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Sunday, June 11, 2023

• The Semiconductor Industry's Most Important Tool Goes Green
• Intel German fab in doubt
• Apple completes its ARM lineup with 5nm, 134billion transistor M2 Ultra
• SynSense releases the Speckâ„¢ Demo kit, enabling users to rapidly deploy and validate event-based neuromorphic vision applications
• Securing Embedded Systems - Making it the Norm
• Top 10 Foundries Report Nearly 20% QoQ Revenue Decline in 1Q23, Continued Slide Expected in Q2, Says TrendForce
• Jim Keller on AI, RISC-V, Tenstorrent's Move to Edge IP
• BrainChip Examines New Approach to Optimizing Time-series Data

Friday, June 9, 2023

• RISC-V Summit Europe 2023 ended in Barcelona but the #riscv revolution has only just begun

Friday, June 9, 2023

• TSMC Announces the Opening of Advanced Backend Fab 6, Marking a Milestone in the Expansion of 3DFabricâ„¢ System Integration Technology

Thursday, June 8, 2023

• D&R IP SoC Day China
• TSMC Announces the Opening of Advanced Backend Fab 6, Marking a Milestone in the Expansion of 3DFabric™ System Integration Technology
• TSMC May 2023 Revenue Report

Thursday, June 8, 2023

• Infineon's HYPERRAMâ„¢ 3.0 memory and Autotalks' 3rd generation chipset drive next-generation automotive V2X applications

Wednesday, June 7, 2023

• EU approves €21bn regional IPCEI microelectronics project
• Leading Aerospace and Defense Company purchases Interlaken IP core from Comcores
• Cortus Launches ULYSS automotive MCU family
• Computex 2023 Reveals Taiwan's Critical Role in AI
• Infineon's HYPERRAM™ 3.0 memory and Autotalks' 3rd generation chipset drive next-generation automotive V2X applications
• Q1 2023 Global Semiconductor Equipment Billings Grow 9% Year-Over-Year, SEMI Reports
• Imec's process technology roadmap to 2036
• Arasan announces the Industry's First CAN FD Light Bus Controller IP

Tuesday, June 6, 2023

• MIPI DevCon 2023 - Cancelled
• Renesas Completes Acquisition of Panthronics
• Cadence expands Arm agreement for EDA tool verification
• Kalray Announces Production Launch of New "Coolidgeâ„¢2" DPU Processor Optimized for AI and Intensive Data Processing
• Green Hills Software adds support for production-ready RTOS and tools to Imagination Technologies' RISC-V CPUs
• intoPIX and PlexusAV Pioneer IPMX Standard-Based AV-over-IP Solutions
• S2C Accelerates Development Timeline of Bluetooth LE Audio SoC
• Kalray Announces Production Launch of New "Coolidge™2" DPU Processor Optimized for AI and Intensive Data Processing
• Arm SystemReady surpasses 100 certifications, driving standardization where it matters
• Global Semiconductor Sales Increase 0.3% Month-to-Month in April
• Defacto will celebrate its 20th anniversary at DAC with customer presentations and major technical announcements

Monday, June 5, 2023

• Startup to raise €3bn for European green datacentres
• Neuromorphic computing systems for software-defined radio devices
• It's a go for the GF-ST joint FDSOI fab in Crolles
• The challenges Intel faces to compete with TSMC, Samsung
• TSMC studying 2nd fab in Kumamoto, focusing on mature technologies
• Marquee Semiconductor Acquires Semikunn Technology Services, Expanding Design Services Portfolio
• UMC Reports Sales for May 2023
• VeriSilicon Obtained Bluetooth 5.3 Certification for Its Complete Bluetooth Low Energy Solution
• Actions Technology Partners with PUFsecurity to Secure Wireless Bluetooth and IoT Applications

Sunday, June 4, 2023

• INTERVIEW: 'Intel is committed to reaching net-zero greenhouse gas emissions by 2040, already runs operations globally by over 90% on renewable electricity': CSO

• Complete RISC-V analog IP subsystem targets IoT
• Dolphin Design picks Imperas for processor functional verification
• Dolphin Design Selects Imperas for Processor Functional Design Verification
• Consortium's Move Will Boost RISC-V Ecosystem, Thankfully
• Microchip Slashes Time to Innovation with Industry's Most Power-Efficient Mid-Range FPGA Industrial Edge Stack, More Core Library IP and Conversion Tools
• Andes Technology Showcases Pioneering RISC-V CPU IP Solutions at RISC-V Summit Europe
• GUC Monthly Sales Report - May 2023
• Are Chiplets Enough to Save Moore's Law?
• GlobalFoundries and STMicroelectronics Finalize Agreement for New 300mm Semiconductor Manufacturing Facility in France
• Silicon Proven 12bit 1Gsps DAC IP Core designed for Wireless RF Applications is available for immediate license
• BrainChip and Lorser Industries to Develop Neuromorphic Computing Systems for Software-Defined Radio Devices
• Agile Analog launches first complete RISC-V analog IP subsystem at RISC-V Summit Europe
• Imperas at the RISC-V Summit Europe, June 5-9 2023

Thursday, June 1, 2023

• RISE project gives RISC-V an open source software lift
• Axiomise Launches Next-Generation formalISA App for RISC-V Processors

Wednesday, May 31, 2023

• The Next Step for Green Energy
• NVIDIA Collaborates With SoftBank Corp. to Power SoftBank's Next-Gen Data Centers Using Grace Hopper Superchip for Generative AI and 5G/6G
• University of Oklahoma Joins the BrainChip University AI Accelerator Program
• Xiphera extends its Transport Layer Security product family
• The game-changing addition of intoPIX JPEG XS codec by Providius heralds a new era of IP media analysis
• Vtool appoints Incusolution to be its sales-channel partner in Korea
• Tachyum Testing Applications on Prodigy FPGA
• UltraRISC Selects Valtrix STING for Verification of RISC-V SoC Designs
• Semidynamics announces largest, fully customisable Vector Unit in the RISC-V market, delivering up to 2048b of computation per cycle for unprecedented data handling
• The Six Semiconductor of OPENEDGES Joins Canada's Semiconductor Council

Tuesday, May 30, 2023

• Can AI Invent New Battery Materials?
• Intel Foundry Services Ushers in a New Era
• Industry Leaders Launch RISE to Accelerate the Development of Open Source Software for RISC-V
• Semiconductor Manufacturing on the Way to Net Zero
• Chiplet Pioneer Eliyan Achieves First Silicon in Record Time with Implementation in TSMC 5nm Process, Confirms Most Efficient Chiplet Interconnect Solution in the Multi-Die Era
• Tenstorrent Partners with LG to Build AI and RISC-V Chiplets for Smart TVs of the Future