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Thursday, January 4, 2024

• Sustainability is the future for industry
• Omni Design Technologies Unveils Next-Gen LiDAR Solutions with Swiftâ„¢ Data Converters
• Socionext to Showcase Leading-Edge Technologies at CES 2024, Featuring Custom SoC Solutions, Low Power Sensors, Smart Display Controller, and Advanced Image Processor
• Omni Design Technologies Unveils Next-Gen LiDAR Solutions with Swift? Data Converters
• GUC Monthly Sales Report - December 2023
• Andes Announces General Availability of the New RISC-V Out-Of-Order Superscalar Multicore Processor, the AndesCore™ AX65
• UMC Reports Sales for December 2023

Wednesday, January 3, 2024

• Korea's AI chip companies gear up for CES 2024
• MulticoreWare and Imagination collaboration accelerates automotive compute workloads
• BrainChip to Unveil Akida Neuromorphic Processor Enabled by Microchip's 32-bit MPU at CES 2024
• Faraday Collaborates in Arm Total Design to Provide Arm Neoverse CSS-based Design Services
• VESA Updates Adaptive-Sync Display Standard with New Dual-Mode Support
• German Court Fines Netflix €7.05 Million for Continued Infringement of Broadcom HEVC Patent
• MIPS recruits former senior SiFive execs to boost RISC-V play
• MIPS Inc. (San Jose, Calif.) has recruited Drew Barbier and Brad Burgess to its leadership team, both formerly with RISC-V pioneer SiFive Inc.

Tuesday, January 2, 2024

• MIPS snags top SiFive brains to amp up RISC-V business
• Intel and DigitalBridge Launch Articul8, an Enterprise Generative AI Company
• MIPS Welcomes New Executives as Part of Company's Growth and Expansion
• Ceva Extends its Connect IP Portfolio with Wi-Fi 7 Platform for High-End Consumer and Industrial IoT
• M31 Successfully Validates 12nm USB4 PHY IP Empowering Next-Generation High-Speed Data Transmission
• Global Semiconductor Capacity Projected to Reach Record High 30 Million Wafers Per Month in 2024, SEMI Reports
• Arm PCs Get a New Lease on Life

Monday, January 1, 2024

• Electromobility: second life for electric motors
• Ventana Microsystems Drives India's Chiplet Innovation in 2024
• Samsung, Korean conglomerates prioritize AI innovation, sustainability in 2024
• MEDIA ALERT: Rambus to Present at 26th Annual Needham Growth Conference
• Taiwan Holds First 5G-ACIA General Assembly
• 3 trends for 2024: AI drives more edge intelligence, RISC-V, & chiplets
• Ventana Microsystems Drives India's Chiplet Innovation in 2024
• ELECTRA IC Marks a Decade of Design and Verification Excellence at CES 2024
• Accelerate Innovation: Harnessing the Speed of Tomorrow with PCIe Gen 4 PHY and Controller IP Cores
• Siemens EDA faces Chinese startup competitor

Sunday, December 31, 2023

• Quantum's threat to encryption is the new Y2K threat
• TSMC reaffirms path to 1-nm node by 2030 on track

Thursday, December 28, 2023

• Led by automakers, 12 companies in Japan form Advanced SoC Research for Automotive
• Fraunhofer IIS joins Sonical's Headphone 3.0 platform
• PCIe 6.0 moves closer to arriving in the market in 2024: Alphawave demonstrates interoperability
• Samsung Seen Stumbling at Silicon's Leading Edge
• BrainChip Awarded Latest Patent for Event-Based Pattern Detection
• U.K. Conference Accelerates Post-Quantum Cryptography Standards Review Process

Wednesday, December 27, 2023

• Samsung Press Conference at CES 2024: Connectivity in the Age of AI
• Established "Advanced SoC Research for Automotive" with 12 companies, led by automotive manufacturers
• Can There Be Any Doubt? In Our Industry, 2023 Was 'The Year of AI'
• Rambus Advances Data Center Server Performance with Industry-First Gen4 DDR5 RCD

Tuesday, December 26, 2023

• Can There Be Any Doubt? In Our Industry, 2023 Was 'The Year of AI'

Monday, December 25, 2023

• Samsung Delays Mass Production at New Texas Fab to 2025
• Synopsys plus Ansys: The making of an EDA giant?
• The green revolution runs on chips - but there is no good way to make the fragile semiconductors ecosystem sustainable in the short term
• Outlook 2024: 6 ways tech will play a role in sustainability
• Europe Aims for Leadership Role in Quantum Computing
• Samsung, Intel Gear Up for Intense Competition in 2-NM Semiconductor Process, Chasing TSMC