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Sunday, May 28, 2023

• Environmental impact of AI: Pioneering solutions for a sustainable future
• SK hynix Enters Industry's First Compatibility Validation Process for 1bnm DDR5 Server DRAM
• MediaTek Partners With NVIDIA to Provide Full-Scale Product Roadmap to the Automotive Industry
• Socionext Introduces Ultra-compact, Ultra-low-power 60GHz Radio-frequency Ranging Sensors for Automotive Applications
• M31 Technology: Q1 EPS NT$2.24, Up 75% YoY, Revenue Growth for the 19th Consecutive Month
• New Arm Total Compute Solutions enable a mobile future built on Arm
• Synopsys and Arm Strengthen Collaboration for Faster Bring-Up of Next-Generation Mobile SoC Designs on the Most Advanced Nodes
• JESD204C PHY & Controller IP Cores with proven automotive compatibility are instantly licensable for extremely reliable performance for your SOC's

Thursday, May 25, 2023

• Rambus's expectations on faster GDDR6 memory
• Partnership enhances deep data analytics in SoCs

Thursday, May 25, 2023

• Synopsys Initiates $300 Million Accelerated Share Repurchase Agreement

Wednesday, May 24, 2023

• Apple Signs Multibillion-Dollar Deal with Broadcom for US-Made 5G RF Components
• CEA-Leti to Report New Integration & Packaging Gains for Next-Generation LiDAR Steering on Autonomous Vehicles at ECTC
• China bars Micron ICs destined for key infrastructure
• FIVEberry Establishes Broad and Easy Access to RISC-V Technology
• Crypto Quantique signs first major client in Taiwan
• Alphawave Semi has published its audited results for the year ended 31 December 2022
• DRAM Industry Q1 Revenues Decline 21.2% QoQ, Marking Third Consecutive Quarter of Downturn, Says TrendForce
• Nanusens announces that it can now create ASICs with embedded sensors
• Generative AI is changing the world – but can it continue to succeed with our current data infrastructure?
• TSMC lays out a killer roadmap
• JEDEC Publishes Major Update to JEP30 PartModel Guidelines

Tuesday, May 23, 2023

• Silex Technology Announces High-Performance 802.11ah Wi-Fi HaLow SDIO Module
• SiFive Gives WorldGuard to RISC-V International to Make this Robust Security Model More Accessible to the RISC-V Community
• 3nm AI chips and 6nm microcontrollers will be key to TSMC Dresden fab
• Experts Weigh Impact of Intel-Arm Collaboration
• Apple announces multibillion-dollar deal with Broadcom for components made in the USA
• Blue Cheetah Demonstrates Industry Leading Silicon-Proven Die-to-Die Interconnect Solution for Chiplets
• BrainChip and CVEDIA Team to Advance State-of-the-Art Edge AI and Neuromorphic Computing

Monday, May 22, 2023

• Synopsys Named a Leader in the 2023 Gartner® Magic Quadrant™ for Application Security Testing for Seventh Consecutive Year
• Automotive Industry Looks Beyond EVs for Decarbonization
• Chiplet interconnect handles 40 Gbps/bump
• Sequans Introduces Taurus 5G NR: The World's First Chipset Specifically Optimized for 5G Broadband IoT Devices
• Imagination launches IMG CXM, the smallest GPU to bring effortless user interfaces into homes
• PCI-SIG Certifies VectorPath Accelerator Card for PCIe Gen5 x16 @ 32 GT/s
• Intel Launches Agilex 7 FPGAs with R-Tile, First FPGA with PCIe 5.0 and CXL Capabilities

Sunday, May 21, 2023

• Samsung To Officially Unveil Its 3nm, 4nm Technologies In June, With Up To 34 Percent Power Efficiency Improvements
• Green, Digital Transformation: Infineon Launches EU Projects for Power Electronics and Artificial Intelligence
• Jean-Louis CHAMPSEIX, VP, Head of Corporate Sustainability, highlights " Sustainability has been a guiding principle in STMicroelectronics" and "How Semiconductors Contribute to Green and Low Carbon"
• Arm expands global engineering teams with two new primary sites
• Axelera AI Raises $50M to Democratize Edge AI
• Audio Pioneer xMEMS Announces General Availability of the World's Only All-Silicon, Solid-State Fidelity Micro Speakers
• We don't compete with our customers - TSMC
• Quadric's DevStudio Speeds Software Development with Industry's First Integrated ML + DSP Cloud-Based Code Development Platform
• CEVA and proteanTecs Announce Partnership to Optimize Reliability and Power of Complex SoCs
• Fabless Semiconductor Innovator Stathera Announces US $15M Series A Funding Round
• NVIDIA Grace Drives Wave of New Energy-Efficient Arm Supercomputers
• USB 4.0 Host and Device Controller IP Cores unleashing the Power of High-Speed Connectivity with tunnelling of Display Port and PCIe is now available for Licensing
• Syntiant's Deep Learning Computer Vision Models Deployed on Renesas RZ/V2L Microprocessor
• New £1 billion strategy for UK's semiconductor sector

Thursday, May 18, 2023

• Efabless Announces AI Generated Open-Source Silicon Design Challenge
• K-Best MIMO Decoder IP Core Available For Immediate Integration From Global IP Core

Wednesday, May 17, 2023

• China's semiconductor developers eye shift to RISC-V architecture amid growing chip demand in cars, data centres and AI, executive says
• Arasan Announces immediate availability of its SUREBOOTâ„¢ Total xSPI PHY IP
• SiliconAlly: GigaPHY Testchip is back from Fabrication and Packaging
• proteanTecs' Die-to Die Interconnect Monitoring IP Passes TSMC9000 Pre-Silicon Assessment
• Rambus and Socionext Renew Patent License Agreement
• proteanTecs to Present in Open Compute Project (OCP) Webinar on Silent Data Errors for Resilient Data Centers
• Synopsys Posts Financial Results for Second Quarter Fiscal Year 2023
• Arasan Announces immediate availability of its SUREBOOT™ Total xSPI PHY IP

Tuesday, May 16, 2023

• GlobalFoundries, Samsung Electronics, and TSMC Join Imec's "Sustainable Semiconductor Technologies & Systems" (SSTS) Program
• MIPI DevCon Returns to Silicon Valley to Explore MIPI in Automotive, IoT and Mobile
• Ansys Signs Definitive Agreement to Acquire Diakopto, Expands Multiphysics Simulation Portfolio for Semiconductor Designers
• Semiconductor Manufacturing Monitor Points to Moderating Industry Contraction in Q2 2023, SEMI Reports
• Weebit Nano to present recent ReRAM-based developments at the International Memory Workshop (IMW) 2023
• Transitioning to a Circular Economy for Greener Electronic Systems
• VESA Updates Adaptive-Sync Display Standard with Tighter Specifications
• BrainChip and Teksun Demonstrate Rapid Adoption of AI Solutions at Embedded Vision Summit
• Arasan announces the immediate availability of its 2nd Generation MIPI D-PHY for GlobalFoundries 22nm SoC Designs