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Sunday, February 23, 2025

• Siemens delivers certified and automated design flows for TSMC 3DFabric technologies
• AheadComputing Raises $21.5M Seed Round and Introduces Breakthrough Microprocessor Architecture Designed for Next Era of General-Purpose Computing
• ZeroPoint Technologies Unveils Groundbreaking Compression Solution to Increase Foundational Model Addressable Memory by 50%
• Quadric Announces Lee Vick is New VP Worldwide Sales
• Cortus MINERVA Out-of-Order 4GHz 64-bit RISC-V Processor Platform targets automotive applications
• Intel set to begin 18A tape-outs later this year, according to reports
• Maximum efficiency at minimum power consumption: New options for integrating RFicient® receivers
• TSMC's Efforts In 2nm Production Could See The Company Reaching 50,000 Monthly Wafers In 2025; With Both Facilities Operational, Output Could Reach 80,000 Units

Friday, February 21, 2025

• Veriest Solutions Strengthens North American Presence at DVCon US 2025

Thursday, February 20, 2025

• Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification

Thursday, February 20, 2025

• STMicroelectronics to ramp new silicon photonics process

Wednesday, February 19, 2025

• CEA and Quobly Report Simultaneous, Microsecond Qubit-Readout Solution With 10x Power-Use Reduction
• CEA and Quobly Report Simultaneous, Microsecond Qubit-Readout Solution With 10x Power-Use Reduction
• Intel in advanced talks to sell Altera to Silverlake
• Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
• EU funding for Infineon Dresden smart power fab approved
• Driving the efficiency of artificial intelligence
• Ex-Intel team raise $21.5m to pursue RISC-V for AI
• STMicroelectronics Unveils Silicon Photonics, BiCMOS Technologies to Power Next-Gen AI Data Centers

Wednesday, February 19, 2025

• 2025 Outlook with Paul Wells of sureCore

Tuesday, February 18, 2025

• Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
• RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
• CEA and Quobly report microsecond qubit-readout solution with 10x power-use reduction
• YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
• Getting Started with Chip Eco-Design Methodology

Monday, February 17, 2025

• AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
• AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
• S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
• Unlocking Quantum Advantage Lies Not Just with Qubits but with Gates
• Synopsys Teams Up with SEMI Foundation to Drive Workforce Development Initiatives in Semiconductor Industry
• VeriSilicon: The "IP family" is on fire, and the three major markets will go hand in hand in 2025
• €29m for 6G chiplet packaging line in Finland

Sunday, February 16, 2025

• ARM signs Meta as first chip product customer, says report
• TSMC Will Not Take Over Intel Operations, Observers Say
• Blueshift Memory starts £2.77 million development project with AP Memory and Syntronix of Taiwan
• Funding to boost Europe's semiconductor production
• Mirabilis Design Accelerates SoC Development with New System-Level IP Library for Cadence Tensilica Processors

Thursday, February 13, 2025

• Arm takes manufacturing into its own hands as it plans to sell chips
• Why RISC-V is a viable option for safety-critical applications
• Qualitas Semiconductor entered into IP Licensing Agreement with a Leading Korean System Semiconductor Design Company

Wednesday, February 12, 2025

• Can silicon photonics overcome scaling challenges for AI and data centers?
• Worldwide Silicon Wafer Shipments and Revenue Start Recovery in Late 2024, SEMI Reports
• Paras Defence Invests in Logic Fruit Technologies to Boost Defence Tech Capabilities at AERO India 2025
• Synopsys Expands the Industry's Highest Performance Hardware-Assisted Verification Portfolio to Propel Next-Generation Semiconductor and Design Innovation
• Ceva, Inc. Announces Fourth Quarter and Full Year 2024 Financial Results
• What Will Sustainable Semiconductor Manufacturing Look Like by 2035?
• New Memory Architectures for SoCs and Multi-Die Systems

Tuesday, February 11, 2025

• Soitec Accelerates Diversification to Withstand Down Cycles
• TSMC Board of Directors Meeting Resolutions
• Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
• Could Thomas Caulfield lead Intel or a merged Intel-GloFo?
• Semiconductor Giants Navigate AI Boom & Trade War
• OpenAI to tape-out on TSMC 3nm this year