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Monday, June 29, 2026

• Soitec and ZenSemi Partner to Scale 300mm BCD-on-SOI Production for Next-Generation Power Electronics
• Floadia Releases High-Performance Automotive Embedded Flash IP on Leading Foundry’s 90BCD Platform
• South Korea nears announcement on new semiconductor production cluster outside Greater Seoul
• Synaptics Acquisition by Onsemi Affirms Edge AI Is for Real
• SkyeChip profit forecast to grow at 48% CAGR from FY26 to FY29
• Renesas Promotes Gaurang Shah to Senior Vice President
• EnSilica set to post record results after "very successful year"
• M31 Joins "2026 TALENT, in Taiwan – Talent Sustainability Action Alliance"
• Ceva CEO Amir Panush Named "Artificial Intelligence Company CEO of the Year" in 2026 AI Breakthrough Awards Program
• Cellular IoT Market Growth to Reach 5.9 Billion Connections by 2035, Says Omdia
• NVIDIA Vera Rubin Delivers World-Class Supercomputers for Science
• PREVAIL: A Unique European Testing Platform for Edge AI
• Jim Keller: ‘AI Still Obeys the Old Laws of Compute’
• EdgeAI Licensed Andes Technology CPU IP to Power Next-Generation Edge AI Neuromorphic Solution
• Sovereign European chips could become a RISC-V-based reality
• M31 talks about 12 FFC Multi-Port Register Array
• Murata and Synopsys collaborate to streamline simulation workflows for electronics designers
• IBM Unveils Sub-1nm Chip Tech with 50% Performance Boost
• Global Foundry 2.0 Revenue Rises 23% YoY in Q1 2026 as AI Continues to Boost Demand
• TSMC (NYSE:TSM) Is Raising 7nm Chip Prices Up To 10% As Expansion Builds
• Advanced USB Connectivity IP Validated on N2P Process Technology

Thursday, June 25, 2026

• SNUG India 2026: Synopsys Unveils First Multiphysics Fusion Tools Since Ansys Deal
• Qualitas Semiconductor "Expects to Turn a Profit Next Year"
• STMicroelectronics unveils world’s first ST54M secure mobile chip with post-quantum cryptography for next-generation connected services
• Soofi announces model for industrial AI in Europe
• Siemens recognized as a Visionary in Gartner Magic Quadrant for AI Platforms for Data Science and Machine Learning
• BrainChip Unveils Communication Reference Platform, Fueling Signal Intelligence at the Edge
• RISC-V Market Leadership Helped Andes Technology Drive Cumulative Shipments of AndesCore-Powered™ SoCs Beyond the 20 Billion Mark
• Nuclei and Lauterbach Successfully Complete World's First RISC-V Data Trace Solution
• Samsung Unveils First UFS 5.0 Optimized for on-Device AI
• GlobalFoundries qualifies SLATE™ advanced packaging technology on 9SW platform for next-generation radio frequency applications

Wednesday, June 24, 2026

• Korea to Invest 800.2 Billion Won in 10 Homegrown AI Chips
• France’s Drive to Rebuild a Native Semiconductor Industry
• Arteris Technology Licensed by SiEngine for Next-Generation Automotive SoCs

Tuesday, June 23, 2026

• Ceva Launches Microsoft-Certified Spatial Audio Software for PC Gaming Headsets
• T2M’s Cellular IP Core Portfolio: Accelerate SoC Innovation with Faster Time-to-Market, Lower Risk, and Superior PPA.
• BOS Semiconductors to Showcase Physical AI Technologies at electronica Shanghai 2026
• Brite Semiconductor Releases 40nm 16-bit 4Msps High-Performance SAR ADC IP, Powering Industrial and Automotive Applications

Monday, June 22, 2026

• Intel Announces Leadership Appointment at Intel Foundry to Accelerate Development and Manufacturing
• Linking Demand, Design, and Manufacturing to Build a Device-Specific Chip Ecosystem
• Memory Market in 2026 Set to Quadruple Compared to 2025
• Qualcomm is reportedly considering a Tenstorrent acquisition for up to 10 billion dollars: Jim Keller’s AI and RISC-V company in focus
• SecureSoC strengthens cybersecurity, security of supply and semiconductor expertise in Finland
• Floadia Releases Automotive Embedded Flash IP on TSMC 180BCD Gen3 Platform
• Space Industry Is Standardizing on RISC-V
• AI compute is only as useful as the memory architecture feeding it — Semidynamics brings its full inference stack to ISC HPC 2026
• Rambus Rolls Out Memory Chipset to Unburden AI PCs
• Samsung Foundry Reportedly in Talks with AMD for 2028 CPU Production as BYD, Google Consider Its Services
• Report: Intel Partners With Taiwan’s UMC on 3nm Chips, Taking Direct Aim at TSMC’s Foundry Dominance
• Rapidus Signs MoU with Fondazione Chips-IT in Italy for Future Semiconductor ManufacturingNew collaboration provides framework between the Japan government and Italy

Thursday, June 18, 2026

• Floadia Releases Automotive Embedded Flash IP on TSMC 180BCD Gen3 Platform
• Introducing Tessent UltraSight - a complete functional monitoring & debug solution for SoCs
• Qualcomm Shares Rise on Tenstorrent Deal Talks and AI Push
• Fraunhofer calls for faster technology transfer to strengthen Germany
• Analog Bits to Present at EE Times Virtual Event, "The Road To Chiplet Scalability" on June 24th, 2026
• Fraunhofer IPMS unveils Q‑Dice: Quantum Random Number Generator delivering multi‑Gbps true randomness for secure applications
• Imagination Technologies Brings GPU Expertise to CHASSIS’ New Chiplet Project
• Europe’s first sovereign chip manufacturing flow could reshape the IoT supply chain
• Gov’t joins hands with Samsung to support AI chip development
• Synopsys Announces Availability of the First Wave of Multiphysics Fusion Solutions
• Keysight Expands Photonic Design Automation Portfolio with System-Level Simulation
• Xiphera contributes to SecureSoC, strengthening Finland’s cybersecurity, security of supply, and semiconductor expertise
• CEA-Leti Scales Ferroelectric RAM to 22nm Node, Unlocking Denser, More Efficient Memory for Edge AI
• Baya Systems partners with Openchip for RISC-V systems
• UK Semiconductor Centre and Rapidus partner to expand access to advanced chip technologies
• Intel Foundry Details Process Milestones and Future Innovation at VLSI Symposium
• ASML, TSMC and imec bring industry-ready 2D-material transistors closer with breakthrough 300mm integration

Wednesday, June 17, 2026

• Chips&Media Signs Next-Gen 'AV2' Video IP Licensing Deal with North American Big Tech, Strengthening Global Standards Leadership
• MIPI Alliance Welcomes Sony Semiconductor Solutions as a Promoter Member
• Agile Analog collaborates with Xiphera for Post-Quantum Cryptography challenge