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Monday, April 17, 2023

• Arm liable for $8.5B SoftBank loan if IPO is a no-show
• Nordic Reveals "Revolution" of Wireless SoC Line: The nRF54 Series
• Mixel MIPI C-PHY/D-PHY Combo IP Integrated into Hercules Microelectronics HME-H3 FPGA
• Rapid Silicon Partners with Elastics.cloud on CXL 3.0 Dual Mode Controller IP to Enhance its Custom FPGA Solutions
• eMemory's Security-enhanced OTP Qualifies on TSMC N5 Process and Continues to Tackle Automotive Solutions
• Cadence Demonstrates Interoperability with SK hynix's Highest Speed LPDDR5T Mobile DRAM at 9600Mbps

Sunday, April 16, 2023

• Spanish startup performs RISC-V open core surgery
• Process agnostic fully customisable RISC-V IP cores
• Cadence extends TSMC deal for physical verification on Azure
• Cadence Extends Collaboration with TSMC and Microsoft to Advance Giga-Scale Physical Verification in the Cloud
• TSMC could partner with Bosch for 28nm fab in Germany
• Introducing the Cutting-Edge USB 3.0/ PCIe 3.0 Combo PHY IP Core in 28HPC+ for High-Performance SoC Designs
• Arm could be on the hook for $8.5bn of Softbank debt
• DVB-S2X LDPC/ BCH Encoder and Decoder IP Core Available For Integration From Global IP Core
• Semidynamics launches world's first fully customisable RISC-V IP cores

Thursday, April 13, 2023

• The Future of LiDAR Lies in ADAS
• TSMC could partner with Bosch for 28nm fab in Germany
• Fraunhofer IIS partners with Avid to enable support of MPEG-H Audio in Pro Tools
• CryptOne IP Core is ready for post-quantum reality
• Experience the Future of Video Processing with intoPIX and Imagine Communications at the 2023 NAB Show
• MainConcept and Fraunhofer IIS collaborate on MPEG-H Audio and xHE-AAC encoding for video and audio streaming services
• Pine64 launches world's first RISC-V tablet device - PineTab-V for presale
• IAR Embedded Secure IP upgrades solutions portfolio with late-stage security
• Pragmatic Semiconductor Announces Appointment of Semiconductor Industry Veteran, David Moore, as CEO
• Cadence Introduces EMX Designer, Delivering More Than 10X Increased Performance for On-Chip Passive Component Synthesis
• Strict Restrictions Imposed by US CHIPS Act Will Lower Willingness of Multinational Suppliers to Invest; Chinese Semiconductor Development Will Be Limited for Next Decade, Says TrendForce

Thursday, April 13, 2023

• Hardware Root of Trust: The Key to IoT Security in Smart Homes

Wednesday, April 12, 2023

• Battery recycling takes the driver's seat
• JEDEC Expands CAMM Standardization to include Two Key Memory Technologies
• VeriSilicon Brings Super Resolution Technology to Smart Display
• Get Ready to be Amazed by the one-of-a-kind exhibit "JPEG XS in Action" by intoPIX at NAB2023
• Frontgrade Products Enable ESA's JUICE Mission
• Global Semiconductor Equipment Billings Reach Industry Record $107.6 Billion in 2022, SEMI Reports
• IC Manage Partners with Library Technologies to Accelerate Library Characterization by 100x in the Cloud
• Ateme and Fraunhofer Join Forces to Deliver Next Generation Audio
• On your Wrist and in Space; Intrinsic ID is Everywhere. Come Find us at Key Industry Tradeshows in April
• EnSilica evaluation platform for EN62020 sensor interface ASIC speeds up development of wearable fitness and healthcare sensor devices
• Synopsys Introduces the Industry's First Emulation System with Unmatched Capacity to Enable Electronics Digital Twins of Advanced SoCs
• Softbank reduces Alibaba holding to 3.8%

Tuesday, April 11, 2023

• Infineon Renames IPC Division to Green Industrial Power
• Nordic Semi introduces fourth generation of multiprotocol SoCs
• Rambus Joins the Intel Foundry Services (IFS) Accelerator IP Alliance to Enable State-of-the-Art SoCs
• DENSO adopts VisualSim Architect to improve in-vehicle network design.
• APlabs Chooses CAST IP Cores for Next-Generation Automotive SoC
• Intel Foundry and Arm Announce Multigeneration Collaboration on Leading-Edge SoC Design
• Xylon Reveals Industry's First L5 Autonomy Ready Data Logger and HIL System
• Arteris IP Selected By ASICLAND for Automotive, AI Enterprise and AI Edge SoCs
• Tiempo Secure and GreenWaves Technologies demonstrate Secure Element role as Master in an embedded system
• Cadence Strengthens Tensilica Vision and AI Software Partner Ecosystem for Advanced Automotive, Mobile, Consumer and IoT Applications
• Lawo and intoPIX Partner to Deliver End-to-End JPEG XS Support!

Monday, April 10, 2023

• UK wireless strategy aims to boost 5G/6G deployment
• Rapid Silicon Launches Revolutionary RapidGPT for FPGA Designers
• Renesas Samples Its First 22-nm Microcontroller
• TSMC March 2023 Revenue Report
• UMC Reports Sales for March 2023
• Village Island VICO-XI is Revolutionizing IP Video Conversion with Reduced Bandwidth and Microsecond Latency using intoPIX Technology

Sunday, April 9, 2023

• Peripheral IP Cores targeting Automotive applications are instantly licensable for extremely reliable performance

Saturday, April 8, 2023

• Semiconductor sustainability: Paving the way for a greener technology industry

Thursday, April 6, 2023

• ARM completes functional safety revamp of microcontrollers with Cortex-M23 update
• Global Semiconductor Sales Decrease 4% Month-to-Month in February

Wednesday, April 5, 2023

• CXL Testing Leverages PCIe Expertise
• ChatGPT leaking Samsung chip secrets is iceberg's tip
• SiPearl: Initial closing of Series A with €90m financing to launch Rhea, the energy-efficient HPC-dedicated microprocessor
• GUC Monthly Sales Report - March 2023
• Post-Quantum Cryptography: Are You Ready?
• Samsung Electronics and AMD Extend Strategic IP Licensing Agreement To Bring AMD Radeonâ„¢ Graphics to Future Mobile Platforms
• Synopsys Accelerates First-Pass Silicon Success for Banias Labs' Networking SoC
• AMD Launches First 5nm ASIC-based Media Accelerator Card to Power New Era of Interactive Media Services at Scale
• intoPIX Partners with Panasonic Connect to Enable new JPEG XS Cameras for Live Video Production
• GUC Taped Out 3nm 8.6Gbps HBM3 and 5Tbps/mm GLink-2.5D IP using TSMC Advanced Packaging Technology
• As Arm Eyes IPO and Higher Prices, RISC-V May Get a Boost