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Thursday, August 17, 2023

• 12bit 640Msps Dual-Channel IQ ADC High-Speed/High-Performance IP Cores for WiFi 6 RF SoC is available for immediate licensing

Wednesday, August 16, 2023

• OpenHW Group Delivering RISC-V CORE-V MCU Dev. Kits
• Samsung Establishes R&D Organization in Silicon Valley
• Metanoia Adopts Omni Design's Multi Giga Sample Data Converters in 5G products
• Synopsys Posts Financial Results for Third Quarter Fiscal Year 2023
• OpenHW Group Announces Tape Out of RISC-V-based CORE-V MCU Development Kit for IoT Built with Open-Source Hardware & Software
• Sirius Wireless Partners with S2C on Wi-Fi6/BT RF IP Verification System for Finer Chip Design
• Faraday Announces Infineon's SONOS eFlash is Fully Qualified on UMC's 40ULP Process
• Synopsys Announces Sassine Ghazi to Assume President and CEO Role Jan. 1, 2024
• Marvell Introduces Industry's First 5nm Multi-Gigabit PHY Platform
• Silicon Motion Terminates Merger Agreement with MaxLinear and Intends to Pursue Substantial Damages in Excess of the Agreement's Termination Fee Due to MaxLinear's Willful and Material Breaches of the Merger Agreement
• Creonic Engages in Numerous Research Projects within the 6G Platform

Tuesday, August 15, 2023

• Nvidia, Cadence, and Ceva Keep Up With AI Processing Demands
• Is RISC-V Worth the Risk? The Tools & Partners You Need to Know
• Global Semiconductor Industry on Track for 2024 Recovery but Near-Term Headwinds Remain, SEMI Reports
• Interview: Arm's SystemReady 2.0 to Secure IoT Devices
• Intel Announces Termination of Tower Semiconductor Acquisition
• Kneron Unveils the KL730 AI Chip, Propelling Low-Energy GPT Solutions at Scale
• Certus Semiconductor Partners with Pragma Design for Embedded ESD Detection Technology
• Tower Announces Termination of Intel Acquisition Agreement
• Eliyan Applauds Release of OCP's Latest Multi-die Open Interconnect Standard, BoW 2.0
• DVCon India 2023 | Keynote: "Journeying Beyond AI: Unleashing the Art of Verification" by Sivakumar P R, Founder & CEO, Maven Silicon
• Tachyum Achieves 192-Core Chip After Switch to New EDA Tools
• NEUCHIPS Announces the Appointment of Ken Lau as Chief Executive Officer
• GBT Technologies, Inc. & Bannix Acquisition Corp. Announce Execution of Patent Purchase Agreement
• Rapid Silicon Announces RapidGPT's Official Availability

Monday, August 14, 2023

• Egide raises €2.6m, pulls sale of US business
• Decarbonization Opens Pathway to a Sustainable Future
• 21 generative AI startups to watch, according to investors
• Collaboration looks to build AI Accelerator chip with analogue in-memory computing
• Imec integrates thin-film pinned photodiode into short-wave-infrared imaging sensors
• Arteris Wins Gold Stevie® Award in the 2023 International Business Awards® for Technical Innovation of the Year
• Arteris Wins Gold Stevie® Award in the 2023 International Business Awards® for Technical Innovation of the Year
• Intel and Synopsys Expand Partnership to Enable Leading IP on Intel Advanced Process Nodes

Sunday, August 13, 2023

• Socionext opens Bangalore office
• Intense Competition in Advanced Semiconductor Processes for Automobiles
• CEVA Joins Samsung SAFEâ„¢ Foundry Program to Accelerate Chip Design for the Mobile, Consumer, Automotive, Wireless Infrastructure and IoT Markets
• Bluetooth Dual Mode v5.3 RF Transceiver IP Cores in 22nm, 40nm, 55nm is Available for Immediate Licensing for TWS, Audio Chipsets and Automotive Applications
• CEVA Joins Samsung SAFE™ Foundry Program to Accelerate Chip Design for the Mobile, Consumer, Automotive, Wireless Infrastructure and IoT Markets
• OPENEDGES and Telechips Collaborates for Automotive Applications

Friday, August 11, 2023

• TSMC allocates $6bn for 2nm capacity in Taiwan

Thursday, August 10, 2023

• Siemens teams for China battery technology centre
• Associations align around MIPI CSI-2 automotive camera interface
• Rambus Initiates $100 Million Accelerated Share Repurchase Program
• TSMC July 2023 Revenue Report
• Socionext Strengthens Design and Development Capabilities with New Office in Bangalore, India
• Andes Technology and TetraMem Collaborate to Build Groundbreaking AI Accelerator Chip with Analog In-Memory Computing

Wednesday, August 9, 2023

• Understanding the Compute Hardware Behind Generative AI
• SMIC Reports 2023 Second Quarter Results
• BrainChip and Edge Impulse Offer a Neuromorphic Deep Dive into Next-Gen Edge AI Solutions
• Intel CEO Voices Concerns About CHIPS Funds, Export Controls
• UCIeâ„¢ (Universal Chiplet Interconnect Expressâ„¢) Consortium Releases its 1.1 Specification

Tuesday, August 8, 2023

• CAN-XL IP integrated CANsec accelerator
• Apple, Samsung, Intel, Nvidia to invest in record-breaking IPO of British chip maker Arm: Report
• 3-nm Race to Start in Semiconductor Industry with Chip for Apple iPhone 15
• Thalia announces new additions to its senior management team and Board
• CEVA, Inc. Announces Second Quarter 2023 Financial Results
• Allegro MicroSystems to Acquire Crocus Technology to Accelerate Innovation in TMR Sensing Technology
• MIPI Alliance and Automotive SerDes Alliance Enter Liaison Agreement to Enable Native MIPI CSI-2 Implementation with ASA-ML PHY
• Blueshift Memory announces successful development of computer vision AI accelerator chip

Tuesday, August 8, 2023

• TSMC Board of Directors Meeting Resolutions

Monday, August 7, 2023

• UCIe™ (Universal Chiplet Interconnect Express™) Consortium Releases its 1.1 Specification
• Analog IP tackles side channel attacks
• Synopsys Partners with NowSecure and Secure Code Warrior to Expand Industry-Leading Application Security Testing Solutions Portfolio
• TSMC, Bosch, Infineon, and NXP Establish Joint Venture to Bring Advanced Semiconductor Manufacturing to Europe
• UMC Reports Sales for July 2023
• Synopsys Appoints Rob Painter to Board of Directors
• Leading Semiconductor Industry Players Join Forces to Accelerate RISC-V

Sunday, August 6, 2023

• CEVA Doubles Down on Generative AI with Enhanced NeuPro-M NPU IP Family
• Arteris Announces Financial Results for the Second Quarter 2023 and Estimated Third Quarter and Full Year 2023 Guidance
• CEVA Doubles Down on Generative AI with Enhanced NeuPro-M NPU IP Family
• Renesas to Acquire Cellular IoT Technology Leader Sequans Through Tender Offer
• DVB-C Demodulator IP Core Available For Immediate Implementation From Global IP Core
• CEO Interview: Intrinsic ID's Pim Tuyls on Embedded Security
• Tenstorrent Raises a $100M Strategic Up-round Co-led by Hyundai Motor Group and the Samsung Catalyst Fund
• GUC Monthly Sales Report - July 2023
• Global Semiconductor Sales Increase 4.7% in Q2 Compared to Q1
• Unlock seamless video transmission between graphics adapters and LCD displays with readily licensable, silicon-proven LVDS IP cores tailored for the advanced 22FDX process node