Search News

Wednesday, July 5, 2023

• Empowering Greener Future: Role Of Energy Storage Systems
• SilTerra Leverages Silvaco's Library Characterization and Optimization Tools to Boost Efficiency in the Development of its Foundry Standard Cell IPs
• Codasip welcomes Axel Strotbek as new chairman of the board
• Imperas Helps Navigate the Journey to RISC-V Based Silicon at DAC 2023
• UMC Reports Sales for June 2023
• Despite Export Ban on Equipment, China's Semiconductor Expansion in Mature Processes Remains Strong, Says TrendForce
• IC Manage GDP-XL Enterprise IP Catalog enables NXP to Improve IP Asset Management and Reuse
• True Circuits Attends 60th Design Automation Conference, Celebrates 25 Years of Timing Excellence
• New PNG Encoder IP Core Expands CAST's Lossless Compression Suite

Tuesday, July 4, 2023

• proteanTecs to Showcase the Future of Health and Performance Monitoring at DAC and SEMICON West 2023
• imec looks to process flow for sub-nm stacked CFET transistors
• Truechip: Exhibiting and Showcasing Latest Verification IPs and NOC IPs at Design Automation Conference (DAC) 2023
• GUC Monthly Sales Report - June 2023
• True Circuits Announces Availability of JSPICEâ„¢ Simulation and Design Environment
• Faraday to Exhibit FPGA-Go-ASIC, SONOS eFlash, and eFPGA Solutions at DAC 2023
• EUROPRACTICE starts offering access to Pragmatic's flexible integrated circuit foundry services through imec

Monday, July 3, 2023

• Infineon and Kontrol join forces to improve the safety of autonomous vehicles
• Advanced Packaging, Performance, power, size, weight, cost... The choice is yours!
• Samsung tapes out 2nm backside routing test chip
• Imec Advances GaN-on-Si and InP-on-Si Technologies for Next-Gen Wireless Communication
• AI Can't Design Chips Without People

Sunday, July 2, 2023

• Canada's semiconductor industry seeks renaissance from AI, shifting geopolitics
• Rapidus CEO Chasing Single-Wafer-Processing Dream
• Tiempo Secure's new TESIC RISC-V IP successfully passes SERMA CC EAL5+ security assessment tests
• AccelerComm Announces 5G PUSCH Channel Equalizer
• OPENEDGES Showcases Live Demo of PHY Vision at Design Automation Conference (DAC) 2023
• ADTechnology Joins Synopsys IP OEM Partner Program
• StarFive and Youyeetoo jointly delivered the official metal case for VisionFive 2
• Synopsys and Golden Electronics Collaborate to Expand Chip Design Talent in Jordan
• Single Carrier Modem Available For Immediate Licensing From Global IP Core
• Bluetooth Dual Mode V5.3 RF Transceiver IP Cores in 40nm ULP is Available for Immediate Licensing

Thursday, June 29, 2023

• CAST Introduces New MACsec Protocol Engine IP Cores

Wednesday, June 28, 2023

• Leti Innovation Days: Do More With Less
• Worldwide Semiconductor Foundry Market Grew 27.9% YoY in 2022, Projected to Decrease by 6.5% YoY in 2023 due to Inventory Adjustments, IDC Finds
• Celestial AI, the Creator of the Photonic Fabric Optical Interconnect Technology Platform, Raises $100 Million in Series B Funding
• OKI IDS adopts Siemens Catapult High-Level Synthesis platform for design and verification services
• Lightelligence Revolutionizes Big Data Interconnect with World's First Optical Network-on-Chip Processor
• Korean prosecutors name ex-Samsung exec who tried to set up copy-cat fab in China and the Taiwanese backer
• Samsung Foundry Certifies Cadence Virtuoso Studio Flow to Automate Analog IP Migration on Advanced Process Technologies
• Weebit Nano's ReRAM IP now fully qualified in SkyWater Technology's S130 process
• AMD Introduces World's Largest FPGA-Based Adaptive SoC for Emulation and Prototyping
• Secure-IC's Securyzr achieves ISO 26262 ASIL-D certification, reinforcing its commitment to Automotive Safety and Security
• Cadence Expands Collaboration with Samsung Foundry, Providing Differentiated Reference Flows Based on the Integrity 3D-IC Platform
• Quadric Joins the Silicon Catalyst In-Kind Partner Ecosystem
• Intel and Movellus Develop Different Fixes For IC Voltage Droop
• Vitesco Technologies And Rohm Have Signed A Long-Term Sic Supply Partnership
• Ansys and Synopsys Accelerate RFIC Semiconductor Design with New Reference Flow for Samsung Technology
• Bluespec Launches New MCUX RISC-V Processor That Enables Developers to Implement Custom Instructions and Add Accelerators

