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Friday, April 25, 2025

• Arteris Wins Two Gold and One Silver Stevie® Awards in the 2025 American Business Awards®
• Arteris Wins Two Gold and One Silver Stevie® Awards in the 2025 American Business Awards®
• Intel's CEO Lip-Bu Tan Reportedly Met With TSMC's CEO To Discuss Foundry Partnership; Raising Possibility of a Deal
• €6m for free space photonic networks for smart factories
• Aion Silicon to Showcase Advanced SoC Design Capabilities at Andes RISC-V CON Silicon Valley
• FPGA prototyping harnessed for RISC-V processor cores
• Faraday Adds QuickLogic eFPGA to FlashKit‑22RRAM SoC for IoT Edge
• Crypto Quantique announces QRoot Lite - a lightweight and configurable root-of-trust IP for resource-constrained IoT devices
• BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
• Xylon Introduces Xylon ISP Studio

Thursday, April 24, 2025

• Silicon Proven AV1 Decoder IP with support for 12-bit pixel size and 4:4:4 Chroma Sub-Sampling Released by Allegro DVT
• Cadence Enables Next-Gen AI and HPC Systems with Industry's Fastest HBM4 12.8Gbps IP Memory System Solution
• S2C and Andes Technology Announce FPGA-Based Prototyping Partnership to Accelerate Advanced RISC-V SoC Development
• PQShield launches UltraPQ-Suite for deeply specialized implementations of post-quantum cryptography
• BrainChip Extends RISC-V Reach with Andes Technology Integration
• M31 Collaborates with TSMC to Advance 2nm eUSB2 IP Innovation
• Andes Technology and Imagination Technologies Showcase Android 15 on High-Performance RISC-V Based Platform
• Synopsys and TSMC Usher In Angstrom-Scale Designs with Certified EDA Flows on Advanced TSMC A16 and N2P Processes
• TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
• Cadence and TSMC Advance AI and 3D-IC Chip Design with Certified Design Solutions for TSMC's A16 and N2P Process Technologies

Wednesday, April 23, 2025

• QuickLogic to Present and Exhibit at Andes RISC-V CON Technology Summit in San Jose
• Crypto Quantique publishes independent cetome analysis on streamlining CRA compliance with the QuarkLink security platform
• DVB-S2X Wideband LDPC/ BCH Encoder FEC IP Core Available For Licensing and Integration From Global IP Core
• Alphawave Semi Delivers Foundational AI Platform IP for Scale-Up and Scale-Out Networks
• Certus Semiconductor Joins TSMC IP Alliance Program to Enhance Custom I/O and ESD Solutions

Tuesday, April 22, 2025

• Andy Nightingale, VP of Product Marketing at Arteris – Interview Series
• MosChip® to showcase Silicon Engineering Services at TSMC 2025 North America Technology Symposium
• GlobalFoundries Accelerates GHG Reductions Commitments with Near Term Science-Based Target
• MosChip® to showcase Silicon Engineering Services at TSMC 2025 North America Technology Symposium
• Ceva Neural Processing Unit IP for Edge AI Selected by Nextchip for Next-Generation ADAS Solutions
• Thalia joins GlobalFoundries' GlobalSolutions Ecosystem to advance IP reuse and design migration
• Cadence Advances AI in the Cloud with Industry-First DDR5 12.8Gbps MRDIMM Gen2 Memory IP System Solution
• MosChip® to showcase Silicon Engineering Services at TSMC 2025 North America Technology Symposium

Monday, April 21, 2025

• BrainChip Gives the Edge to Search and Rescue Operations

Monday, April 21, 2025

• EU Bolsters Cybersecurity With NIS2 Directive
• EU Bolsters Cybersecurity With NIS2 Directive
• Analog Bits to Demonstrate IP Portfolio on TSMC 3nm and 2nm Processes at TSMC 2025 Technology Symposium 
• Shifting Sands in Silicon by Global Supply Chains
• Alphawave Semi Audited Results for the Year Ended 31 December 2024
• Analog Bits to Demonstrate IP Portfolio on TSMC 3nm and 2nm Processes at TSMC 2025 Technology Symposium Novel
• Equal1 advances scalable quantum computing with CMOS-compatible silicon spin qubit technology
• Analog Bits to Demonstrate IP Portfolio on TSMC 3nm and 2nm Processes at TSMC 2025 Technology Symposium
• Automating Hardware-Software Consistency in Complex SoCs

Saturday, April 19, 2025

• BOS Joins Plug and Play NeoCity 2025

Friday, April 18, 2025

• New Breakthroughs in China's RISC-V Chip Industry

Thursday, April 17, 2025

• JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
• JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
• ASML targeted in latest round of US tariffs
• BrainChip Gives the Edge to Search and Rescue Operations
• JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
• Creonic Unveils Bold Rebrand to Drive Innovation in Communication Technologies
• Andes Technology Celebrates 20 Years with New Logo and Headquarters Expansion

Wednesday, April 16, 2025

• Has AI Finally Destroyed the Need for Software Testing?
• Samsung achieves 40%+ test yields with 4nm logic die
• Equal1 Validates CMOS-Compatible Silicon Spin Qubit Platform Using GlobalFoundries' 22FDX Process
• Taiwan to focus on silicon photonics, build new economic shield
• Silicon Photonics Enables Low-power AI Accelerator Platform
• Smart and compact sensors with Edge-AI
• VeriSilicon Launches Ultra-Low Power OpenGL ES GPU with Hybrid 3D/2.5D Rendering for Wearables
• How NoC architecture solves MCU design challenges
• Secafy selects Siemens' EDA tools for innovative hardware security development
• Orthogone Technologies and Blackcore® Technologies Announce Strategic Partnership to Deliver Ultra-Low Latency Solutions for High-Frequency Trading
• AMD Achieves First TSMC N2 Product Silicon Milestone
• Cadence to Acquire Arm Artisan Foundation IP Business
• Intel Announces Strategic Investment by Silver Lake in Altera

Tuesday, April 15, 2025

• Korea unveils massive $23.2B semiconductor support plan
• Vertex Growth commits €10M in Dolphin Semiconductor
• New TSN-MACsec IP core for secure data transmission in 5G/6G communication networks
• Vertex Growth commits €10M in Dolphin Semiconductor
• eDP/DP 1.4 Tx PHY & Controller IP Cores Now Available to Meet Rising Demand for High-Performance Display Solutions with Next-Gen Visual Connectivity
• Doteck Integrates intoPIX JPEG XS for High-Performance ST 2110 8K & 4K Encoding
• Gartner Says Worldwide Semiconductor Revenue Grew 21% in 2024

Monday, April 14, 2025

• BOS Semiconductors at Auto Shanghai 2025
• Omni Design Technologies Offers 3nm, Single Core-voltage Supply Rail Process, Voltage and Temperature (PVT) Monitor
• EnSilica - Ongoing Investment in Space Industry Fuelling Silicon Chip Demand
• Why Do Hyperscalers Design Their Own CPUs?
• Expedera Achieves ISO 9001:2015 Certification for Quality Management Systems
• Beware of the Open-Source Licensing Gap
• Defacto Technologies Automates Front-End SoC Integration for Large RISC-V Designs