistive AI solution for IC design and verification
RISC-V Moving Toward Open Server Specification
Cadence RTL design tool claims 5x faster RTL convergence
Singapore opens US$2bn chiplet factory
Chip Experts See Talent Shortage as Main Growth Hurdle
12bit 640Msps Dual-Channel IQ ADC High-Speed/High-Performance IP Cores for WiFi RF SoC is available for immediate licensing
Has the electronics market bottomed out?
Could AMD use IFS?
Friday, July 21, 2023
IoT security label planned for smart consumer IoT devices in U.S.
Thursday, July 20, 2023
Thalia raises $2.7m for IP reuse tool
The revolutionary potential of 3D IC technology in the semiconductor ecosystem
TSMC Reports Second Quarter EPS of NT$7.01
Cadence to Acquire Rambus PHY IP Assets
Wednesday, July 19, 2023
Schneider takes lead to decarbonise semiconductor value chain
SK hynix adopts Siemens' Polarion to help gain Korea's first ASPICE certification
Arm expands open-source partnerships to reinforce commitment to open collaboration
Synopsys Accelerates Advanced Chip Design with First-Pass Silicon Success of IP Portfolio on TSMC 3nm Process
Semidynamics announces fully customisable, 4-way, Atrevido 423 RISC-V core for big data applications
Thalia Secures $2.7 Million Funding to Strengthen Position as Leading IP Reuse Partner for Semiconductor Industry
BrainChip's Latest US Patent Award Extends Intellectual Property Strength and its Leadership in Edge Learning
Tuesday, July 18, 2023
Minimize Design Risk and Achieve First-Pass Silicon Success on TSMC's N3E Process
HCL Technologies US$ 300 Million Bet on India's Semiconductor Industry
VSORA Announces All-in-One Single Chip Architecture to Meet Generative AI Processing Challenges
How China is Building an Open National Chip Plan Around RISC-V
Schneider Electric Partners with Intel and Applied Materials to Decarbonize Semiconductor Value Chain
How semiconductor firms are chipping in on sustainability
Passport for a sustainable European electronics supply chain
VSORA reveals Jotunn generative AI processor
Cadence, GlobalFoundries, Hoerzentrum Oldenburg and Leibniz University Hannover Collaborate to Advance Hearing Aid Technology
Lightelligence Partners With ZeroPoint Technologies to Increase Data Center Connectivity Performance by Up to 50%
Expedera Announces LittleNPU AI Processors for Always-Sensing Camera Applications
New Wave Design and Verification Appoints Ike Song to Advisory Committee
Monday, July 17, 2023
Samsung Shipping First GAAFET Silicon; 3nm and 4nm Yields Are Improving - Report
OmniSpeech, Cadence Tensilica team up on voice AI technology
Startups Help RISC-V Reshape Computer Architecture
DENSO Adopts Attopsemi's OTP to Upgrade Future Automotive Products
Sunday, July 16, 2023
Radiofrequency & silicon photonics for high-performance, low-power, secure data transmission
DAC 2023: RISC-V is not in the future, it's now
Cadence Joules RTL Design Studio delivers breakthrough gains
SMIC: Resignation of Chairman of the Board and Executive Director Appointment of Chairman of the Board and Change of Authorised Representative
Allegro DVT joins the DVB Project
Cadence Unveils Joules RTL Design Studio, Delivering Breakthrough Gains in RTL Productivity and Quality of Results
The industry's first RISC-V IoT security chip, "Towngas Chip", had sold over 1,000,000 pieces
GMAC Intelligence Goes Big with BrainChip Partnership
RED Semiconductor and Crypto Quantique agree MOU for Development of Chip with Advanced Processing Capability and Quantum-based Security
Accelerate the verification process of your design IP by licensing the Verification IP Cores, which come equipped with a solid track record of automotive compatibility
Thursday, July 13, 2023
M31 Partners with Intel IFS Alliance to Present Latest IP Development Achievements
Wednesday, July 12, 2023
Rambus Delivers Quantum Safe IP Solutions with Next-Generation Root of Trust for Data Center Security
Global Semiconductor Equipment Sales Forecast: $87 Billion in 2023 With 2024 Rebound, SEMI Reports
Truechip Announces First Customer Shipment Of USB4v2 Verification IP
European Commission Approves Broadcom's Acquisition of VMware
The Future of Mobility: Fraunhofer IPMS drives the Revolution in Vehicle Architecture
Tuesday, July 11, 2023
Intelligent terminals applications given an innovation enhancement through AI acceleration
Cadence Digital, Custom/Analog Design Flows Certified and Design IP Available for Intel 16 FinFET Process
T2M Presents Silicon Proven MIPI D-PHY and DSI Controller IP Cores in 12FFC & 22ULL For Your Next Generation Display Products
Crypto Quantique Selected for European Innovation Council (EIC) Grant Funding
Cycuity Achieves ISO/SAE 21434 Certification for Automotive Cybersecurity Compliance
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