Search News

Monday, April 3, 2023

• Synopsys to Showcase Next Gen Polaris Software Integrity Platform at RSA Conference
• Allegro DVT Announces the Industry's First MPEG-5 LCEVC Decoder Silicon IP
• SEMIFIVE Achieves Mass Production Milestone of its SoC Platform
• CEO interview: Paul Wells of SureCore on low power memory and China
• ULTRARAMâ„¢ universal computer memory to be commercialised
• Introducing STAGE RACER 2 with intoPIX JPEG XS: The Future of Fiber Transmission for Broadcast Events
• sureCore pushes the SRAM voltage envelope to below 0.5V for the first time
• Sondrel signs EDA license extension with Siemens for three more years

Sunday, April 2, 2023

• Making Formal Verification the New Normal in IoT with Ashish Darbari - Founder, Axiomise | The IoT Podcast
• SynSense closes strategic round to accelerate the development of their high-speed 3D neuromorphic processor DYNAPâ„¢-CNN2
• Vtool appoints Wonderep to be its sales-channel partner in Israel
• The Future of Semi Innovation from Disruptive Memory to Chiplets with Alphawave Semi
• TurboConcept and Lomicro Information Technology today celebrate two years of successful collaboration
• XMOS announces xcore®-voice: the next generation intelligent solution for smart voice applications
• Unleashing the Full Potential of Your Display: eDisplayPort v1.4 PHY and Controller IP Cores are available for licensing for your Robust products

Wednesday, March 29, 2023

• Blue Ocean Smart System Unveils Chiplet-Based Products Powered by VeriSilicon's High-Performance Processors
• CXL Testing Leverages PCIe Expertise
• POLYN Introduces VibroSense, Industry-First Application-Specific Vibration Pre-Processing Chip Design
• Interview: Aart de Geus on AI-driven EDA
• Renesas Expands RISC-V Embedded Processing Portfolio with New Voice-Control ASSP Solution
• Computing Hardware Expert Georgios Konstadinidis Joins proteanTecs Advisory Board

Tuesday, March 28, 2023

• 3D-IC: An Opportunity to Augment India's Semiconductor Ecosystem
• Survey reveals software now central to automotive development
• I hear you NOCing, But Can You Close Timing?
• Veriest Solutions Promotes Dusica Glisic to Vice President of Frontend Engineering
• Synopsys.ai Unveiled as Industry's First Full-Stack, AI-Driven EDA Suite for Chipmakers
• Tachyum To Use UCIe Interconnect Standards In Prodigy 2
• Networking Chip Startup Enfabrica Emerges from Stealth Mode to Solve Scalability and Price-Performance Challenges for AI Growth in Cloud
• Report: Arm proposes change to IP royalty model

Monday, March 27, 2023

• Mobiveil's PSRAM Controller IP Lets SoC Designers Leverage AP Memory's Xccela x8/x16 250 MHz PSRAM Memory
• eMemory and UMC Expand Low-Power Memory Solutions for AIoT and Mobile Markets with 22nm RRAM Qualification

Monday, March 27, 2023

• Andes Custom Extensionâ„¢ (ACE) Supports AndesCoreâ„¢ 45-Series Processors to Provide Flexible Acceleration

Sunday, March 26, 2023

• Samsung Electronics Facing TSMC-Nvidia Alliance in Advanced Chip War
• Is RISC-V Poised to Benefit From Arm's Licensing Changes?
• MIPI A-PHY Specification Levels Up In-Vehicle Connectivity
• Chinese web giant Baidu backs RISC-V for the datacenter
• China forms its own chiplet standard amid isolation
• 2026 All-Time High in Store for Global 300mm Semiconductor Fab Capacity After 2023 Slowdown, SEMI Reports
• Designing MPUs/MCUs with Functional Safety
• Sensor Fusion Explores AI to Prep for ADAS, AV Designs
• MIPI A-PHY Specification Levels Up In-Vehicle Connectivity
• Bluetooth Dual Mode V5.3 RF Transceiver IP Cores in 22nm ULP is Available for Immediate Licensing for Smart Audio Chipsets

Thursday, March 23, 2023

• Alphawave Semi Opens Pune Office, Continues Expansion into India

Wednesday, March 22, 2023

• SynSense closes USD$10m Pre-B+round to bring their ultra-low-power vision processing SOC "Speckâ„¢" to mass production
• Global Fab Equipment Spending on Track for 2024 Recovery After 2023 Slowdown, SEMI Reports
• CEO Interview: Ian Lankshear, EnSilica
• Andes Custom Extension™ (ACE) Supports AndesCore™ 45-Series Processors to Provide Flexible Acceleration
• OPENEDGES Completes the Tapeout of the 7nm HBM3 Memory Subsystem (PHY & Memory Controller) Test chip