Tuesday, June 27, 2023

• Leti details move to 10nm, 7nm FD-SOI process in Europe
• The European Project Creating Extensible, Energy-Efficient RISC-V CPUs
• CEVA Introduces Channel Sounding over Bluetooth® to Enable High-Accuracy Secure Positioning for Automotive, Industrial and the IoT Ecosystem
• Cadence Delivers Certified, Innovative Backside Implementation Flow to Support Samsung Foundry SF2 Technology
• Cadence Digital and Custom/Analog Design Flows Certified for Samsung Foundry's SF2 and SF3 Process Technologies
• Samsung Electronics Unveils Foundry Vision in the AI Era at Samsung Foundry Forum 2023
• Siemens extends support for Samsung Foundry's latest process technologies
• DCAN FD Full - a final step to CAN XL?
• Synopsys and Samsung Foundry Boost Power, Performance and Area for Modern SoCs on Samsung's SF2 Process
• Synopsys and Samsung Foundry Deepen Collaboration to Accelerate Multi-Die System Design for Advanced Samsung Processes
• CEVA Introduces Channel Sounding over Bluetooth to Enable High-Accuracy Secure Positioning for Automotive, Industrial and the IoT Ecosystem
• M31 Announces New 12nm Digital PLL IP to Drive the Benefits of IoT Clock Technology

Monday, June 26, 2023

• With NextGen, CEA is inventing the future generations of electronic chips to maintain France's competitiveness
• MAXEYE License and Deploy CEVA Sensor Fusion Software in Digital Pen for Leading Global Mobile OEM
• Bluespec Launches New MCUX RISC-V Processor That Enables Developers to Implement Custom Instructions and Add Accelerators
• Cadence AI-Based Virtuoso Studio Certified for Samsung Foundry PDKs for Mature and Advanced Nodes
• YorChip and Siloxit Collaborate on Industry's First Secure Data Acquisition Chiplet for Mass Markets
• MAXEYE License and Deploy CEVA Sensor Fusion Software in Digital Pen for Leading Global Mobile OEM
• Logic Fruit Technologies: Exhibiting and Showcasing Cutting-Edge Solutions at Design Automation Conference (DAC) 2023
• Comcores Unveils JESD204 IP Core Integration Guide to Streamline Customer PHY Integration Challenges
• Dolphin Design unveils an innovative IP for sound classification cutting down energy by 99%
• Blue Pearl Software and NanoXplore SAS team to Accelerate Development and Verification of Radiation Hardened FPGA Designs
• Arasan furthers the compliance of their I3C IP with its participation in the I3C Interop at MIPI Member Meeting
• Andes Technology Unveils the Annual Andes RISC-V CON, Scheduled for June 27th at the San Jose Airport DoubleTree Hotel

Sunday, June 25, 2023

• TSMC Plans Collaboration on 2nm Chips with Potential Clients
• CXL: The key to memory capacity in next-gen data centers
• How Will 5G Advanced Change RF Design?
• SEMIFIVE announces commercialization of its 5nm HPC SoC Platform with lead partner Rebellions, AI Chipmaker startup based in Korea
• Rapidus CEO Chasing Single-Wafer-Processing Dream
• 12Bit ADC and DAC IP Cores with High-Speed, High-Performance for Wireless applications that requires RF are available for immediate licensing
• DB GlobalChip Deploys Cadence's Spectre FX and AMS Designer, Accelerating IP Verification by 2X
• BrainChip Selects IPro Silicon IP to Serve Israel's high growth AI market

Saturday, June 24, 2023

• Leti Innovation Days: From Lab to Fab and the Future of Semiconductors